3D InCites Podcast: Recent Episodes
Francoise von Trapp
As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.
Fifty years of Semicon Europa set a fitting backdrop for a conversation that feels both celebratory and unsentimental about the state of advanced packaging in Europe. We walk the floor in Munich and pull together a story that spans chemical metrology, panel plating, glass substrates, thermal materials, logistics resilience, and the push from R&D to production—plus a heartfelt goodbye.
Dena Mitchell, Nova opens the curtain on chemical metrology for electroplating, showing how bath health drives TSV fill, hybrid bond grain structure, and environmental wins through longer bath life. Sally Ann Henry, ACM Research, explains why horizontal panel electroplating can deliver better uniformity than vertical as panel-level packaging grows. Thomas Uhrmann, EV Group zooms out to the strategy: Europe’s strength in pilot lines and research consortia, the urgency to materialize large-scale packaging fabs, and how the EU Chips Act is knitting packaging into every node from photonics to logic.
Henkel's Ram Trichur takes on thermals, from kilowatt-class data center processors with backside power delivery to mobile’s shift from package-on-package to side-by-side for exposed die cooling, and the heat challenges inside HBM stacks. Comet's Isabella Drolz steps into glass panel territory with TGV inspection at 610 x 610 mm, aligning tools, standards, and timelines toward late-decade ramps. Martin Wynaendts van Resandt explains how
Lab14 brings agility with direct-write lithography for large substrates and optical interconnect masters—speeding iteration and trimming mask overhead as co-packaged optics advances. Jim Garstka, Shellback Semiconductor, talks about its Hydrozone product that is finding traction in photo mask cleaning.
We also get practical about moving all this innovation: Barry O'Dowd and Robin Knopf, of Kuehne+Nagel, detail how Europe’s packaging supply chains remain global, and how sea-air blends can cut cost and time for non-sensitive, high-volume flows while building resilience against disruptions. ASE's Patricia MacLeod, Christophe Zinck, and Bradford Factor tie it together with automotive realities—centralized compute, heterogeneous integration, reliability constraints—and the enduring role of MEMS and sensors to feed the brain of the car.
It’s a grounded, forward-looking journey through the technologies and decisions that will determine whether Europe turns its R&D leadership into production momentum. Listen for clear takeaways, candid perspectives, and a final toast to the community that made the 3D InCites Podcast possible.
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Europe’s chip future is being built in real time, and the view from Munich is electric. We sit down with IMEC’s leadership and ESMC’s founding CEO to unpack how pilot lines, a major Dresden fab, and the EU Chips Act are reshaping the continent’s strategy—from research to high-volume manufacturing. Along the way, we track the evolution of Semicon Europa over 50 years, from a supplier-centric expo to a convening force that brings equipment makers, materials leaders, device companies, and end users into one space.
Our guests open the hood on what resilience actually looks like: a 28 nm to 12 nm FinFET roadmap with integrated RRAM for microcontrollers, a half‑million‑wafers‑per‑year target, and a hiring plan that scales with purpose-built training in Dresden and Taiwan. On the R&D front, IMEC’s expanded pilot line infrastructure—fueled by multi‑billion‑euro investment—helps Europe retain technology leadership while translating breakthroughs into products. We also examine advanced packaging, where 3D integration and chiplet architectures blur the line between front end and back end and create fresh opportunities for automotive and industrial electronics.
The conversation gets candid on sovereignty versus interdependence. Full autarky is a myth; durable relevance comes from global collaboration, reverse dependencies, and focus on areas where Europe is indispensable—lithography, metrology, materials, and increasingly packaging and system design. We talk talent, too: why workforce visibility, skills pipelines, and on-the-job training will determine whether ambitious ramps hit their marks. If you care about semiconductors, policy, and the future of manufacturing in Europe, this is your inside track.
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A crowded server board with ten thousand parts doesn’t forgive sloppy inspection—and neither do pricey GPUs and chiplets. From the floor of Productronica in Munich, we dig into how automated optical inspection keeps advanced packages honest once they hit the PCB line, where solder quality, coplanarity, and sheer component variety can make or break yield. Vidya Vijay from Nordson Test & Inspection joins us to unpack why AOI remains the fastest path to actionable insight, when X‑ray is the smarter choice, and how new sensor design changes the game for reflective, high‑mix assemblies.
We explore the real pain points engineers face today: shiny dies that confuse cameras, BGAs packed with I/O where hidden defects hide under the body, and miniature passives that crowd tight keep‑outs. Vidya explains how three‑phase profilometry creates true 3D height maps by projecting fringe patterns and reading them from multiple angles, enabling precise checks for corner fill, underfill, and coplanarity. We also get into multi‑reflection suppression, Nordson’s approach to filtering glare and ghost images so the system sees the joint, not the noise. With true RGB on side cameras and higher resolution, AOI can now pick out tiny solder balls and subtle surface issues at speed—fuel for stronger AI autoprogramming and more reliable defect classification.
If throughput is king, data is queen. We talk about closing the loop from inspection back to the line to prevent bad lots—flagging stencil drift, placement offsets, and paste issues before they explode into scrap. Then we spotlight Nordson's launched SQ5000 Pro: faster cycle times, a wider field of view, and configurable 7 µm or 10 µm sensors designed for modern PCBA demands. Whether you’re chasing yield on high‑value GPUs or balancing AOI with AXI on dense boards, this conversation offers a practical roadmap for choosing the right tool, tackling reflectivity, and using insight to drive predictable quality.
Nordson Test and Inspection
Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications.
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Want a candid look at how women build durable careers in one of the world’s toughest industries? We sit down with three semiconductor leaders - Nitza Basoco, Anne Meixner and Julia Freer - who share how early encouragement, gritty problem solving, and clear communication turned curiosity into impact. From summer jobs at national labs and early days at IBM to leading operations, test, and sustainability initiatives, their stories show why diverse voices aren’t just nice to have—they’re a competitive advantage.
We dig into the real moments: being the only woman in a test engineering group, pushing for inclusive language that actually changes culture, and navigating career pivots to balance family, flexibility, and ambition. You’ll hear how mentorship and sponsorship differ—and why you need both—plus specific tactics to make them work inside fast-moving chip companies. One unforgettable segment starts with a five-minute crash-and-burn presentation and becomes a two-year, teamwide communication overhaul that turns shy engineers into confident presenters ready for conferences and boardrooms.
Across materials science, advanced packaging, test and inspection, and sustainability, the thread is clear: communication is a core engineering skill. Writing reflective status reports, designing slides for decisions, and telling a tight technical story can accelerate yield improvements, align manufacturing and supply chain, and win executive support. We also tackle today’s DEI headwinds with a practical lens—keep the pipeline alive, promote from within, and build programs that outlast policy shifts. The conversation closes with why their new book matters: ordinary, relatable role models who show many valid paths into STEM and semiconductors.
Learn more about the book, Empowering Women in STEM.
Teradyne
Teradyne test solutions for semiconductors lets customers consistently meet their quality standards.
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Power electronics are quietly rewriting the rules of energy use—from the range of your EV to the efficiency of a hyperscale data center. Françoise sits down with Henkel’s Ram Trichur to unpack what’s driving the $67.5B surge in power semiconductors and why the move to wide bandgap materials like silicon carbide and gallium nitride is such a big deal.
We break down the real differences between logic and power devices, then dive into where innovation is happening right now: die attach materials, thermal pathways, and manufacturing processes that can keep up with higher power densities. Ram explains why traditional wirebond packaging remains dominant in power, even as modules climb from 400 V to 800 V and beyond. You’ll learn how the industry is moving from solder to silver sintering for performance, and why copper-based sintering may be the breakthrough that balances cost, reliability, and manufacturability.
From discrete devices to full power modules, we explore the challenges of thinner die, copper leadframes, backside metallization compatibility, and bond line control. Ram shares Henkel’s roadmap for pressure-assisted copper sintering at lower temperatures and pressures in nitrogen, the multi-year qualification path customers expect, and how early sampling shortens time to scale. If you care about EV range, charger efficiency, industrial uptime, or greener data centers, this conversation connects the dots between materials science, packaging engineering, and system-level performance.
If you enjoyed this deep dive, follow the show, share it with a colleague who cares about SiC and GaN, and leave a quick review to help others find us. Got a question or a hot take on copper vs. silver sintering? Drop us a note and join the conversation.
Henkel Semiconductor Packaging Materials
Henke's advanced materials elevate semiconductor packaging to meet power, performance, area and cost
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The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips.
EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so every die and corner is verified. They also unveiled LithoScale XT, a fully digital, maskless lithography system printing 300 mm at 60 wph—perfect for massive AI dies and fast design turns.
Lab14 widened the frame with a portfolio approach: direct-write lithography, single-wafer processing, data prep, and analysis tools working as a coordinated line, with data sharing and AI feedback baked in.
Resilience and regionalization came to life through Kuehne+Nagel’s on-the-ground view: supplier clustering near fabs, cross-border trucking, time-critical services, and 4PL integration that gives real-time visibility and smarter capacity planning.
ERS showed where throughput meets cost: photothermal debonding with lower stress and reusable glass carriers, demo centers in Taiwan (and planned in North America), plus surge demand for warpage repair as volumes rise.
Process control is moving into packaging with front-end rigor. Nova detailed metrology for hybrid bonding, chemistry monitoring of plating baths, X-ray and XPS/SIMS material insights, and the handling know-how to measure framed wafers and panels reliably.
Nordson Test & Inspection highlighted AI-driven inspection, ultra-fast acoustic scanning, automated X-ray metrology, and sensor wafers that cut tool downtime and sharpen process windows. Comet showcased its CT and CA20 upgrades for 3D IC and TSV analysis.
Power dominated the later conversations. Siemens argued we need to design for energy from the chip through the blade, rack, and data center, simulating real workloads and cooling to slash gigawatts—then extend that thinking into the fab, where optimizing chillers and facilities already saves serious money.
Onto Innovation brought it home with execution: the PACE Center now hosts partners’ tools, accelerating experiments for glass, TGV, and panel processes without waiting on public funds.
If you care about hybrid bonding, maskless lithography, CT for 3D ICs, panel-scale packaging, or cutting AI’s energy bill, this one is dense with takeaways and hard truths. Subscribe, share with a colleague who lives in the fab or data center, and leave a review telling us which insight you’ll act on first.
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A nationwide talent engine for chips is taking shape—and it’s built to scale. Recorded live at SEMICON West in Phoenix, we sit down with SEMI Foundation leaders to unpack the National Network for Microelectronics Education, a hub-and-node model designed to align schools, employers, and workforce systems. Backed by CHIPS Act funding through the National Science Foundation, NNME will fund multi-state regional nodes that modernize curricula, streamline upskilling, and share proven playbooks across the country. We also unveil the refreshed Chip Path portal, which maps your skills and interests to real jobs in fabs, equipment, and materials, and we highlight SEMI-Quest, a hands-on STEM experience designed to spark early curiosity about microelectronics.
Then we turn to sustainability where momentum is accelerating. The Semiconductor Climate Consortium has grown past 100 members and is shifting from baselines to projects that deliver measurable impact. We explore how the Energy Collaborative pushes for policy that opens affordable renewable power, while SCC advances user-side strategies—better emissions accounting, renewable procurement models, and fab energy efficiency. A core challenge emerges: hyperscalers often target net zero by 2030, while many chipmakers point to 2050. We dig into how coordinated innovation, shared standards, and advocacy can close that 20-year gap.
AI’s energy appetite raises the stakes, so we tackle both sides of the equation: adding clean capacity where it matters most and designing for lower power at the chip and fab level. From global cooperation across APAC, EU, and the U.S. to practical ways individuals and companies can act now, the throughline is collaboration with urgency. Ready to find your role in the future of chips—whether building skills, hiring smarter, or decarbonizing faster? Subscribe, share this episode with your team, and leave a review to help more people find these insights.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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We recorded live at IMAPS with Siemens, ACM Research, Shellback Semiconductor, DECA, Nordson Electronic Solutions, and VIEW Micro Metrology to explore how AI demand, chiplets, and panels are reshaping advanced packaging. We dig into 3D BLOX, thermal and test roadblocks, green chemistries, metrology at scale, and why the back end now leads innovation. Listen to learn about:
• The Siemens–ASE collaboration on 3D BLOX models and VIPACK workflows
• Interoperable YAML-based packaging definitions moving toward IEEE standard
• 3D stacking to cut picojoules per bit amid thermal and test limits
• Panel-level packaging economics, sizes, and lack of standards
• ACM Research updates in copper plating, bevel clean, frame clean, and compound deplating
• Batch spray versus single wafer trade-offs at Shellback Semiconductor
• HydrOzone green strip replacing legacy NMP in select flows
•The DECA–SST deal for NVM chiplet package and SoC disaggregation
• Nordson Electronic Solutions' panel strategy, IntelliJet 1.1, Vantage platform, and warpage control
• VIEW Micro Metrology's high-throughput telecentric metrology across wafers and large panels
Learn more at imaps.org
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We record live at IMAPS to follow a first-time attendee’s leap into advanced packaging and a trio of high school students discovering semiconductors, robotics, and career paths that bridge disciplines. Along the way, we unpack speed-to-market, standards, hybrid vs TCB, and why AI skills matter.
• why a self-funded first conference can reset a career
• key takeaways from PDCs and technical talks
• time-to-market pressure across packaging workflows
• standards tension between front-end and packaging
• hybrid bonding promise versus TCB workhorse reality
• how to network with intent and follow through
• volunteering with IMAPS to build early-career hubs
• robotics as an on-ramp to semiconductors
• interdisciplinary routes into microelectronics
• student goals, mentors, and university paths
• practical questions to ask on the expo floor
IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
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We sit down with Dr. Subu Iyer of UCLA to unpack chiplets vs dielets, why a universal ecosystem is missing, and how sub‑10 µm bump pitch could make protocols optional. Then we host a panel featuring John Knickerbocker, IBM; Mike Kelly, Amkor; and Tolga Tekin, Fraunhofer IZM on co‑packaged optics, bandwidth, and power for AI data centers.
• chiplet as design construct, dielet as physical die
• lack of universal chiplet ecosystem and interoperability
• bump pitch scaling and protocol overhead trade‑offs
• packaging purpose reframed as power, communication, and cooling
• economic shift and value capture in advanced packaging
• national competitiveness, prototyping access, and talent pipeline
• co‑packaged optics definition, drivers, and cost targets
• copper reach limits, latency, and bandwidth density for AI
• hyperscalers as early adopters and five‑year outlook
Learn more at imaps.org
IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
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A semiconductor wafer travels around the globe five times on average before becoming the chip in your smartphone. Each journey represents a potential risk to device reliability that few consumers—or even industry professionals—ever consider.
Behind every high-performing semiconductor device lies a carefully orchestrated logistics operation ensuring these sensitive components arrive intact and functioning. As Francoise von Trapp discovers in this eye-opening conversation with John Desmond and Valentina Aplenalp of Kuehne+Nagel, the journey matters just as much as the manufacturing.
Drawing from his background in semiconductor design and manufacturing, John explains how vibration, temperature fluctuations, humidity, and even light exposure can compromise device integrity during transit. Wafers transported in specialized containers called FOUPs, delicate packaging materials, and critical replacement parts for manufacturing equipment all require extraordinary care throughout their global journeys.
Valentina reveals the sophisticated systems developed to protect these valuable shipments: real-time environmental monitoring sensors connected to 24/7 control towers, specialized air-ride vehicles, and climate-controlled packaging solutions. When emergencies arise—like a critical equipment failure threatening production—their time-critical logistics teams deliver replacement parts within hours, not days.
Most fascinating is the human element. The Semicon Chain certification program ensures every person who might handle semiconductor shipments receives specialized training, creating an end-to-end system where nothing is left to chance. As John puts it, they aim to be "the best partner that you never know you had"—the hidden force ensuring semiconductor reliability.
Whether you're a semiconductor professional, supply chain specialist, or simply curious about the invisible infrastructure supporting our digital world, this episode offers rare insight into how logistics enables technological innovation.
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SEMI's flagship event, SEMICON West, is moving to Phoenix, Arizona this October 7-9, 2025, after 35 years in San Francisco, coinciding with the region's semiconductor manufacturing boom and $200 billion in announced investments. In this episode, Françoise speaks with SEMI Americas president, Joe Stockunas, who shares reasons for the move and what attendees can expect to experience. This includes:
• Move driven by need to refresh the event and bring it closer to industry growth
• New October timing based on attendee feedback to avoid disrupting July holidays
• CEO Summit featuring keynotes from Arizona Governor Hobbs, TSMC, NVIDIA, and Intel
• Exhibition floor expanding to over 1,500 booths (50% increase from last year)
• Technical tracks focused on advanced packaging, AI, cybersecurity, and workforce development
• Street fair networking event Tuesday evening on 3rd Street
• Student attendance expected to jump from 700 to 7,000 thanks to proximity to Arizona's educational institutions
• Special SemiQuest exhibit at Arizona Science Museum running September through year-end
• Global Semicon events continue growing, with Semicon India doubling to 1,000 booths
For registration and complete program information, visit semiconwest.org or download the event app to navigate the show and build your agenda.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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The IMAPS International Symposium returns to the Town & Country Resort in San Diego from September 29-October 2, 2024, featuring restructured technical tracks, new Monday panel discussions, and exciting networking events including a special reception aboard the USS Midway aircraft carrier. General Chair Benson Chan and outgoing IMAPS President Erica Folk share what attendees can expect at this premier microelectronics packaging event.
• Expanded program with six focused technical tracks for better attendee experience
• New Monday afternoon panels on thermal challenges, HIR roadmap, and co-packaged optics
• Co-location with the new Thermal Management Conference (Wednesday-Friday)
• Special reception on the USS Midway aircraft carrier (requires RSVP during registration)
• Student engagement through high school tours, university booths, and the Posters & Pizza session
• Leadership transition as Erica Folk hands the presidency to Dan Kruger
• Multiple networking opportunities throughout the week including the Exhibitor Happy Hour
• Volunteer opportunities that provide valuable professional development and career connections
Register now at imaps.org to secure your spot at the symposium and don't forget to RSVP for the special Midway reception.
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X-ray technology reveals what the naked eye cannot see - the intricate world of semiconductor interconnects that power our digital lives. In this deep dive with Ben Peecock, Senior Director of Business Development at Nordson Test and Inspection, we uncover the critical differences between x-ray inspection and metrology that keep semiconductor manufacturing on track.
With nearly three decades of experience in the industry, Peecock guides us through the evolution of semiconductor inspection technologies. While silicon itself remains transparent to x-rays, the metal interconnects between components provide the perfect canvas for quality assessment. As advanced packaging pushes toward smaller, more complex structures with 3D stacking and chiplet architectures, the need for sophisticated inspection has never been greater.
We explore how inspection (focused on imagery) and metrology (centered on precise measurements) serve complementary roles across the semiconductor manufacturing ecosystem. From R&D laboratories perfecting new processes to high-volume production lines seeking zero defects, these technologies help manufacturers identify issues before they become costly failures. The conversation ventures into the distinctions between 2D inspection (optimized for speed) and 3D analysis (delivering comprehensive structural information) and when each approach proves most valuable.
Particularly fascinating is Nordson's approach to vertical integration, developing their own specialized x-ray sources and detectors optimized specifically for semiconductor applications. This expertise extends to their innovative work integrating artificial intelligence to accelerate inspections while maintaining accuracy. Their thoughtful approach to data security gives customers options to protect proprietary information while still benefiting from AI's capabilities.
Discover how these technologies are already supporting emerging trends like panel-level packaging and learn about Nordson's unique radiation management solutions that protect sensitive components during inspection. Whether you're a semiconductor professional seeking quality control insights or simply curious about the technologies that ensure your electronic devices function reliably, this episode offers a fascinating glimpse into an invisible world of quality assurance.
Nordson Test and Inspection
Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications.
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Thailand is positioning itself as a new hotspot for semiconductor and microelectronics manufacturing, building on existing infrastructure and establishing key partnerships throughout the region. Managing editor Jillian McNichol shares insights from her recent trip to Thailand where she toured facilities and interviewed industry leaders about the country's ambitious plans.
• Thailand has been involved in assembly and test operations since 1996 through the Thai Microelectronics Center
• Currently Thailand is the 10th largest automobile exporter in the world, with a strong focus on power electronics
• Tariffs present significant challenges, with Thailand currently facing a 36% tariff rate for exports to the US
• The Eastern Economic Corridor (EEC) is a key region for manufacturing, with industrial parks, universities, and port facilities
• Sustainability is a major focus, with Thailand aiming for net zero emissions by 2050
• Thailand is addressing talent shortages through university partnerships that prepare graduates for industry needs
• Strong alignment between government, companies, and educational institutions is driving Thailand's semiconductor strategy.
Learn more in Jillian's article, Thailand: An Emerging Force in the Semiconductor Supply Chain.
Learn more about the Thailand Board of Investment
Contact Jillian McNichol on LinkedIn
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The race toward more powerful AI carries a hidden cost that's becoming impossible to ignore: skyrocketing energy consumption. Did you know AI is projected to devour 10% of global electricity by 2030? This staggering figure has even forced tech giants to delay their sustainability goals.
Enter ASE's Executive Vice President Yin Chang, who reveals how the world's largest semiconductor packaging company is tackling this challenge head-on. The solution lies in revolutionary approaches to power delivery and data transmission. By integrating voltage regulators directly into substrates, power can be delivered mere nanometers from compute chips, drastically reducing energy loss. Even more promising is the shift from electrons to photons for data transmission, which slashes power consumption by an impressive 6x.
At the heart of these innovations is ASE's VI-PACK platform, a comprehensive toolbox that empowers system architects to create maximally efficient AI systems. Moving compute components closer together minimizes power requirements, while co-packaged optics enable the crucial electron-to-photon conversion for longer-distance communication. These technologies aren't just theoretical—industry leaders like NVIDIA and AMD are already implementing them, with significant efficiency improvements expected within five years.
The conversation extends beyond data centers to the future of AI at the edge. As foundry processes advance toward smaller nodes, the voltage requirements decrease, making AI more viable for battery-powered devices. Chang envisions a near future where personal devices run limited AI models locally, offering enhanced privacy by processing sensitive data without cloud dependencies.
Discover how advanced packaging is becoming the unsung hero in balancing our appetite for AI innovation with the planet's energy limitations. Follow ASE Global on LinkedIn or visit aseglobal.com to learn more about their pioneering work in sustainable semiconductor solutions.
Learn more at aseglobal.com or follow ASE Global on LinkedIn.
ASE
ASE plays a significant role in the development of the world’s most innovative electronics.
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The 75th anniversary celebration of ECTC in Dallas showcases a remarkable evolution in advanced packaging technologies, revealing how semiconductor priorities have dramatically shifted. Rather than the relentless miniaturization of the smartphone era, today's AI-driven applications demand larger packages with more functionality and sophisticated thermal management solutions.
Glass core substrates emerged as the star technology of the conference, with standing-room-only sessions demonstrating the industry's intense interest in this promising material platform. The excitement is justified – glass offers superior dimensional stability and enables higher-density interconnects than traditional organic substrates. Meanwhile, co-packaged optics generated similar enthusiasm as engineers tackle the monumental challenge of powering AI server racks that consume between 0.5-1 megawatt each, making energy efficiency a critical concern.
Through conversations with industry leaders including Monita Pau (Onto Innovation), Charles Lee and Mark Gerber (ASE), Tim Olson (Deca), Scott Sikorski (IBM), Roland Rettenmeier, (SCHMID Group), Simon McElrea (LDQX), Henan Zhang, (ACM Research), and Evelyn Weng (ERS Electronic) we gain insights into how these technologies will reshape semiconductor packaging.
With record attendance exceeding 2,500 participants, ECTC has firmly established itself as the premier venue for pre-competitive research in advanced packaging. The technologies showcased this year may take 5-10 years to reach high-volume manufacturing, but they provide a crucial window into the semiconductor industry's future direction. As one participant aptly noted, "We used to draw pictures of these advanced packaging technologies and people quite often laughed... now they are actually production products because it was the only way to get there."
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
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What happens when the world's thirst for artificial intelligence collides with physical limitations? The answer lies at the intersection of silicon innovation and packaging technology.
From the conference hall of ECTC 2025 in Dallas, we're joined by Sam Naffziger of AMD who reveals how AI has transformed from a peripheral topic to the dominant force in computing within just five years. The economic motivation is clear: creating machines that generate intelligence offers "uncalculable value" to humanity. Yet as Nafziger explains, today's large language models face significant limitations—they excel at pattern recognition but struggle with true reasoning, suffer from hallucinations, and require human verification for mission-critical applications.
Perhaps most surprising is Nafziger's revelation about "the data wall"—general-purpose AI models have essentially exhausted the high-quality training data available on the internet. This constraint is pushing AI development toward more sophisticated approaches involving reinforcement learning and models that check other models, gradually shifting from simple pattern recognition toward deliberative thinking that more closely resembles human reasoning.
The conversation tackles the looming concern of AI's energy consumption, projected to reach 10% of global power by 2030. Rather than viewing this as an insurmountable problem, Nafziger offers a compelling perspective: AI's ability to optimize countless processes—from transportation routing to crop yields and manufacturing efficiency—could ultimately lead to net energy savings despite its own substantial power requirements.
For the advanced packaging community, the message is clear: your work sits at the foundation of AI's future. As computational demands increase exponentially, innovations in thermal management, power delivery, and component integration will directly determine how quickly and effectively AI can evolve.
Connect with Sam Naffziger on LinkedIn or visit AMD.com to learn more about their competitive AI solutions and join the conversation about technology that's reshaping our world.
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What happens when you gather 75 years of packaging innovation under one roof? The Electronic Component Technology Conference (ECTC) has transformed from a modest gathering of 300 electronics professionals to a powerhouse event attracting over 2,500 industry leaders, researchers, and visionaries. This remarkable journey reflects how advanced packaging has evolved from supporting technology to the driving force behind modern electronics.
In this special episode, we speak with three generations of ECTC committee members: Pat Thompson (with 41 years of ECTC experience), Przemek Gromala (10 years), and Florian Herault (since 2010). They share fascinating insights into how the conference has tracked—and often predicted—the industry's most significant shifts. From the days when Ball Grid Arrays were cutting-edge to today's excitement around hybrid bonding and chiplets, ECTC has been the barometer for packaging innovation.
The conversation reveals how technologies that once caused standing-room-only excitement have either become industry standards or faded into obscurity. Remember 450mm wafers? That path was abandoned in favor of panel-level packaging. Through-silicon vias struggled with cost issues for years before finding their sweet spot in high-performance applications. And the longstanding debate between System-on-Chip and System-in-Package approaches has evolved into today's heterogeneous integration paradigm.
Looking forward, our guests highlight the challenges driving tomorrow's innovations: thermal management for power-hungry AI chips, specialized edge computing architectures, and adapting advanced electronics to automotive and other harsh environments. As Host Françoise von Trapp observes, "It's a great time to be a nerd," with abundant technical challenges ensuring exciting work for packaging professionals for decades to come.
Don't miss our upcoming episode featuring ECTC keynote speaker Sam Naffziger discussing responsible AI implementation and the critical role of packaging in creating energy-efficient high-performance devices!
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Pratyush Kamal explains how 3DIC technologies are transforming semiconductor design as Moore's Law slows, requiring closer integration between chip and package design to maximize performance.
• Traditional chip design treated packaging as an afterthought with designers "throwing designs over the wall"
• Economic realities of advanced nodes mean companies now pay more for smaller transistors, driving chiplet adoption
• Thermal challenges multiply in 3D stacks as power density doubles with each added layer
• Data centers projected to consume 10% of US electricity by 2030, making power efficiency critical
• Siemens working to standardize design languages across tools and enable open chiplet ecosystems
• Average age of electrical engineers in US is 57, creating urgent need for workforce development
• Universal Chiplet Interconnect Express (UCIe) emerging as key standard for chiplet interoperability
Visit siemens.com/3DIC to learn more about Siemens' comprehensive 3DIC solutions.
Siemens EDA
Siemens' EDA software helps you turn today's ideas into the sustainable products of the future.
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Andrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they're improving semiconductor manufacturing quality.
• X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality
• Traditional 2D radiographic imaging is being replaced by 3D imaging for more stringent manufacturing requirements
• Planar CT imaging suffers from artifacts when inspecting flat electronic components like circuit boards and wafers
• Dynamic Planar CT takes more images from different angles with a wider field of view, reducing artifacts
• New technology operates twice as fast as traditional methods while reducing x-ray dose to sensitive components
• Automated inspection systems integrate directly into manufacturing lines with no human interaction required
• Common applications include detecting voids in ball grid arrays and micro bumps in flip chip devices
• The technology supports Quality 4.0 initiatives by providing feedback to improve manufacturing processes
• Nordson's systems are in use worldwide with an install base exceeding 2000 automated x-ray inspection systems
Learn more about Dynamic Planar CT and Nordson's x-ray inspection solutions at nordson.com or on their YouTube channel.
Nordson Test and Inspection
Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications.
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The IEEE MTTS International Microwave Symposium attracts over 9,000 attendees and 500+ exhibitors to share cutting-edge developments in RF, microwave, and advanced packaging technologies. Tim Hancock and Jim Buckwalter from the IMS committee explain why this premier event, taking place in San Francisco's Moscone Center from June 15-20, has become increasingly relevant to professionals in advanced packaging and heterogeneous integration.
• Approximately 15% of accepted papers directly address packaging and heterogeneous integration topics
• Papers undergo rigorous double-blind review with an in-person committee meeting to ensure highest quality content
• Technical focus includes laminate technology, chip stacking, thermal management, and other critical packaging technologies
• Special workshops address 3D heterogeneous integration, millimeter-wave phased arrays, and advanced packaging solutions
• Exhibition floor features 500+ companies providing networking opportunities and technology discovery
• Student programs include design competitions, volunteer opportunities, and dedicated sessions for underrepresented groups
• Early bird registration ends May 16th with regular registration continuing at ims-ieee.org
Register at ims-ieee.org to secure your spot and book accommodations before they fill up.
THE 2025 IEEE MTT-S IMS
The 2025 IEEE MTT-S IMS is the largest event for RF and microwave professionals in the world.
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Acoustic inspection stands as a silent sentinel in semiconductor manufacturing, detecting microscopic defects that could lead to catastrophic failures in high-value applications. Bryan Schackmuth, Senior Product Line Manager at Nordson Test and Inspection, reveals how this technology has evolved from laboratory tools to production-line essentials.
When ultrasound encounters even the tiniest air gap—we're talking hundreds of angstroms—it reflects completely, making acoustic imaging uniquely powerful for evaluating bonds between materials. While optical inspection shows surface defects and X-ray reveals density variations, acoustic inspection peers between layers, identifying delamination and other hidden flaws that might otherwise escape detection until field failure.
The challenges of advanced packaging have driven significant innovation in acoustic inspection technology. As manufacturers stack more die, create complex interconnects, and push toward heterogeneous integration, the value of each wafer increases dramatically. Nordson's SpinSam system represents a breakthrough in this space, replacing traditional raster scanning with a rotational approach that achieves 41 wafers per hour—eight times faster than previous generation technology—while maintaining resolution down to 10 microns.
Beyond pure speed, the system's spinning scan technology offers unique advantages for edge inspection where defects are more common due to coefficient of thermal expansion effects. The modular design allows maintenance on individual scanners while others continue operating, maximizing uptime in production environments. Most exciting is the integration of AI and machine learning for defect detection, moving beyond simple thresholds to analyze complex multilayer images simultaneously.
Want to see how your inspection strategies might benefit from these advances? Check out Nordson's SpinSam technology at nordson.com and discover how acoustic inspection is helping manufacturers achieve higher yields and more reliable products in today's most demanding semiconductor applications.
Nordson Test and Inspection
Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications.
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The 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year's award winners in heterogeneous integration and chiplet technology.
• SallyAnn Henry, Jim Straus and David Wang, ACM Research, describe a horizontal rotation plating system for panel-level packaging with superior uniformity across square substrates
• Eric Gongora, of MacDermid Alpha, explains how NovaFab fine-grained copper enables hybrid bonding with customizable annealing times and improved electron migration resistance
• Chuck Woychik, NHanced Semiconductors, talks about how the company brings hybrid bonding capabilities onshore with expertise in wafer processing for both defense and commercial applications
• Keith Felton, Siemens Digital Industries Software, introduces Innovator 3DIC for hierarchical device planning that automatically propagates design changes throughout chiplet interfaces
• Kazuyuki Mitsukura explains how Resonac builds collaborative consortia in Japan and the US to solve complex advanced packaging challenges through shared resources
• Rex Anderson from Micross shares his engineering journey and passion for mentoring the next generation of technologists
• Ron Huemoeller and Eelco Bergman discuss how Saras Micro Devices addresses AI power challenges with embeddable S-Tile capacitors. They also talk about Saras corporate culture.
EV Group
EV Groups supplies high-volume equipment and process solutions for semiconductor manufacturing.
KLA, SPTS Division
KLA provides semiconductor equipment for metrology, inspection, wafer processing, and more.
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Navigating today's complex manufacturing landscape demands unprecedented supply chain resilience. This eye-opening conversation with Barry O'Dowd (Kuehne+Nagel) and Kamal Ahluwalia (Resilinc) reveals why robust supply chains matter more than ever—particularly for semiconductor capital equipment.
The semiconductor industry operates at extraordinary precision, with equipment working at scales as small as five nanometers—roughly 1/18,000th the width of a human hair. This precision makes these multi-million dollar tools exceptionally vulnerable during transport, requiring meticulous handling across tens of thousands of miles between manufacturing and installation. With leading-edge fabs costing up to $20 billion, equipment failures or delays can trigger catastrophic financial consequences.
Our experts explain how companies are reimagining resilience through sophisticated data analysis, multi-tier visibility, and proactive risk management. Barry shares how Kuehne+Nagel's risk mitigator tool brings together all supply chain stakeholders to identify vulnerabilities and implement mitigation strategies—expertise developed during their flawless delivery of over 2 billion COVID vaccines. Meanwhile, Kamal describes how Resilinc helps organizations leverage AI to anticipate disruptions across 40 different risk categories, from natural disasters to financial instability.
The conversation offers practical advice for strengthening your own supply chain: understand your end-to-end process, engage with experienced partners, and adopt a first-principles approach to reimagining resilience with current technology. As global uncertainties continue mounting—from geopolitical tensions to extreme weather events—supply chain resilience isn't merely about risk avoidance; it's becoming a strategic competitive advantage.
Kuehne+Nagel
Trust Semicon Logistics by Kuehne+Nagel to navigate even the most demanding supply chain challenges.
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The 3D InCites Member Spotlight episode features exclusive conversations with industry leaders at IMAPS Device Packaging Conference 2025, exploring the cutting-edge of semiconductor packaging innovation and domestic manufacturing expansion.
• Rex Anderson of Micross details their RESHAPE program funding and Integra acquisition, establishing them as North America's largest domestic OSAT
• Calvin Cheung of ASE explains how advanced packaging enables AI infrastructure while reducing power consumption by 40-60% through vertical power delivery. He also describes silicon photonics emerging as a game-changer for data transmission, using light instead of electrons for faster, more energy-efficient signal integrity
• Keith Felton of Siemens discusses digital twin technology allowing early predictive analysis during package prototyping to prevent costly downstream engineer change orders - or ECOs.
• Vahid Akhavan highlights PulseForge's photonic debonding technology partnerships for clean, high-yield wafer release
• Bernd Krafthoefer and Florian Lechner, ERS Electonic representatives, share insights on their new European competence center and sub-micron photonic debonding capabilities for 300mm wafers.
Join us next week as we explore supply chain resilience in the semiconductor capital equipment sector with Barry O'Dowd from Kuehne+Nagel and special guest Kamal Aluwalia, CEO of Resilinc. Learn more about member benefits at 3DInCites.com/memberships.
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
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Arizona is transforming into the "Silicon Oasis" of America through an unprecedented collaboration that's reshaping semiconductor education from high school through graduate studies. At the heart of this revolution is a groundbreaking partnership between the University of Arizona and Chandler Unified School District, launching the nation's first high school career and technical education program focused on semiconductor manufacturing.
Starting July 2025, forty students will begin a two-year journey learning on industry-grade equipment—not "glorified children's toys" but actual mechatronic systems, universal robots, and PCB printing technology. What makes this program revolutionary is its design for multiple pathways; graduates can either enter the workforce immediately as technicians or continue to higher education with college credits already earned.
Meanwhile, Arizona State University is building the advanced end of this educational pipeline through CHIPS Act-funded initiatives like the Southwest Advanced Prototyping Hub and the SHIELD project. Graduate courses in semiconductor packaging have exploded in popularity, growing from just 27 students to over 175 in two years. The university is getting creative with outreach too, developing a "Packaging on Wheels" mobile facility to bring semiconductor education to schools nationwide.
The strength of Arizona's approach lies in its extensive industry involvement. Fifteen major companies form the steering committee for the high school program, providing real-world problems and case studies. Students from diverse backgrounds—electrical, mechanical, materials science, and chemical engineering—all find pathways into this multidisciplinary field.
As one industry expert notes, students with hands-on, industry-specific training demonstrate markedly better performance both during interviews and on the job. This educational ecosystem is creating not just the chips of tomorrow, but the workforce that will design, build, and innovate them.
Contact Our Guests on LinkedIn:
- Scott Hayes, NXP
- Liesl Folks, University of Arizona
- Janet Hartkopf, Chandler Unified School District
- Chris Bailey, ASU
- Pallavi Praful, ASU
- Rohit Gandhi, ASU
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
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What happens when AI diagnoses patients better than doctors? Where does artificial intelligence truly stand on the hype cycle? Is all this computational power actually benefiting society? These critical questions frame our fascinating discussion recorded live at IMAPS Device Packaging Conference in Phoenix, Arizona.
Join our expert panel featuring Hemanth Jagannathan (IBM Research), Mark Kuemerle (Marvell), and Kimon Michaels (PDF Solutions) as they tackle AI's most pressing challenges and opportunities. Their collective expertise reveals surprising insights about how AI is transforming industries while raising important considerations about its implementation.
The conversation explores AI's evolution from specialized technical applications in semiconductors to today's consumer-facing generative tools. Our experts draw fascinating parallels between AI and previous technological breakthroughs like laser technology, suggesting we've only scratched the surface of potential applications. They provide compelling examples from healthcare where AI systems demonstrate superior diagnostic capabilities by processing complex datasets beyond human capacity.
While acknowledging concerns around data accuracy, power consumption, and appropriate boundaries, the panel remains optimistic about AI's future. They emphasize that today's implementations represent merely the beginning of a transformative technology whose full impact remains largely unanticipated. Yet they also agree on applications where human judgment should remain primary – including, amusingly, matchmaking.
Dive into this thought-provoking conversation to understand why organizations must either leverage AI effectively or risk being outpaced by competitors who do. Subscribe to 3D IncItes Podcast for more cutting-edge discussions on technologies shaping our future.
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
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Explore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Packaging Conference (DPC). With the conference relocating to the vast Wild Horse Pass, expect an enriched experience with expanded technical tracks and exhibitor opportunities reflecting the rising interest in this field. Get ready to embrace the future of packaging with insights that redefine its significance in the semiconductor industry.
Uncover the critical challenges facing AI infrastructure in a thought-provoking panel discussion with experts from IBM Research, Intel, and leading OSATs. We'll tackle whether today's infrastructure can keep pace with AI's explosive growth, especially concerning energy-efficient chip designs and packaging solutions. Learn about groundbreaking advancements and the potential to alleviate data center power consumption concerns through innovative packaging techniques. Beyond the tech talk, we'll highlight the vibrant networking scene at the conference, featuring events like the Backyard Olympics and a charity golf tournament, ensuring a perfect blend of professional growth and community building. Join us for a chance to network, learn, and potentially reshape the future of microelectronics packaging.
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
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The episode explores the key insights from the recent SEMI ISS event, focusing on the semiconductor industry's journey toward a trillion-dollar market by 2030. It discusses the significant themes of uncertainty and the transformative impact of AI, while also addressing industry challenges and emerging trends.
Additionally, SEMI's Market Intelligence team dive into the revised 2024 equipment forecast and World Fab Forecast, discussing trends influenced by AI technology and geopolitical factors, especially those linked to China.
As we detail the upswing in equipment sales, driven by Chinese investments and AI progress, we also spotlight the trends shaping both front and back-end equipment markets. From the resurgence of advanced packaging to the anticipated rebound in test equipment, this episode provides a thorough look at the semiconductor industry's current state and its promising future, including insights into the world fab forecast and its implications for the automotive and power sectors.
Highlights:
• Overview of SEMI ISS and its significance in the semiconductor industry
• Highlights on this year's theme: Ready, Set Ramp! and its implications
• Insights on overcoming market uncertainties and challenges
• AI's transformative role in driving semiconductor innovation
• Discussion of upcoming semi events and their importance for networking
• Market intelligence updates on forecasts and growth opportunities
Contact Our Guests on LinkedIn:
- Joe Stockunas, President, SEMI Americas
- Christian Dieseldorf, Senior Analyst, SEMI MIT
- Inna Skvortsova, Market Analyst, SEMI MIT
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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Unlock the secrets of semiconductor packaging materials with insights from industry experts Dariush Tari and Rose Guino of Henkel's Semiconductor Packaging Materials Division. This episode promises a deep dive into the processes behind developing materials that are both reliable and high-performing, crucial for the ever-evolving demands of AI, machine learning, and quantum technologies.
Dariush and Rose share their wealth of knowledge on material characterization, modeling, and application engineering, and discuss how Henkel maintains its pivotal role within the semiconductor ecosystem. From underfills to thermal interface materials, discover how comprehensive material offerings are shaping the future of high-performance computing.
Explore the fascinating advancements in material modeling for semiconductors, where physics-based simulations are transforming reliability testing and development cycles.
Gain a clearer understanding of capillary underfill materials and their vital role in enhancing solder joint reliability under thermal stress.
This episode delves into the collaboration between material developers and modeling experts, underscoring the importance of early customer engagement to tailor innovative solutions.
If you are interested in learning how cutting-edge materials are propelling the semiconductor industry forward, this conversation is a must-listen.
Contact the Speakers on LinkedIn
Dariush Tari, Henkel Semiconductor Packaging Materials
Rose Guino, Semiconductor Packaging Materials
Henkel Semiconductor Packaging Materials
Henke's advanced materials elevate semiconductor packaging to meet power, performance, area and cost
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This episode was recorded live at SEMICON Europa.
Michael Zahn from Koh Young talks to Françoise von Trapp about the growing significance of metrology in semiconductor manufacturing and the need for advanced measurement technologies. They discuss the transition from 2D to 3D measurements in semiconductor manufacturing. Zahn explains why non-destructive, optical 3D measurements offer precise height and position data with sub-micron resolution.
You'll learn how these measurements are crucial for early defect detection, improving efficiency, and reducing waste. You'll also gain an understanding about the importance of real-time, in-line measurements for quality assurance and process optimization.
Zahn also highlights Koh Young's AI integration for process control and the future potential of sub-micron resolution systems.
Contact Michael Zahn on LinkedIn
Koh Young Europe
Koh Young paves the way for smart factory solutions with 3D measurement-based inspection solutions.
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This episode was recorded live at SEMICON Europa. It features interviews with four of the 20 under 30 Recognition Award recipients from Cadence, ERS Electronic, KLA, and Semilab. It also features updates from Comet Yxlon, Trymax Semiconductor, and DSV-IMS.
SEMI Europe's 20 Under 30 program recognizes future leaders in the microelectronics industry.
James McGrath from KLA discussed his role as a PE CBD Process Engineer and his unexpected entry into the semiconductor industry.
Augustin Detruit from ERS Electronics highlighted his growth from a master's thesis to Head of Production, overseeing a significant increase in production capacity.
Luca Sinkó from Semilab shared her journey from physics to R&D Team Leader and her recent promotion to Product Manager.
Charis Kalantzi from Cadence detailed her role in supporting digital design tools and her involvement in community volunteering.
All four talk about what brought them into the semiconductor industry, what made them stand out to the judges, and the honor of receiving such an award.
From Dionys van de Ven, we hear about the announced the launch of Comet Yxlon's new 3D X-ray system for fab-level yield improvement,
Peter Dijkstra from Trymax, discussed what is driving the company's growth and it's expansion into the U.S. market.
Spencer Wall talks about DSV's acquisition of Schenker, and shares the progress so far. Michael Murray talks about DSV-IMS foray into using AI and machine learning to improve supply chain efficiencies.
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In this episode, recorded live at SEMICON Europa in Munich, Françoise von Trapp continues her conversations with the keynote speakers on helping to build Europe’s technical sovereignty, and how implementing digital twins can help achieve this goal.
John Behnke, of Inficon, discussed the evolution of smart manufacturing in the semiconductor industry. He highlighted how smart software can increase factory productivity by 5-15% by making autonomous decisions based on digital twins. You’ll learn about Behnke’s vision for the Smart Control Room.
Catherine Le Lan, Synopsys, emphasized the need for collaboration between academia and industry to address the talent shortage, suggesting cross-disciplinary education and early branding of microelectronics.
Katharina Westrich, Siemens, explained how digital twins optimize factory planning, reduce emissions, and train workforce remotely, envisioning a future where virtual and real-world operations are seamlessly integrated.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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This episode was recorded live at SEMICON Europa in Munich. This year's theme of this year’s conference is "Innovation and Collaboration: Powering Sustainable Exponential Growth". In other words, how the semiconductor industry can work together to sustainably reach the trillion dollar goal by 2030 without compromising its Net Zero goals. It's going to be tricky, for sure.
Frederic Godemel of Schneider Electric talks about what he calls the “energy trilemma” that is causing the energy supply challenges. These are security, affordability, and the impact on the planet. He explains how electricity generated from renewable sources will help address these issues and implores the industry to focus on growing responsibly so it can meet its goals.
The conversation continues with Comet CEO, Stephan Haferl, who discusses the importance of developing power-efficient semiconductors. He talks about the power advantages of 3D stacking and heterogeneous integration and explains how 3D X-ray technologies helps bring these technologies to market.
Lastly, you’ll hear from Bart Placklé of imec, who talked about next generation vehicle architectures enabled by sensing and chiplets. You’ll learn what’s driving the need for chiplets in today’s software-defined vehicles, and how chiplet architectures can take us to the next level of autonomous vehicles.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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It's been quite an exciting year for the U.S. Chips for America as the funding starts rolling out. All year long, Françoise von Trapp has interviewed various government dignitaries about various elements of the CHIPS Act. This episode brings these episodes together in order of appearance, to give you a timeline of the year's progress.
First up is Dan Berger, National Advanced Packaging Manufacturing Program (NAPMP), who explains how CHIPS Acts monies are being used to address gaps like advanced packaging and substrate manufacturing, to help revitalize the US semiconductor industry. The focus is on developing domestic manufacturing teams for U.S. leadership in microelectronics, with global collaboration and security in mind. He discusses the importance of advanced packaging roadmaps aimed at scaling down feature sizes, eliminating interposers and integrating chiplets directly onto substrates.
Next, we hear from the Honoroable Laurie Locascio, Director of NIST, and Undersecretary of Commerce for Standards and Technology. She explains importance of public-private collaboration, addressing research gaps, strategic investments, and global collaboration to ensure the industry's success and address economic and national security concerns.
Lastly, Dev Palmer explains Chips Act's funding distribution and its impact on the semiconductor ecosystem. He emphasizes the importance of bridging research and industry and describes some of the programs key initiatives. Palmer highlights the need for collaboration across large and small businesses, academia, and nonprofits to achieve the Chips Act's ambitious goals, and shares the details of the recently announced Small Business Innovation Research (SBIR) program under the Biden Harris administration.
Contact the Panelists on LinkedIn
- Dan Berger, Associate Director, NAPMP
- Dr. Laurie Locascio, NIST
- Dev Palmer, NAPMP
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On September 30, 2024, Onto Innovation held the grand opening of its Packaging Applications Center of Excellence - or as it's being called, PACE. Françoise von Trapp attended the grand opening to learn why the company has partnered with like-minded suppliers of the panel-level packaging ecosystem to accelerate the development of PLP technologies for both organic and glass substrates. These include 3D InCites Members: LPKF Laser & Electronics, Evatec, MKS-Atotech and Lam Research; as well as Resonac, Corning, and others.
This episode starts off with a conversation with Onto Innovation CEO, Mike Plisinski, who explains how PACE came to be, its business model, and why AI is driving growth in panel-level packaging.
The story continues with a tour of PACE conducted by Keith Best, Director of PACE. Best gives a step-by-step description of the processes as panels move from the photoresist coater, to the lithography stepper, to the developer, and then to the inspection system. He also talks about the role advanced lithography tools play in developing down-stream panel level processes.
Lastly, you'll hear from PACE collaboration partners:
- Ralph Zoberbier, CMO, Evatec
- Kuldip Johal, MKS-Atotech
- Kazuyuki Mitsukura, Resonac
- Junro Yoon, Corning Advanced Optics
- Richard Noack, LPKF Laser & Electronics
Read the full story on 3D InCites
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In this episode, Françoise von Trapp speaks with Chee Ping Lee, of Lam Research, about the critical role of high bandwidth memory (HBM) in generative AI, emphasizing its high bandwidth and compact design.
HBM memory has received a lot of attention as one of the first technologies to implement 2.5D and 3D stacking. Lee explains how HBM uses advanced packaging technologies like TSV and microbumps to achieve high memory capacity and performance. Lam Research's solutions are key to HBM's success.
Listen to learn details about:
- The importance of HBM for AI chip manufacturing
- The relationship between advancedpackaging and HBM
- The differences between different HBM generations
- The future of microbumps and hybrid bonding
- Lam Research’s advanced packaging solutions
Contact Chee Ping Lee on LinkedIN
Learn more about why HBM Is a critical enabler for generative AI in this blog post.
Lam Research
Lam Research equipment and services allow chipmakers to build smaller and better performing devices
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In this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They discuss how AI is being used to find structural defects in advanced chip packages, and also how 3D inspection is being used to develop advanced AI technologies themselves.
von Trapp and Drolz explore the evolution of inspection methods in advanced packaging, noting the complexity of 3D ICs and the limitations of traditional optical inspections. Drolz emphasizes the importance of AI in accelerating yield curves and improving inspection efficiency. She also mentions the need for an enterprise solution to integrate various inspection tools.
You’ll learn:
- About the difference between 2D and 3D X-ray technologies
- How 3D X-ray evolved over the past decade so that it can be used effectively in volume production
- How Comet Yxlon’s CA 20 tool, integrated with the AI software Dragonfly, enhances defect detection by using deep learning to analyze X-ray images
Contact Isabella Drolz on LinkedIn
Comet Xylon
Comet Yxlon delivers high-end X-ray and CT system solutions for advanced packaging inspecton needs.
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In this episode, Francoise speaks with Simon McElrea, an interconnectologist, about his career in and the evolution of interconnectology, emphasizing its importance in semiconductor packaging.
McElrea discusses his roles at semiconductor start-ups like Vertical Circuits and Invensas; his foray into wireless charging at Energous and FreePower; and his return to the semiconductor industry due to its current inflection point.
He talks about how the Chips Act favors large companies over startups and stressed the need for government support to attract young talent and foster innovation. Lastly, McElrea explained how to better support startups and disruptive technologies in the semiconductor industry through policies and funding.
Listen and learn:
· How adopting the term "interconnectology" will change the narrative around advanced packaging
· Why we need to inspire young talent to pursue careers in interconnect-focused fields like packaging through initiatives at universities
· The role of consortia and joint ventures can play
Contact Simon McElrea on LinkedIn
LQDX
LQDX is setting a new metal deposition standard with its breakthrough family of Liquid Metal Inks®.
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In this episode, Françoise von Trapp talks with Onto Innovation’s Monita Pau and Jiangtao Hu about metrology for advanced packaging – why do we need it? What are the challenges, and how do we solve them?
In semiconductor manufacturing front-end processes, metrology has always been a critical step to ensure consistency of very fine features. It’s only recently become important to back-end advanced packaging processes – especially for heterogeneous integration. As chips are designed with smaller features, advanced packaging processes are becoming more front-end like.
You’ll learn about how metrology designed for front-end manufacturing is being reimagined for wafer-level and assembly applications such as:
- Hybrid bonding
- 3D stacking with micro bumps
- RDL applications for interposers
- TSV applications
The speakers discuss the challenges, gaps, and solutions for each. You’ll also learn what makes Onto Innovation uniquely qualified to support this.
Contact Our Guests on LinkedIn
· Monita Pau
· Jiangtao Hu
Onto Innovation
Your partner for innovative solutions that improve time to market, yield, and product reliability.
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In this episode, Tarak Railkar and Benson Chan join Françoise von Trapp for a preview of The IMAPS International Symposium 2024, which takes place in Boston from September 30 to October 3, 2024.
This year's symposium focuses on heterogeneous integration for paradigm-shifting microelectronics and photonics. It will feature a five-track technical program, special interactive sessions on onshoring, keynote speakers by industry leaders, and much more. The symposium will also host a Bingo networking event to promote DEI, a career fair, student poster sessions, and off-site tours to MIT and MRSI Systems.
Listen in to learn about:
- The benefits of volunteering for IMAPS
- Networking and career opportunities
- The speaker and panel line-up
Register for this year's IMAPS Symposium here.
Contact the Speakers on LinkedIn
- Tarak Railkar, General Chair
- Benson Chan, General Chair-Elect
IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
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In this episode, Françoise von Trapp speaks with Bruce Kim, of SurplusGLOBAL, for an update on the semiconductor secondary equipment market, and how the US. and European Chips Acts are impacting it.
They also discuss the trend of top-tier OEMS prioritizing the development of innovative technology rather than investing in legacy tools that are still very much in need, and the impact this is having on device manufacturers that rely on legacy tools, but have trouble finding repair parts. This was part of an interview with Bruce by WorldFolio. Find the complete article here.
You’ll learn how SurplusGLOBAL is building a global parts platform that helps legacy tool owners find parts, and also manufactures replacement parts for those that have become obsolete. You’ll also learn how AI is helping to optimize this business. You’ll also hear about the 2030 Big Cluster Project, the company’s global expansion in semiconductor manufacturing hot spots around the globe, and more.
Contact Bruce Kim on LinkedIn
SurplusGLOBAL
SurplusGLOBAL is one of the largest one-stop platforms for pre-owned semiconductor equipment.
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In this episode, Françoise von Trapp and underfill materials expert, Dick Jensen, NAMICS corporation explore the societal and technological challenges that impact microelectronic materials development.
The conversation focuses on the evolution of underfill materials development over the past 30 years. They discuss the importance of underfill materials in semiconductor manufacturing, focusing on their compatibility, environmental impact, and properties.
You’ll learn about:
- The development of specialized underfill materials for advanced packaging technologies, including AI chips, and the challenges arising from material changes in electronics manufacturing
- Historical examples of working with restricted substances and how that created a need for alternative materials
- The current need for collaboration and innovation to address the issue of PFAS chemicals in products
- Why and how much testing is important to ensure material compatibility and performance
NAMICS
NAMICS Corporation provides advanced materials and solutions for the semiconductor industry.
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This episode was recorded live at SEMICON West 2024 – SEMI’s flagship tradeshow where the global industry gathers to showcase its latest products and technologies; and discuss topics critical to the industry’s growth. Two of these continue to be Sustainability and Workforce Development. Today’s guests will address both these topics.
Paul Kelly, Vice President of Strategies, Partnerships, & New Ventures and Chief Operating Officer of NY CREATES, and Dr. Mousumi Bhat, SEMI Vice President of Sustainability Programs join Françoise von Trapp to discuss an environmental sustainability partnership between NY CREATES and the SEMI Climate Consortium (SCC). You'll learn:
- What the SCC is all about and why it's a crucial step forward for the semiconductor industry
- New York's leadership role in addressing environmental sustainability for the semiconductor industry
- What the agreement between SEMI and NY CREATES covers
- How the climate agreement dovetails with the CHIPS Act and it's goals
- and more.
Our second guest is Shari Liss, Director of SEMI Foundation. She updates Françoise on the initiatives her team launched in the U.S. to address the semiconductor talent shortage, and how they are being rolled out in other parts of the globe.
Connect with our guests on LinkedIn:
- Paul Kelly, NY CREATES
- Mousumi Bhat, SEMI
- Shari Liss, SEMI Foundation
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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For this 3D InCites Podcast Extra, Françoise von Trapp traveled to Morrisville, North Carolina, to witness Foundry 2.0 in action at NHanced Semiconductors.
She speaks with founder and CEO Bob Patti about his vision for the company, which is based on implementing the Foundry 2.0 business model he conceptualized. It involves sourcing dies and chiplets from traditional foundries and applying semiconductor foundry processes and advanced packaging and assembly technologies.
You'll learn:
- What's driving the transition to advanced packaging from traditional scaling
- Why the traditional foundry model may not be the way going forward
- How Foundry 2.0 is different
Françoise also takes you on an audio tour of the facility, led by Operations Director, Carl Petteway. It gets a bit noisy - but you'll feel like you're right there, and you'll learn about the tools used to perform processes like chemical mechanical polishing (CMP), photolithography, hybrid bonding, and through silicon vias.
Contact Our Guests on LinkedIn:
- Bob Patti, CEO and Founder, NHanced Semiconductors
- Carl Petteway, Operations Director, NHanced Semiconductors
Learn More:
Read the story and see the photos from the tour on the 3D InCites Website.
NHanced Semiconductors
The USA’s First Pure-Play Advanced Packaging Foundry - Where Innovation Meets Precision
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The semiconductor industry supply chain continues to capture attention as general awareness about the importance of semiconductors in our everyday lives grows.
The news of global expansion and ongoing delays of new fabs coming online is constant. But have you ever stopped to think how complicated it is to outfit a fab with its highly calibrated, sensitive equipment? There are many moving parts to consider – both figuratively and literally.
In this episode, Françoise von Trapp leads a conversation with Barry O’Dowd of Kuehne+Nagel; Kevin Mille, of KLA, and Emerald Grieg, of PTW Group to discuss what it takes to successfully move a piece of semiconductor equipment from the supplier to the manufacturer.
The speakers discuss trade compliance and logistics challenges, the proper approach to packing and crating sensitive equipment, and how to ensure safe transportation. They discuss the differences between moving new equipment from an OEM, and secondary equipment from a broker. They also share stories of when things didn’t go exactly to plan, and what they learned from the experience.
Listen in and learn:
- What you should consider when you’re ready to move a tool
- What you need to know about trade compliance issues
- What to do if the customer is not ready to receive the tool
- The importance of communication and collaboration throughout the process
- The importance of using specialists who understand the complexities of semiconductor equipment and parts
- And more…
Contact Our Panel on LinkedIn:
- Barry O’Dowd, Kuehne+Nagel
- Emerald Grieg, PTW Group
- Kevin Mille, KLA
Kuehne+Nagel
Trust Semicon Logistics by Kuehne+Nagel to navigate even the most demanding supply chain challenges.
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This week’s episode was recorded live at SEMICON West where 10 of our community members have news to share. The conversation focused on the latest advancements in semiconductor technology, including lithography, packaging, and materials. Speakers discussed the need to reduce power consumption in AI chips, the potential of using interposers to connect dies without pads, and the ongoing talent crisis in the industry. They also highlighted the importance of sustainability and the potential for the industry to reach a trillion-dollar goal by 2030. Additionally, speakers discussed the expansion of companies in North America, the significance of UV laser debonding, and the investment in electric vehicles and carbon initiatives.
Speakers include:
- Ken McWilliams, of Multibeam Corporation, and Brad Ferguson of Skywater Technology
- Ram Trichur, Henkel Technologies
- Alan Weber, PDF Solutions
- Nirmalya Maity and Zia Karim, Yield Engineering Systems (YES)
- Martin Elzingre and Jeremy Sanner of Edwards
- Dave Kirsch and Thomas Uhrmann of EV Group
- Spencer Wall and Robert Green of DSV–IMS
- Chuck Byers, of Monozukuri (MZ Technologies)
- Meg Conkling, of Veeco
- Bernd Krafthofer of ERS Electronic GmbH
The Brandon T. Adams Audio Experience
Welcome to The Brandon T. Adams Audio Experience, hosted by entrepreneur, investor,...
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SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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Recorded live at SEMICON West 2024, SEMI’s flagship tradeshow where the global semiconductor industry gathers to discuss important matters and showcase new products and technology.
This episode features Françoise von Trapp’s conversation with Jose Fernandez, Under Secretary of Economic Growth, Energy, and The Environment for the Department of State, to talk about securing critical supply chains for the 21st century.
Fernandez discussed the importance of addressing geopolitical issues and ensuring supply chain resilience, particularly in the aftermath of the pandemic. He highlighted the importance of establishing global semiconductor supply chains that meet clean energy goals to galvanize a clean energy future. He also emphasized the need to prioritize security over efficiency and highlighted the issue of semiconductors seeping into Russia despite sanctions.
You’ll also learn:
- How the U.S. Department of State International Technology Security and Innovation Fund (ITSI) supports workforce development and is helping to secure critical minerals.
- About the impact of sanctions on Russia's semiconductor industry, and how companies are working together to improve due diligence and prevent the flow of semiconductors into Russia
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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Recorded live at SEMICON West 2024, the flagship tradeshow for SEMI, where the entire industry gathers to showcase their latest products and technologies.
Françoise von Trapp interviews Laurie Locascio, Director of NIST and the Under Secretary of Commerce for Standards and Technology to learn more about the US CHIPS and Science Act, implementation updates, and government investments in semiconductor manufacturing and supply chain.
Key takeaways included the importance of public-private collaboration, addressing research gaps, strategic investments, and global collaboration to ensure the industry's success and address economic and national security concerns.
You’ll learn about:
- Strategic partnerships with industry to ensure Chips Act investments achieve long-term goals.
- Advanced packaging R&D funding opportunities.
- Global semiconductor industry collaboration and government support.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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Françoise von Trapp and AJ Incorvaia discuss the evolution of EDA tools for 3D integration and design tools for 3D ICs and packaging. They talk about the need for real-time 3D visualization and automation capabilities to enable the design and manufacturing of complex 3D ICs. They also highlighted the growing importance of digital twin technology in the semiconductor industry and the challenges of designing and optimizing 3D ICs, including the need for concurrent design across multiple disciplines.
You'll learn about:
- Evolution of semiconductor packaging from wire bond to heterogeneous integration and 3D stacking
- 3D IC design tools and their evolution
- Digital twins, chiplet architectures, and 3D integration processes in semiconductor design
- Innovator 3D IC - a new product " for faster, more predictable chip design
- Siemens' new 3D IC design platform for concurrent design and optimization.
- How design teams can take advantage of the digital twin and predictive analysis capabilities in Innovator 3D IC.
Learn more about Innovator 3D IC
Contact AJ Incorvaia on LinkedIn
Siemens EDA
Siemens' EDA software helps you turn today's ideas into the sustainable products of the future.
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In this episode, Françoise von Trapp speaks with Christine King, the world’s first woman CEO of a semiconductor company, about her journey from near destitution to success in a male-dominated industry. Christine recently published a memoir about her journey, called Breaking Through the Silicon Ceiling, which details her journey and provides insights on work-life balance at IBM and beyond.
Christine talks about how she overcame adversity and stumbled into engineering and entrepreneurship. She shares stories of how she made her way up the IBM corporate ladder, overcoming challenges such as gender bias and roadblocks from male colleagues.
You’ll learn about her 12 lessons for success, the importance of mentorship, networking, and sponsorship, and the need for individuals to advocate for themselves and support each other in their careers.
Christine King’s book, Breaking Through the Silicon Ceiling, is available here on Amazon and Barnes and Noble.
Connect with Christine King on LinkedIn.
Correction: the interview states that the book was released on July 4, 2024. But its actual release date was June 28, 2024.
How to Start a Podcast Guide: The Complete Guide
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Saxony, Germany, has a strong potential to become a global semiconductor location due to its long history in traditional industries, technological base, vast talent pool, strategic location, and investment in education and new talent.
In this episode, Françoise von Trapp speaks with Andreas Lippert, of Saxony Trade and Invest, and Jan Klinger, of Fabmatics, about the region's unique ecosystem for microelectronics, government co-funding, and innovation.
You'll learn about:
- Saxony's history in innovation and competitiveness, and its impact on developing strong industrial sectors.
- Saxony's microelectronics cluster and its growth potential
- Germany's commitment to sustainability in the semiconductor industry, and how automating legacy fabs provides environmental benefits.
- How Saxony is attracting skilled workers and employees, particularly women, by offering affordable housing, childcare, and education.
- Saxony's strengths in microelectronics and automation make it a promising location for the semiconductor industry.
Contact Our Guests on LinkedIn
- Andreas Lippert, Saxony Trade and Invest
- Jan Klinger, Fabmatics
Saxony Trade and Invest
Saxony Trade & Invest is the public economic development agency of the Free State of Saxony, Germany
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Françoise von Trapp talks with ECTC 2024 General Chair, Karlheinz Bock and Program Chair, Michael Mayer about highlights and key takeaways from the 2024 IEEE Electronic Component Technology Conference. (ECTC 2024).
Bock and Mayer discussed the growth of ECTC 2024, and how focusing on strategic decisions such as changing the format and increasing the exhibition space helped organizers achieve record attendance. They also describe the volunteering opportunities and the pathway to leadership it provides. They shared their own experiences and the impact ECTC has had on their careers.
From the event itself, you'll learn about the importance of packaging technology and collaboration between chip and packaging communities to meet the high bandwidth requirements of AI applications. You'll also learn about advancements in hybrid bonding, metrology, and the impact of geopolitics in electronics packaging.
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This episode features conversations at ECTC 2024 with 11 of 3D InCites community members. You’ll learn about their perspectives on the hottest topics of the times such as thermal management and power issues for AI devices, and glass core substrates versus organic substrates. You’ll also learn about their latest technology advancements key takeaways from ECTC 2024.
Guests include
- Vikas Gupta and Mark Gerber of ASE Group
- Rao Bonda and Nathan Whitchurch of Amkor Technologies
- Eelco Bergman and Bart Deprospo of Saras Micro Devices
- Simon McElrea of LQDX
- Rama Pulligada and Alex Smith, of Brewer Science
- Bob Patti of NHanced Semiconductors
- John Lannon of Micross
- Bob Chylak of Kulicke & Soffa
- Tony Gueli and Venkata Mokkapati of AT&S
- Kuldip Johal, MKS-Atotech
- Joel Scutchfield, Koh Young A
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Recorded live at the 2024 Electronic Component Technology Conference, this episode features conversations Francoise von Trapp has with Keynote Speaker Keren Bergman, Columbia University and co-founder of Xscape Photonics, and Chet Lennox, of KLA.
Bergman explains the potential of photonics in AI applications to improve energy efficiency and bandwidth. You’ll learn about the limitations of current photonics technology in data centers and proposes a new generation of integrated photonics and silicon to overcome these limitations. You’ll also learn about the development of unique laser technologies for energy efficiency and the latest advancements in optical communication technologies, including full-wafer fabrication and wafer-scale probe technology.
Learn more about Xscape Photonics.
Chet Lenox talks about the growing importance of metrology and inspection in advanced packaging processes. He shares highlights of an ECTC special session, such as the importance of including process control in the Heterogeneous Integration Roadmap, and a technology track on metrology and inspection in future ECTC programs.
You’ll learn why In-line metrology is crucial for controlling processes, ensuring defect-free surfaces, and reducing variability. Quality and yield are key concerns, and more inspection and metrology are needed in the early stages of R&D to ensure success.
Contact Our Speakers on Linkedin:
· Keren Bergman, Ph.D, Professor at Columbia University
· Chet Lenox, Fellow, KLA
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In this preview episode for SEMICON West 2024, Françoise von Trapp and SEMI America’s President Joe Stokunas talk about SEMICON West's Past, Present, and Future.
The discussion emphasizes the need for collaboration in the semiconductor industry and the important role SEMI plays in supporting the interests of its global members.
Joe updates listeners on semiconductor industry growth and challenges, including sustainability, workforce development, and supply chain risks. He also shares updates on investment opportunities in the US industry, particularly opportunities in New York and Arizona.
You’ll learn about the speaker line-up for the two-day CEO Summit during SEMICON West, which focuses on investment in the U.S. semiconductor industry on day one, and global opportunities on Wednesday. You’ll also hear about the special features and numerous networking opportunities scattered throughout the week.
The episode concludes with a sneak preview of SEMICON West 2025 in Phoenix, highlighting its key features and networking opportunities. You’ll also learn about the importance of community, industry, and government collaboration to make the move to Phoenix successful.
To learn more and register for SEMICON West, visit the website.
How to Start a Podcast Guide: The Complete Guide
Learn how to plan, record, and launch your podcast with this illustrated guide.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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Glass has long been explored as an alternative substrate material to organic laminates and silicon. As high-performance computing and chiplets HPC push the boundaries of existing technology, they are demanding innovative packaging solutions, beginning with innovative substrate materials. This is paving the way for glass.
In this episode, Françoise von Trapp and Richard Noack discuss the highlights and takeaways from the recent webinar, Evolving HPC and Chiplet Packaging with Glass, and dive deeper into the motivation and trends that are bringing glass to the forefront.
They talk about the need for collaboration across the glass ecosystem and issue a call to action for downstream metrology companies to collaborate on developing solutions for measuring through transparent materials.
You’ll learn about the challenges of integrating glass into semiconductor production, such as the lack of reliability data, metrology processes, aspect ratio issues, metallization, and standardization.
You’ll also learn about the benefits of LPKF’s semiconductor manufacturing process, including adaptability, low to high-volume sampling, and a flexible process that can be tuned to meet industry needs.
LPKF Laser & Electronics
A leading provider of laser manufacturing solutions for advanced semiconductor packaging and more.
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This episode features the winners of this year’s 3D InCites Awards. These included five technology enablement awards, one sustainability award, the Adele Hars Award for DEI, and an award for Best Place to Work.
Nils Anspach, of LPKF & Laser Electronics, explains the company’s laser-based deep etching technology for glass substrates in heterogeneous integration, and how it solves the challenges of forming interconnects through glass substrates.
Dave Taraci, of Carl Zeiss Microscopy, explains how advanced microscopy techniques address the challenge of analyzing mixed material devices such as chiplets and heterogeneous integration packages in microelectronics.
Ken MacWilliams, of Multibeam, addresses the challenges of chiplet communication with large interposers and high-density interconnects.
Debbie Claire Sanchez of ERS Electronic, GmbH, talks about the company’s culture steeped in diversity, equity, inclusion and belonging.
Charles Woychik, of NHanced Semiconductors, describes how Bob Patti’s leadership and culture of caring at NHanced Technology has created a positive work environment and successful company.
Craig Bishop of Deca talks about the latest chapter of the Adaptive Patterning story. Adaptive Pad Stacks are a continuation of Adaptive Patterning, addressing misalignment issues in large-scale interposers.
Vikram Turkani, of PulseForge, discusses how ever-thinning wafers used in 3D stacking called for new solutions for temporary bond/debond processes.
EV Group
EV Groups supplies high-volume equipment and process solutions for semiconductor manufacturing.
KLA, SPTS Division
KLA provides semiconductor equipment for metrology, inspection, wafer processing, and more.
ASE Group
ASE plays a significant role in the development of the world’s most innovative electronics.
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This episode was recorded live at the IMAPS Device Packaging Conference – helping celebrate the event’s 20th year. The record turnout included many of our 3D InCites Community members. Françoise von Trapp spoke with several of them who were exhibiting and presenting, and in some cases, simply attending.
Alex Ospina of ACM Research discussed the latest technologies in wafer-level packaging, and the company’s focus on developing novel IP technologies to address industry challenges. You’ll hear about the company’s new vacuum cleaning tool designed to remove flux from bonds in smaller chiplets. You’ll also learn about the company’s approach to reducing its environmental impact.
Tim Olson, of Deca, shares big news about the company’s collaboration with ASU to create an open lab for innovation for innovation, licensing its M-Series and Adaptive Patterning technology, and working with ASU to outfit a fab with unique equipment.
Laura Mirkarimi and Oliver Zhao, of Adeia, explain the important role optical interferometry plays in atomic-level hybrid bonding. Zhao explains how they are using AI-powered neural networks to identify defects in the hybrid bonding process, with a focus on categorizing defects based on their relevance to certain process steps.
Manuela Junghähnel, of Fraunhofer IZM-ASSID, explains her new role taking over the leadership of IZM-ASSID, from Jürgen Wolf. She talks about learning the pilot scale to the production line created by Wolf. She also explains the relationship from the parent IZM and IZM ASSID.
Brian Riley, of QP Technologies, shares a history of advanced packaging technologies, and the company. He describes QPs' proprietary process for flip chip packages, the use of open mold plastic packages, and overmold QFNs.
Justin Locke, of Siemens EDA discusses innovations in functional verification of 3D Heterogeneous integration connectivity. He explains about the importance of formal verification in the design process, highlighting its ability to catch errors early on and prevent physical implementation issues.
Peter Cronin, of MRSI Mycronic talks about new technologies and interconnects in optical packaging, highlighting the need for active alignment tools. He introduces the Active Aligner.
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This episode was recorded live at IMAPS DPC, where the Spring version of the Global Business Council focused on Geopolitics Fueling the Repatriation of the Semiconductor Ecosystem. To get the complete picture of the collaboration happening, Françoise von Trapp speaks with representatives of the government, industry, and academia.
Dan Berger, National Advanced Packaging Manufacturing Program (NAPMP), explains how CHIPS Acts monies are being used to address gaps like advanced packaging and substrate manufacturing, to help revitalize the US semiconductor industry. The focus is on developing domestic manufacturing teams for U.S. leadership in microelectronics, with global collaboration and security in mind. He discusses the importance of advanced packaging roadmaps aimed at scaling down feature sizes, eliminating interposers and integrating chiplets directly onto substrates.
Zachary Holman, of Arizona State University, discusses how ASU’s Fulton School of Engineering is working to advance the college’s research impact in areas such as health, climate, and national security through partnerships with government and industry investments. He highlights ASU’s focus on extending the advanced packaging capabilities of its MacrotTechnology Works (MTW) fab, which allows for larger-scale packaging tools and pilot-to-fab gap closure.
Holman emphasized the importance of providing hands-on experience with state-of-the-art tools and materials for students. This will help provide a skilled workforce that can operate and maintain the latest equipment. Holman also discussed how ASU is building a platform to democratize innovation by providing access to R&D capabilities for startups and small businesses.
Mark Litecky, of Skywater, highlights the need for secure supply chain management and proprietary technology management in the U.S. semiconductor industry. He also stressed the importance of having global capabilities and secure supply chain management in the US, while avoiding duplication in different regions.
Litecky also highlighted workforce development, emphasizing the need for more people to understand the value of the field and the various career paths available.
Contact the Panelists on LinkedIn
- Dan Berger, Associate Director, NAPMP
- Zachary Holman, Vice Dean, Arizona State University
- Mark Litecky, Chief Revenue Officer, Skywater
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This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging.
Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company, IBM and Hemanth Dhavaleswarapu of AMD, about chiplet application drivers, such as artificial intelligence. She then talks to Pooya Tadeyon, of Intel, to find out why we are moving to advanced packaging, and particularly chiplet architectures, to enable the future of Moore’s law.
You’ll learn about:
- Chiplets architectures for high-performance applications
- How chiplets can enable foundational AI models that can be applied to various business use cases
- Challenges in chiplet design and test
- The importance of open interface standards
Contact our guests on LinkedIn:
- Arvind Kumar, IBM
- Hemanth Dhavaleswarapu, AMD
- Pooya Tadeyon, Intel
Next week, our coverage of IMAPS continues, as we bring you conversations from the Global Business Council, which focused on repatriating the US microelectronics industry. You’ll get perspectives from academia, the government, and industry.
IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
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In this episode, recorded live at SEMI ISS Europe, Françoise von Trapp hands over the mic to SEMI Europe President, Laith Altimime, who leads a discussion on the European chip industry’s growth and challenges, and whether the European Chips Act will strengthen Europe towards its 20% vision goal. Panelists include:
- Manfred Horstmann, GM and SVP GlobalFoundries Dresden
- Thomas Richter, Senior Vice President & Managing Director, Infineon Technologies Dresden
- Juergen Schmidt, VP Semiconductor Manufacturing Frontend, Robert Bosch GmbH
- Andreas Lippert, Head of Department (Vice President) Acquisition, Inward Investment, Saxony Economic Development Corporation
The discussion broadened to include the chip industry’s role in sustainability and talent development. Reducing Scope 3 emissions and addressing supply chain challenges are key topics.
From this conversation, you’ll discover:
- Lessons learned from COVID for creating a resilient supply chain
- Europe's value proposition for investment in the semiconductor industry
- Germany’s strengths and unique selling points
- How to address the talent crisis
- Cost management in the semiconductor industry
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
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This week’s episode was recorded at ISS Europe, in Vienna, where the European semiconductor industries key strategists gathered to plan the path forward and forge a sustainable path to securing 20% of the global semiconductor market. One of the main topics continues to be building a resilient semiconductor supply chain.
In the first segment of the episode, Françoise speaks with Sandrine Bronner, VP of supply chain, in the semiconductor division of Edwards Vacuum. They discuss her approach to creating end-to-end semiconductor supply chain resilience.
You’ll learn how to adapt to a changing environment through a positive approach that emphasizes risk management and supplier assessment. You’ll also learn about the benefits of diversifying suppliers of critical components, and how designing in multiple sources can help create resilience in your supply chain.
In the second segment of the episode, Françoise hands over the mic to Michael Alexander, of Roland Berger, who led the Panel discussion: Powering Europe's Future - The Impact of Geopolitics on Energy. Panelists include:
- Katharina Westrich, Global Head of Vertical Management Semiconductor, Digital Industries, Siemens AG
- Yvonne Keil, Director Global Procurement, GlobalFoundries
- Nicolas Leterrier, Semiconductor Sustainability Business Leader, Schneider Electric
The group discusses the energy industry’s supply shortage and geopolitical effects, particularly its impact on the European sector of the semiconductor supply chain. You’ll learn about the shift from centralized to distributed energy systems and the potential for AI to improve energy efficiency and sustainability. You’ll also learn about the need for green energy in the semiconductor industry, and the impact it may have on cost.
The conversation shifts to the need to invest in sustainability improvement and upgrades to legacy fabs, and the importance of being willing to pay a premium for green products.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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In honor of International Women’s Day (IWD 2024), 3D InCites partnered with SEMI ISS to bring you this episode on how companies are fostering and implementing DEIB and allyship into their corporate culture.
Françoise von Trapp speaks with Nigel Wenden, CEO of WGNSTAR, Laura Matz, CTO of Merck KGAA Darmstadt Germany; and Mike Rosa, CMO, Onto Innovation. They discuss their respective company’s success stories with DEIB and their efforts to foster allyship in the workplace.
You’ll learn about some startling statistics about women and underrepresented minorities (URMs) in the technology industry, and the goals that WGNSTAR, Merck KGAA Darmstadt Germany, and Onto Innovation have set for themselves to address these numbers.
The three speakers talk about how a culture of DEIB will positively impact the future of technology. They also explain their respective company’s strategies in using DEIB to address the talent shortage in the semiconductor industry.
The speakers also field call-in questions from listeners about fostering a culture of inclusion and building the semiconductor workforce.
- Shari Liss, of SEMI Foundation asks how companies can foster a workplace culture that not only attracts diverse talent, but also ensures an inclusive environment where everyone, regard feels valued, respected, and empowered to deliver their best.
- Cath Rossi-Roos of Roos Instruments, asks about the willingness of companies to subsidize education of the next generation of engineers to solve the workforce shortage.
- Joy Racowski, of EMD Electronics asks how we can better frame allyship as an ongoing effort.
Caryn Veach, of Kokusai Semiconductor Equipment Corporation asks for advice on creating more male allies on the engineering staff. She also wants to know how they can make women engineers in the field feel part of the company when they aren’t supported by a local office.
Connect with our speakers on LinkedIn:
- Nigel Wenden, CEO, WGNSTAR
- Laura Matz, Merck KGAA Darmstadt, Germany and Athinia
- Mike Rosa, Onto Innovation
WGNSTAR, Inc.
WGNSTAR is the leading workforce services and semiconductor asset lifecycle management partner.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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The International Microelectronics and Packaging Society’s Device Packaging Conference (IMAPS DPC) celebrates its 20th year this year. The conference takes place March 19-21, in Fountain Hills, AZ.
In this episode, Françoise von Trapp speaks with Scott Hayes, General Chair, IMAPS DPC, and Amy Lujan, General Chair-Elect of IMAPS DPC about the history of this event, and what sets it apart from IMAPS annual Symposium.
This year’s event will focus on heterogeneous integration and growth drivers for packaging, with speakers from companies like AMD, Intel, Facebook Reality Labs, and more. The General Business Council session will focus on Chips for America funding, doing business in China, and the significant growth of the U.S. semiconductor supply chain, particularly in Phoenix, AZ.
You’ll learn about the key applications driving technology advancements in autonomous vehicles, radar, and high-performance computing. During the panel discussion, you’ll learn about the next killer app and its potential impact of the semiconductor industry.
Hayes and Lujan also discuss all the networking opportunities and fund raising activities that you can take part in.
Contact our Guests on LinkedIn
Scott Hayes, Technical Director, NXP Semiconductors
Amy Lujan, Vice President, SavanSys
Registration for IMAPS DPC can be found here. You can also register for the Golf Tournament and Hike for DEI at the same time.
If you’d like to participate in the 3D InCites Member and Guest Event – the Backyard Olympics, sign up here. There is no charge to participate, and space is limited.
International Women’s Day is March 8th, and to celebrate, we’re partnering with SEMI to bring you an episode on how companies are fostering and implementing DEIB and allyship in their corporate culture. We’re looking for a few mentor/mentee pairs who are interested in sharing there story, as part of the episode. If you’d like to participate, drop me a line at francoise@3DinCites.com. Interviews must take place by February 23 to be included.
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
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In this episode, Françoise von Trapp and Jean Christophe Eloy of Yole Group, discuss the future of advanced packaging and chiplets in the semiconductor industry, and how these technologies will revolutionize the industry.
Get ready for a deep dive into a technology discussion. From Jean-Christophe, you’ll learn how chiplets differ from multichip modules (MCM) and systems-in-package (SiP). He highlights the benefits of chiplets, including optimizing different nodes for specific functions. You’ll also learn about important enabling technologies that ensure the fast and robust connections that hallmark chiplets.
Françoise and Jean-Christophe also discuss the key applications using chiplets for their cost-savings and sustainability benefits.
In a bonus interview with Jan Vardaman of TechSearch International, Francoise and Jan discuss how chiplets provide the power efficiency needed for next-generation semiconductor devices.
Contact Our Speakers on LinkedIn:
- Jean-Christophe Eloy, President and CEO, Yole Group
- E. Jan Vardaman, President, Techsearch International
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Françoise von Trapp and SEMI Europe's Laithe Altimime discuss the status of the European Chips Act, which aims to double Europe's market share in global manufacturing by 2030 and increase chip production by 20%.
The discussion focuses on European industry growth and resilience, and the importance of collaboration. They also discuss ISS Europe which takes place in Vienna, March 6-8, 2024, and how its content differs from SEMI ISS.
This year's theme will focus on the microelectronics supply chain, sustainability, and workforce development.
You'll learn about the importance of Europe's Chips Act in maintaining competitiveness and increasing strategic positioning in the global value chain.
You'll also better understand the need for a more resilient supply chain, particularly in light of geopolitical events and the chip shortage.
You'll learn, in detail, about the workforce development challenges facing the entire semiconductor industry, and the approach the EU is taking to address them.
To learn more about ISS Europe 2024, and to register, visit the website.
Contact Laith Altimime on LinkedIn.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
At SEMI ISS, Paul Triolo, Albright Stonebridge Group (ASG) delivered a presentation on the geopolitical headwinds impacting the semiconductor industry in 2024. He explains challenges of industrial policies, export controls, and supply chain perturbations.
Triolo is Senior Vice President for China and Technology Policy Lead at ASG, where he is also an Associate Partner. He advises clients in technology, financial services, and other sectors as they navigate complex political and regulatory matters in the US, China, the European Union, India, and around the world.
In this episode, Françoise von Trapp talks with Triolo about why understanding the geopolitical climate is critical for industry leaders to develop successful strategies. They discuss how geopolitics is disrupting the $5 Trillion information and communication technology sector.
You’ll learn about:
- The US’s “Carrots and Sticks” approach to semiconductors.
- The potential outcome from regional semiconductor manufacturing silos being created by the various CHIPS Acts.
- What’s happening with China and Taiwan
- India’s efforts in building a semiconductor infrastructure and ecosystem
Follow Paul Triolo on X (formerly Twitter) @PSTAsiatech
Or connect with him on LinkedIn:
- Paul Triolo, Albright Stonebridge Group
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
For the first few episodes of Season 4 of the 3D InCites Podcast, Françoise von Trapp headed to the SEMI Industry Strategy Symposium, (ISS) where semiconductor industry executives gather to gain and share insight on where the semiconductor industry is headed, and how they can work together to get there.
Economic trends, industry markets, and growth drivers are a critical part of the discussion, so in this first episode, Francoise speaks with members of SEMI’s Market Intelligence team (MIT), Clark Tseng and Inna Skvortsova to get some of the details.
We start with a recap of what happened with the semiconductor markets in 2023, and what MIT expects to see in 2024 as the industry looks to recover from a global economic downturn.
Skvortsova shares key takeaways from her presentation on materials supply and demand growth outlook. You’ll learn what’s driving growth in this industry, and priorities being set for the year.
From Tseng, you’ll learn how geopolitics and the Chips Acts impact the industry. You’ll also learn about the role MIT plays in supporting the industry through its ups and downs.
Learn more about SEMI's Market Intelligence Team
Contact Our Panelists on LinkedIn
- Clark Tseng, Sr. Director, SEMI Market Intelligence Team
- Inna Skvortsova, Market Research Analyst in the SEMI Market Intelligence Team
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Once again, Cassandra Melvin, SEMI Europe, takes over the mike from Françoise von Trapp to lead a panel discussion on the Future of Work in the semiconductor industry. We join the panel discussion in progress, as it was part of a session on the Future of Work that took place in Munich during SEMICON Europa.
You’ll hear from Flemming Kehr, the Global Practice Lead, Sustainability, for Mercuri Urval, Christine Pelissier, General Manager of Customer Center EMEA at Edwards, and Emma Derby, Human Resources Director at Vodafone. They discuss what current and future leaders need to embrace to be successful.
Listen and learn about:
- What makes a good leader
- How the leadership paradigm shifted
- Gaps in current leadership styles or styles that may prevent semiconductor industry growth
- How to develop the leaders of tomorrow
- What qualities are most important for tomorrow’s leaders
- The impact of diversity, equity, inclusion and belonging in leadership
- And more….
Find the Speakers on LinkedIN
· Cassandra Melvin, SEMI
· Flemming Kehr, Mercuri Urval
· Christine Pelissier, Edwards
· Emma Derby, Vodafone
This wraps up season 3 of the 3D InCite podcast! We’ll take a short break but will be back with all new episodes in 2024. That should give you time to catch up on all the episodes you’ve missed. In the meantime, Happy Holidays from all of us at 3D InCites, to all of you!
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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In this episode, which was recorded live at SEMICON Europa 2023, Françoise hands over the mike to Cassandra Melvin, Senior Director of Business Development and Operations at SEMI. She led the session during the Fab Manager Forum on How To Cultivate the Workforce of Tomorrow and moderated a panel discussion on Achieving EU Ambitions Through Successful Recruitment and Retention. It highlights the instrumental role of universities and governments in supporting the industry's growth.
Panelists include Richard Goddard, Global Practice Lead for technology Mercuri Urval. Michelle Williams Vaden Deputy Director of SEMI Foundation, and Bernie Carpraro. EU talent development program manager at Intel R&D in Ireland.
These experts dive deep into very complex challenges facing the industry to alleviate the talent shortage. Questions they address include:
- How Europe’s talent shortage compares with global players, highlighting challenges and opportunities.
- Ways to address the skills gap in the semiconductor industry
- The need to develop an infrastructure for new investments in the workforce
- The importance of retaining talent
- Career and professional development
- Maintaining work-life balance
- The role of diversity, equity, and inclusion in the semiconductor industry
They also share some solutions they've implemented at their own companies.
Listen in to learn what your organizations can do now to start building the talent pipeline of the future.
Find Speakers on LinkedIn:
- Cassandra Melvin, SEMI
- Richard Goddard, Mercuri Urval
- Michelle Williams Vaden, SEMI
- Bernie Carpraro, Intel
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this episode, Françoise von Trapp hands over the mike to imec’s Katrien Marent, who hosted imec’s ITF Towards NetZero at SEMICON Europa. She introduces a panel discussion on Collaborative Strategies and Practical Solutions Toward a More Sustainable Semiconductors Future.
The panel kicks off by polling the audience on what they think are the most pressing issues facing the semiconductor industry as it endeavors to reduce its carbon footprint while simultaneously growing to meet the demands of semiconductor devices, many of which will help other industries on their paths to sustainability.
The panel tackles some grave and difficult questions and offers some useful advice on how to collaborate as an industry and the importance of individual efforts made by companies. What is the role of innovation in achieving these goals? Do we need to have standardization around data? Do we need to report more transparency?
In some places, you’ll hear instances of the audience polling and the results of those informing the questions asked by panel moderator, Jan-Hinnerk Mohr, Managing Director & Partner, Boston Consulting Group.
Panelists
- Emily Gallagher, Principal Member of Technical Staff, imec
- Jean-Marc Girard, CTO and SVP of Manufacturing Technologies, Air Liquide Advanced Materials
- Benjamin Sokolowski, Managing Director & VP Government Affairs EMEA, Qualcomm
- Bill Lussier, Senior Vice President Regional Sales & Deputy GM, Tokyo Electron Europe Ltd.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
This episode features conversations with 3D InCites members who attended or exhibited at SEMICON Europa 2023, which took place in Munich, Germany from November 14-17, 2023.
The topic of the week was Shaping a Sustainable $1 Trillion Era. Members weigh in on what their companies are doing to support this effort. They also discuss their impression of the show, what they were showcasing, and their latest news.
Peter Dijkstra, Trymax Semiconductor, updates us on activities at Trymax USA and shares news of his participation at a Dutch and Flemish delegation in Phoenix Arizona in early December.
Mike Motherway, Cimetrix by PDF Solutions, talks about the role cloud-native data tools for AI applications play in global fab expansion.
Debbie Claire Sanchez at ERS Electronic explains the company’s partnership with PulseForge to bring photonic debonding to their product portfolio as an equipment integrator of this technology.
David Wang and Jim Straus of ACM Research share the news of the company’s expansions in Asia as well as the Grand Opening of its new office in Portland, Oregon.
Hans Peters and Emerald Grieg, PTW Group, introduce a new tool line, SpinTec, established to renew and restore legacy SEZ single wet wafer tools.
Abul Lateef, PlasmaTherm, talks about the company’s latest acquisition of Milan-based Thin Film Equipment, to complete PlasmaTherm’s sputtering and PVD portfolio, and put them near significant customers in Italy.
Neil O’Brien, Finetech, talks about the growing need for high-accuracy die-bonders, and how that’s driving a need for full production tools based on its tabletop machines originally developed for academia.
Harald Eppinger, Koh Young Europe, explains how the company’s 3D optical measurement tools deliver precise data that helps to visualize advanced packaging processes to improve quality and reduce failures.
Dieter Rathai, DR Yield, shares some feedback from the Fab Manager Forum and how he uses that information to inform his business and improve his company’s product.
Spencer Wall, Jeroen Haex, and Michael Murray, of DSV Solutions explain the role a logistics service provider can play in shaping a sustainable $Trillion Era through inventory and supply chain strategies, as well as a commitment to certified alternative fuels for all modes of transport.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
This episode was recorded live from Munich, as the official podcast of SEMICON Europa. The theme of this year’s event is Shaping a Sustainable $1 Trillion Era. Françoise von Trapp talks with some of the keynote speakers about the roles their companies play in achieving this goal. talking with some of the Keynote speakers about the roles their company plays in this task.
From Paul de Bot of TSMC Europe, you’ll learn about the company’s R&D investment in continued CMOS scaling and 3D integration, as well as a $32B investment worldwide in capacity expansion to support Moore’s Law, specialty technologies for the automotive market, and advanced packaging. De Bot explains the different strategies used in Europe, including a partnership with Bosch, Infineon, and NXP, and addresses the company’s commitment to green manufacturing and sustainability.
Imec’s Luc Van Den hove explains what he means by “polycrisis” – a word he used to describe the multitude of challenges facing the world, with a specific focus on climate change, and how imec is working to solve these challenges using AI and data analysis. He also talks about the conundrum of using semiconductors to solve climate change, while trying to half our own carbon footprint. Imec is bringing together the entire ecosystem to address these challenges together.
Rebecca Dobson, of our member company, Cadence explains the complexities of generative AI, and how it will be a key enabler of growth for the European microelectronics industry. You’ll learn how generative AI impacts team productivity and design team structure, and how it can be used to help us reach our sustainability goals, as well as how it can be used to increase productivity.
Lihong Cao, of ASE Group, talks about the challenges the advanced packaging sector is facing as we enter the chiplet era and how to address them. You’ll learn about the importance of developing an integrated chiplet design ecosystem. You’ll also learn how heterogeneous integration can help solve industry challenges in a sustainable way.
Contact our Speakers on LinkedIn:
· Paul de Bot, General Manager, EMEA at TSMC Europe
· Luc Van Den hove, President and CEO at imec
· Rebecca Dobson, Corporate VP, EMEA, Cadence
Lihong Cao, Senior Director, Engineering/Technical Marketing, ASE Group
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this episode, Françoise von Trapp talks with AT&S’s Markus Leitgeb and Tony Gueli, about the complex world of IC substrates for advanced microelectronics. The conversation focuses on technical and commercial challenges, and how they can be overcome when you work with the right substrate partners.
You’ll learn about the driving applications for advanced IC substrates, including data storage, data speed, and the automotive industry. You’ll hear about the challenges of keeping up with advanced node technology and the need for reliable interconnects in the assembly industry.
Other topics include the oversupply situation in the substrate industry, the importance of maintaining R&D activities, the lack of substrate manufacturing in the US, and the impact of geopolitics on the supply chain.
Connect with our speakers on LinkedIn:
- Markus Leitgeb, R&D Manager
- Tony Gueli, Key Account Director
AT&S
AT&S is a global manufacturer of high-end PCBs and IC substrates for microelectronics applications.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
This Member Spotlight episode was recorded live at the IMAPS International Symposium. Françoise von Trapp speaks with community members who attended and exhibited about what they were showcasing, and what they learned.
John Lannon and Rex Anderson, Micross Components, helped demystify the multiple government funding efforts to onshore advanced packaging.
Casey Krawiec of StratEdge Corporation talks about the company’s role in delivering packaging technology for high-frequency applications.
Brian Schmaltz, Namics Corporation, talks about the company’s efforts to eliminate harmful PFAS chemicals from their portfolio of products.
Vahid Akhavan, PulseForge explains how the company’s core competency — high-powered photonic-based pulsed light technology — is being used for temporary bond/debond processes.
Ajinomoto Fine Techno’s Habib Hichri talked about developments beyond its core ABF (Ajinomoto Buil-up Film) to meet the needs of next-generation thin and large packages.
QP Technologies' CEO Dick Otte, explains why QP has decided to NOT pursue CHIPS for America Act funding.
Paul Ballentine, the co-founder of Mosaic Microsystems, talked about his involvement with the U.S. Government in building out the advanced packaging cluster in Rochester New York.
Peter Cronin, MRSI Systems, talked about the company’s latest foray into die-bonding tools – the MRSI 705 HF.
Onto Innovation’s Keith Best discussed the implications of Intel’s announcement that they’ve developed a glass core substrate technology for next-generation advanced packaging.
Read the accompanying blog post here.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this panel discussion, recorded live at the International Microelectronics and Packaging Society International Symposium, Françoise hands over the mike to Dan Krueger, Honeywell, as he moderates a panel on Diversity in Packaging, Past, Present, and Future. Don’t miss this lively town hall discussion on many important topics in today’s challenging work environment, including the important differences between equity and equality in the workplace.
You’ll hear representatives of different generations of IMAPS leadership discuss their experiences as women making careers in the microelectronics industry, the diverse perspectives that each generation experienced, the progress they see in the industry, and suggestions for work left to be done and how to achieve it. They also provide tips on how to improve DEI at companies going forward, the importance of mentorship, and how to be better allies to your peers.
Moderated by Daniel Krueger, Panelists include:
· Beth Keser, Zero ASIC
· Erica Folk, Northrop Grumman
· Robin Davis, Deca
· Amy Lujan, Savansys
· Susan Trulli, Retired from Raytheon
Next week, we wrap up our coverage of the IMAPS Symposium with our Member Spotlight episode, interviewing 3D InCites Community Members about what they showcased and what they learned at the event.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In a time when unprecedented industry growth is expected, the microelectronics industry is in the midst of a workforce shortage. To address this, the International Microelectronics and Packaging Society – IMAPS – is increasing its efforts to raise awareness about this rewarding industry through partnerships with universities and high schools.
Simultaneously, companies that serve the microelectronics industry are ramping up internship programs and coming up with new approaches to recruitment to help attract and retain young talent.
In this episode, recorded live at the IMAPS International Symposium on October 4, 2023, Françoise sits down with three high school students from the Carlsbad Highschool Robotics Clubs, Demetrios Dresios, Vaselios Dresios, and Kendra Ammon, who attended the event to learn more about the industry.
They talk about what got them interested in robotics, how it has shaped their ideas about careers, and what they want to study. They also talk about what they learned at the symposium.
Next, Françoise interviews Roberta Foster-Smith and Gabriela Philips, of Nordson Electronics Solutions, about Gabriela’s experience in Nordson’s Commercial Leadership Development program.
Next week, on the 3D InCites podcast, Françoise hands over the mike to Dan Krueger, Honeywell, as he moderates a panel on Diversity in Packaging, Past, Present and Future. Don’t miss this lively town hall discussion on many important topics in today’s challenging work environment, including the important differences between equity and equality in the workplace.
Support the show
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
This episode was recorded live at the 2023 IMAPS International Symposium, where the week’s keynote talks focused on different aspects of heterogeneous integration, packaging technology for high-performance computing, and what’s driving these technologies. Françoise von Trapp speaks with three of the keynote speakers who addressed attendees including Kevin Anderson, of Qorvo; Jeffrey Burns, of IBM Research; and C.P. Hung of ASE Group.
From Kevin Anderson, you’ll hear about Qorvo’s involvement in DARPA’s SHIP Program, and its Advanced State-of-the-Art RF Semiconductor Packaging Center that won them the 2023 3D InCites Award for Device Manufacturer of the Year. You’ll get Qorvo’s back story in being a supplier of wireless products and its focus on compound semiconductors. You’ll also learn about the difference between the SHIP Program and the CHIPS for America Act, and the role Qorvo plays.
From Jeff Burns, you’ll get detailed education on AI, and Deep Learning. Using the development of image recognition as an example of how AI can surpass human capabilities, he explains the advantages of AI accelerators, and how IBM’s work in foundation models is democratizing AI applications. He also explains the role 3D heterogeneous integration and chiplet architectures in making this happen.
From CP Hung, you’ll get a history lesson on the different types of advanced packages that are available to solve different challenges presented by today’s applications. Specifically, you’ll learn about the needs of Electric Vehicles, and how heterogeneous integration is addressing these needs. You’ll also learn about ASE’s launch of its Integrated Design Ecosystem (IDE) a collaborative design toolset optimized to systematically boost advanced package architecture across the VIPack™ platform.
Contact Our Guests on Linkedin
- Kevin Anderson, Director, Integration Technology Research at Qorvo, Inc.
- Jeffrey Burns, Director, IBM Research AI Hardware Center at IBM
- CP Hung, VP of Corporate R&D, ASE Global
Next week, on the 3D InCites Podcast, Françoise interviews some special guests of IMAPS, members of Carlsbad Highschool’s Robotics Club. Listen and learn what is inspiring the next generation of microelectronics experts.
IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
SEMICON Europa 2023 is only six weeks away, and the 3D InCites podcast will once again be the Official Podcast Partner. There is an exciting lineup of topics and top-notch speakers, all focused on the main theme of shaping a sustainable $1T Era. And for the second time, following the great success of last year's premiere, the Belgian research technology organization, imec, is hosting its International Technology Forum (known as ITF) on the SEMICON Europa show floor.
In this episode, Françoise von Trapp speaks with Katrien Marent, CMO of imec, and Laith Altimime, President of SEMI Europe about Europe’s role in creating a diverse and inclusive workforce, as well as developing strategies to achieve the industry’s NETZERO goals worldwide.
You’ll hear about Marent and Altimime’s career paths, and how the industry has evolved into one with representation across many nationalities. You’ll learn about imec’s diverse culture, with 95 different nationalities represented, and the benefits of diversity in leadership and the need for developing future leaders in the industry.
You’ll also learn about the initiatives being taken to address these challenges, such as curriculum development, image campaigns, and role models.
Lastly, the trio shares what you can expect to learn at SEMICON Europa and ITF, which will focus on sustainability challenges in the semiconductor industry.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
As autonomous vehicles take to the roads, the jury is still out on the readiness of these vehicles in terms of safety. Technologies being used are still in nascent stages, and there is still work to be done before these vehicles can be operated in driverless mode.
In this episode, Françoise von Trapp sits down with Gulroz Singh, a renowned thought leader and expert in the automotive industry, specializing in the areas of autonomous driving safety, automotive functional safety, and semiconductor safety.
Listen in to learn about the challenges facing the autonomous vehicle industry in terms of safety, including the evolving vehicle architecture and the use of cloud-native technologies in safety-critical applications.
You’ll come away with a better understanding of potential safety and cybersecurity risks associated with over-the-air software updates for vehicles, and the need for robust safety and security mechanisms to prevent incidents from happening in the future.
You’ll also discover the challenges and opportunities presented by emerging technologies such as chiplet architectures, AI, advanced memory, and 5G in the automotive industry, and why there is a need for standardization in packaging and interconnects for chiplets to ensure compliance with automotive safety and cybersecurity standards.
About our Guest
Gulroz Singh is a certified professional in ISO 26262 and ISO 21434, two international standards for automotive safety. His passion for automotive innovation and safety is evident in his work, which can be found at www.gulrozsingh.com. Connect with Gulroz on Linkedin.
Join us next week on the 3D InCites Podcast, when I sit down with SEMI Europe’s Laith Altimime, and Imec’s Katrien Marent, to discuss Europe’s role in creating a $1T Semiconductor Industry.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
We've made changes to the 3D InCites Awards Program and the 2024 Yearbook! This recording of the recent 3D InCites 411 explains everything you need to know to participate in these programs.
In this information session and Q&A you'll learn about:
💡 The new 3D InCites Awards Format and Nomination Process
💡The 2024 Yearbook Opportunities and Schedules
💡New Offerings for 2024 including Webinars and Visits from the Queen
Find more information on Sponsorship, Advertising, and new opportunities, use the links below:
Yearbook Editorial and Advertising
3D InCites Awards Sponsorships
A Visit from the Queen of 3D
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Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
You are now listening to the 100th Episode of the 3D InCites Podcast! To celebrate, Françoise sits down with Erica Folk and Tarak Railkar, both representatives of the International Microelectronics and Packaging Society – also known as IMAPS. 3D InCites is the official Industry Partner of IMAPS and the Official podcast of the IMAPS Symposium.
In this episode, you’ll get a look behind the scenes of this largely volunteer-led organization, and the opportunities the Society provides its members. Folk, incoming IMAPS president, talks about the work her predecessor, Beth Keser, set in motion, particularly around workforce development, that she intends to keep moving forward during her two-year term.
As General Chair-Elect, Railkar leads the technical committee, and provides some insight on the latest drivers that inspire the topics addressed in the Keynote talks and technical program for this year's IMAPS International Symposium, which takes place October 2-5 in San Diego, CA.
He explains how attendees contribute to the topic selection through survey participation, what led to this year’s focus on Artificial Intelligence, and how it impacts the microelectronics industry. There's a Keynote talk dedicated AI, a professional development course, as well as a panel discussion.
Conversation also focuses on the DEI Panel discussion, as well as student participation, the growing popularity of poster sessions, networking opportunities, and how to take advantage of all that is available. You’ll also get some valuable tips on how to network effectively!
To learn more about the IMAPS Symposium, and register, visit the website.
Contact Our Guests
- Erica Folk, President-elect, IMAPS (Manager, MMIC and RFIC Design, Northrop Grumman)
- Tarak Railkar, General Chair-elect, IMAPS International Symposium (Principal Packaging Engineer / SMTS, Qorvo)
Next week, on the 3D InCites podcast, we’ll be bringing you the 3D InCites 411 – Ask me Anything, with me, Françoise von Trapp. I’ll be speaking about the changes coming for the 2024 3D InCites Awards, the 2024 Yearbook, and how your company can make the most of them. This will be a recording of a live event taking place on September 19. If you’re interested in attending the live event on Zoom, Register Here.
IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
The semiconductor industry is in an interesting position – on one side, the demand is there for it to become a $1T industry sometime in the next 7-10 years. But headwinds – including a current downturn, has many companies putting the brakes on spending. In this episode, Françoise von Trapp talks with Joe Cestari and Martijn Pierik, of Kiterocket, about why companies should think twice about cutting their marketing budget and what they can do to move up in a downturn.
You’ll learn about the cyclic nature of the semiconductor industry and the general philosophy behind why companies cut their budgets when facing a lull in revenue. You’ll also learn why that’s not necessarily the best business decision, and how investing in the health of your brand is critical to position your company for growth.
If you don’t have a choice and your marketing budget is cut, Pierik and Cestari offer tips on how best to approach prioritizing your marketing and communications activities.
Lastly, you’ll learn about Kiterocket’s PR-forward approach to marketing communications, and what sets the agency apart from others serving the semiconductor and microelectronics industries.
To learn more, visit www.kiterocket.com
Find Our Guests on LinkedIn
Martijn Pierik, Founder and Chair, Kiterocket
Joe Cestari, Executive Director, Kiterocket
Coming up Next....
Join us next week for a preview of the International Microelectronics and Packaging Society International Symposium. I’ll be speaking with Erica Folk, incoming IMAPS president, and members of the committee about what you can expect from this year’s event that takes place October 2nd to 5th in San Diego, CA.
Kiterocket
A global strategic marketing agency serving the semiconductor and sustainability industries.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the showBecome a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
This episode of the 3D InCites podcast was recorded live at SEMICON West. Françoise von Trapp speaks with Alex Wei and Omar Ma about the memory challenges facing the semiconductor industry, as AI and machine learning create a need for more advanced Flash Memory and DRAM.
As memory specialists who recently joined the UCIe Consortium, Winbond is helping to address integrating memory in chiplet architectures.
Listen in to learn about the difference between code storage and data storage, and why both are critical for supporting today’s advanced smart device cryptography needs. You’ll also learn about data labeling used in AI and machine learning applications. Lastly, you’ll learn about all the different memory solutions Winbond provides for these applications.
To learn more, visit www.winbond.com
Connect with the Speakers on LinkedIN
- Alex Wei, Marketing Director, Winbond Electronics
- Omar Ma, DRAM Marketing Manager at Winbond Electronics
Winbond Electronics
Specialists in high-performance memory for smart industrial and consumer applications.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the showBecome a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
This week’s episode dives deep into the world of X-ray inspection and its many uses in today’s high-density 3D heterogeneous integration technologies for semiconductor manufacturing. Françoise von Trapp speaks with subject matter expert, Chris Rand, of Nordson Test and Inspection.
You’ll learn the basics – how X-ray inspection is used in semiconductor manufacturing and how that has changed over the years. The challenges facing manufacturers as heterogeneous integration schemes become more advanced – with 3D stacking and chiplet architectures are also discussed.
You’ll also learn why achieving zero defects is so important for today’s semiconductor and microelectronics devices and the different strategies for achieving zero defects.
Lastly, you’ll learn about some solutions provided by Nordson Test and Inspections to help you execute those zero-defect strategies.
You can learn more about the new Quadra Pro at the Nordson Test & Inspection website.
Contact Our Guest on LinkedIN
- Christopher Rand, Product Line Manager at Nordson Test and Inspection
One Step Beyond Cyber
One Step Beyond Cyber, the ultimate IT and Cybersecurity Pod
Listen on: Apple Podcasts Spotify
Nordson Test and Inspection
Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the showBecome a sustaining member!
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
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This episode was recorded live at SEMICON West 2023, where one of the main topics of conversation was the importance of creating a collaborative supply chain. Françoise von Trapp speaks with Bruce Kim, CEO of SurplusGLOBAL, and team members Danny Kim and Rose Lee, about the critical role secondary equipment and parts play in this ecosystem.
You’ll learn about the status of the current global semiconductor legacy equipment and parts market and how it is being impacted by the current strain on the US and China relationship, as well as how it’s impacting semiconductor manufacturing as demand for devices continues to rise.
In response to this, SurplusGLOBAL is introducing its Global Parts Platform. You’ll find out what it is and how it’s satisfying a need in the semiconductor industry. Listen in as the SurplusGLOBAL team provides important details of how the platform is structured, and how you can benefit from participating in it.
Contact Our Guests on LinkedIn
Bruce Kim, CEO, SurplusGLOBAL
Daniel Kim, Managing Director, Global Parts Platform
Rose Lee, Marketing Manager, SuplusGLOBAL
SurplusGLOBAL
SurplusGLOBAL is one of the largest one-stop platforms for pre-owned semiconductor equipment.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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This episode was recorded live at IMAPS CHIPCon, where experts in heterogeneous integration and chiplet-enabled advanced packaging schemes gathered to address some of the semiconductor manufacturing industries most pressing technical and industry-related challenges.
Françoise von Trapp speaks with Scott Sikorski, of IBM who demystifies the complexities of the CHIPS Act, and the opportunities available for companies hoping to participate in R&D for advanced packaging. He also discusses the challenges of onshoring commercial advanced packaging.
She also interviews Amkor’s Mike Kelly and ASE Group’s Ou Li, two of the panelists who participated in the panel discussion moderated by Jan Vardaman. The panel addressed the question, Are Chiplets the Answer for AI, ML, and Photonic/co-packaged optics?
Kelly and Li share some of the key takeaways from the panel discussion, such as the challenges chiplet architectures address for AI, ML, and photonics/co-packaged optics, as well as outsourced semiconductor assembly and test service providers (OSATS) readiness for chiplet integration. They also talk about the availability of 3rd party chiplets, and help unravel the mysteries of the available chiplet interfaces, like the Universal Chiplet Interconnect Express (UCIe),
To learn more about takeaways from CHIPCon, you can read Françoise’s blog post here.
Contact Our Guests on LinkedIn
- Scott Sikorski, IBM
- Mike Kelly, Amkor Technology
- Ou Li, ASE Group
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Françoise von Trapp speaks with 3D InCites Member companies who exhibited and or attended SEMICON West 2023. She posed one main question, based on the show’s three key topic areas. What role do they play in helping the semiconductor industry succeed in becoming a $1T industry by 2030, how are they addressing the path to Net Zero, and how are they being impacted by the talent shortage?
- Franziska Peterson, Edwards talks about the company’s role in the Semiconductor Climate Consortium.
- Alan Weber, CImetrix by PDF Solutions talks about the adoption and use of standards and how it impacts KPIs.
- Paul Lindner. Dave Kirsch, and Garrett Oakes, EV Group, talk about what it means to win its 11th Triple Crown for TechInsights Customer Service Satisfaction Survey.
- Giancarlo De la Garza, Nordson Test, and Inspection, talks about the acquisition of CyberOptics and what that means for the company’s product portfolio.
- Keith Best, Onto Innovation, shares some news about its Application Center of Excellence focused on advanced packaging for panels.
- Sally Anne Henry and Jim Straus, ACM Research talk about reasons why they think we’re in the midst of a talent shortage across the globe.
- Abdul Lateef, CEO, PlasmaTherm explains the role 200mm manufacturing at legacy nodes plays in helping the industry achieve $1T.
- Dieter Rathei, DR Yield, talks about the new fab expansions needing state-of-the-art data management tools to achieve better manufacturing efficiencies.
- Peter Dykstra, Trymax Semiconductor, talks about opening Trymax USA, driven by the push to onshore manufacturing in the US.
- Vinay Patwardin, Cadence, discusses the different EDA needs of 3D HI multi-chiplet systems, compared with simple 2D advance packaging.
- Feng Ling, Xpeedic, talks about Metis, the company's simulation tool for 2.5D and 3D IC that won the Herb Reiter Design Tool of the Year Award.
- David Doyle, Heidenhein, talks about how the company’s motion control products support the precision and accuracy needs of today’s advanced packaging technologies.
- Joe Gaustad, ClassOne Technology, talked about the company’s collaboration with universities to bring state-of-the-art tools to the hands of engineering students.
- Jobert Van Eisden, MKS Instruments, talks about how next-generation Cu-to-Cu plating chemistry makes a low-temperature die-to-wafer hybrid bonding process.
- Joel Scutchfield, Koh Young America talks about the company’s recent entrance into the heterogeneous integration space from PCB assembly space with automated optical inspection tools.
- Martijn Pierik, Kiterocket talks about the Kiterocket Lounge hospitality space and the exciting panel discussion they organized and hosted on behalf of its clients that focused on how AI is shaping the semiconductor industry.
- Spencer Wall, DSV-IMS talks about the role a global transport and logistics company plays in supporting a robust semiconductor supply chain.
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Françoise von Trapp talks to SEMI President and CEO Ajit Manocha, about the semiconductor industry’s journey on the path to becoming a $1 Trillion and what SEMI is doing to address the headwinds that could prevent that from happening.
The semiconductor industry is growing at an amazing rate as demand for computer chips increases in everything from traditional applications like high-performance computing, data centers, and network architectures to automotive, artificial intelligence, and machine learning applications. Experts anticipate the industry will become a $1T industry by the 2030s. But headwinds including supply chain disruptions, the impending restrictions on PFAS chemicals that are used in semiconductor manufacturing, and the growing talent shortage will cause delays.
From this exclusive interview with Ajit Manocha, you’ll learn why these headwinds threaten growth and SEMI’s efforts in addressing them.
Contact Ajit Manocha on LinkedIn.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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At SEMICON West, one of the key areas of discussion was the Path to Net Zero. What can we do to make sure the semiconductor industry grows in a way that is beneficial to the planet and shows cross-industry leadership?
Françoise von Trapp talks to SEMI’s Dr. Mousumi Bhat, VP of Global Sustainability Programs, and Collin O’Mara, CEO of the National Wildlife Federation about key takeaways from the sessions at the Climate Equity & Social Impact Pavilion at SEMICON West.
The program brought together leading climate and climate justice experts from across the United States, federal agencies like US EPA and the newly established Chips for America office, a White House advisor, and many SEMI member companies such as Lam Research, ASML, Western Digital, and TEL.
O’Mara talks about why the CEO of the NWF is at SEMICON West, and the opportunities he sees for the semiconductor industry to address the climate crisis.
Bhat explains how the Climate Equity Pavilion relates to SEMI’s global work to help the industry collaborate for net zero through the Semiconductor Climate Consortium and other efforts. She also explains the importance of collaboration across the value chain to achieving Net Zero Goals, and what the industry is doing now to accelerate progress.
Learn more about SEMI's Semiconductor Climate Consortium.
Connect with our Guests on LinkedIN
Dr. Mousumi Bhat, VP of Global Sustainability Programs
Collin O’Mara, CEO of the National Wildlife Federation
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Trymax Semiconductor
When Plasma Matters. High-performing solutions for volume manufacturing.
Nordson Test and Inspection
Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications.
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In this episode, Françoise von Trapp talks with SEMI’s Bettina Weiss, and Bindiya Vakil, of Reslinc about how to navigate the complexities of the semiconductor supply chain.
The electronics industry continues to be in a state of flux. After two years of shortages, delays, and skyrocketing costs, the causes of supply chain disruptions keep changing rapidly. There is no single cause. Economic uncertainty, legislation, geopolitics, sustainability, and regionalization are all at play. Supply chain managers must be ready for multiple worst-case scenarios and be able to pivot quickly when disruption hits. Agility is the name of the game and companies must act quickly to changing needs.
The conversation focuses on why we’re still struggling with supply chain issues after 2 years, and how these disruptions are likely here to stay. The connection between supply chain issues and sustainability is also examined.
You’ll learn why traditional approaches are no longer the best way to go, and how you can set your company up for supply chain success. Lastly, you’ll learn about the SEMI Supply Chain Management Initiative, led by an Industry Advisory Council that now includes ASE, ASM, Dell, GlobalFoundries, Google, Infineon, Intel, KLA, Merck, Schneider Electric, and TSMC.
To hear more from Bindiya Vakil, listen to the 2022 podcast episode from SEMI ISS 2022: A Conversation about Creating a Risk-Ready Supply Chain.
Connect with our Guests on LinkedIn
- Bettina Weiss, Chief of Staff and Corporate Strategy, SEMI
- Bindiya Vakil, CEO and Founder, Reslinc
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
DSV Inventory Management Solutions
DSV IMS is here to optimize your inventory management and reduce your total cost of ownership.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the showBecome a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
For this week’s episode, we’re taking you to SEMI Europe’s 3D and System Summit, which took place last month in Dresden Germany. If you didn’t get to attend, you’re in luck, because in this episode, Françoise hands over the microphone to Jan Vardaman, who moderated a panel Panel Discussion titled: Customer-Supplier Partnering to Overcome Challenges in 3D. Industry experts Raja Swaminathan, of AMD; Andre Blum, of Audi; and Eric Beyne, imec lend their voices to the conversation.
The panel address the main drivers for 3D in different applications spaces. They also discuss the importance of partnerships and collaboration to implement heterogeneous integration solutions. There is a focus on evolving automotive electronics, and how 3D integration technologies are coming into their own to provide solutions as more advanced technology is needed alongside legacy node products.
Find the Panelists on LinkedIn
· Moderator – Jan Vardaman, Techsearch International
· Raja Swaminathan, AMD
· Andre Blum, Audi
· Eric Beyne, imec
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Françoise von Trapp interviews Dave Thomas, of the SPTS Division at KLA, to talk about the evolution of wafer-level packaging, what’s been driving the market to adopt more advanced processes over the past 20 years, and the role KLA and specifically the SPTS division has played in bringing these technologies to commercialization.
The specific technology focus is on plasma dicing, its uses, particularly in die-to-wafer hybrid bonding, and the path to adoption. Thomas addresses in detail some of the process challenges and how SPTS has addressed them. He also talks about the fast-moving technical requirements that make the processes for packaging applications highly competitive.
To learn more about plasma dicing, read this article published by KLA on 3D InCites.
KLA, SPTS Division
KLA provides semiconductor equipment for metrology, inspection, wafer processing, and more.
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In this special episode of the 3D InCites Podcast, in partnership with the International Microelectronics and Packaging Society (IMAPS), we talk to Steve Kummerl,TI; and Mark Gerber, ASE, about the upcoming CHIPcon event which takes place July 24-27 in San Jose CA. This conference is a rebrand and restructuring of what was formerly the Advanced System in Packaging Symposium. Kummerl is the General Chair for the event, and Gerber is on the IMAPS Academic Committee. They are part of the team that put together a very robust agenda, with expert speakers from across the chiplet ecosystem.
CHIPCon stands for Chiplet Heterogeneous Integration and Packaging Conference. Kummerl and Gerber talk about the motivation for repositioning the conference, and how the speakers were selected to represent the end-to-end chiplet ecosystem. They also explain how CHIPCon is differentiated from the annual IMAPS International Device Packaging Conference. They provide some details of what attendees can expect to learn by attending this event.
Note that Early Bird Registration AND the hotel block ends today, June 30, 2023. Registration for both is found at www.chipcon.org.
IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
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This episode of the 3D InCites podcast is brought to you by our sustaining members. Shout out to our first official sustaining members Lori McDonald of Deca, and Brian Schieman, of IMAPS. Thanks for helping us continue to create great content!
At ECTC 2023, which took place earlier this month, the password was hybrid bonding. In this episode, you’ll hear from our member companies that specialize in hybrid bonding solutions: Adeia, EV Group, and Onto Innovation. You’ll also hear about a novel die-to-wafer process technology from CEA Leti, and an alternative to Die-to-wafer hybrid bonding being developed by the UCLA CHIPS program.
Thomas Uhrmann, Markus Wimplinger, and Dave Kirsch, EVGroup, talk about the company’s capabilities in supporting both wafer-to-wafer hybrid bonding, and the work being done at the Heterogeneous Integration Competency Center in Austria.
Adeia’s Laura Mirkarimi and Abul Nuruzzaman, pioneers of hybrid bonding, help dispel some misconceptions about the commercialization of Die-to-wafer hybrid bonding. They talk about the advantages of investing in not only the technology license but the technology transfer.
Monica Pau, Onto Innovation, talks about the events focused on hybrid bonding, but also some insights into glass core IC substrates, and Onto Innovation's capabilities in both.
Emilie Bourjot, CEA-Leti, describes a novel self-assembly process that allows for improved alignment accuracy and increased throughput during die-to-wafer hybrid bonding.
Subu Iyer, of UCLA CHIPS, offers a new approach to copper-to-copper thermocompression bonding that he says provides an alternative to die-to-wafer hybrid bonding.
Next up on the 3D InCites Podcast: On July 6, Dave Thomas, of KLA’s SPTS division will talk about the advantages of plasma dicing for die-to-wafer hybrid bonding. That episode is sponsored by KLA.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this SEMICON West podcast preview episode, Françoise talks with SkyWater’s CEO Tom Sonderman, who will deliver a keynote talk, “Creating a Path to Talent”. addressing the workforce shortage currently facing the semiconductor industry.
Semiconductor manufacturing is on a path to becoming a $1Trillion industry somewhere around 2030. New fabs are being constructed all over the world to meet the growing demand for computer chips. In the US, the CHIPS and Science Act legislation and the promise of a $52B investment to fuel onshore manufacturing is driving this growth. One of the many challenges is building the workforce to support this flourishing industry.
Sonderman provides the back story on how the US semiconductor industry got into this talent crisis and what can be done about it. He gives a glimpse of some of the programs launched at SkyWater to provide pathways for recruitment, to fill critical roles from fab technicians to Ph.Ds.
You can catch the full Keynote talk during the CEO Summit Keynote session, The Path to Talent, which takes place on Thursday, July 13 at SEMICON West. SkyWater is also working with the SEMI Foundation on workforce development programs. Check out all the CEO Summit Keynotes here.
Connect with Tom Sonderman on LinkedIn.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
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The 3D InCites community had 24 of its members who were either presenting, exhibiting, or both. This episode features conversations Françoise had with many of the participating members about the key takeaways they got from the event, as it relates to their company’s technology goals.
Rozalia Beica and Venkata Mokkapati, AT&S talk about the important role advanced IC substrates have in today’s advanced microelectronics. They addressed questions about the lack of IC substrate manufacturing in the US, and how AT&S is positioned to help support that need.
Ram Trichur, of Henkel Corporation accepted the Material Supplier of the Year 3D InCites Award and talked about the materials innovations that won them the award.
Ralph Sorberbier and Rolland Rittenmeier of Evatec talk about advancements in physical vapor deposition for fan-out wafer-level packaging, and thermal management solutions for HPC. They also talk about the traction fan-out panel level packaging is getting.
David Levy, of Mosaic Microsystems, was at ECTC to learn about emerging applications that could benefit from the company’s thin glass handling solutions.
Stephan Schmidt, LPKF Laser, explains why glass is such an important topic right now in the microelectronics community and the role LPKF has played in solving glass challenges – such as forming through glass vias.
Irving Wang, MRSI, talks about what he came to learn at ECTC 2023, and the current focus on hybrid bonding, and the role MRSI plays in die-to-wafer hybrid bonding.
Gary Pycroft, Deca, sings the praises of ECTC, and what a great event it is. He also talks about the different segments of the market that Deca’s technologies serves.
Curtis Zwenger, at Amkor Technology, shares the news about opening of the smartest OSAT factory in the OSAT world, located in Vietnam.
Dave Thomas, KLA’s SPTS division, talks about all the information he gets out of ECTC, and how it relates to what SPTS is working on to support emerging technologies.
C.P. Hong and Vikas Gupta, from ASE Group, talk about the company’s new product announcement, FoCoS Bridge, and how it fits into the VIPack pillars.
Debbie-Claire Sanchez, ERS Electronic, talks about the company’s efforts to build a portfolio around warpage, with the launching of its warpage metrology system.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
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In this episode, recorded live at ECTC 2023, Françoise interviews some of the key speakers about the hot topics of the week: Quantum computing, the Chips and Science Act, and workforce development. Additionally, she speaks with the winner of the first-ever, IEEE EPS William Chen Distinguished Service Award. The episode concludes with a conversation with the event organizers about changes and future plans.
Keynote speaker, Mike Manfra, physics professor at Purdue University, and Scientific Director, Microsoft Quantum Lab West Lafayette, talks about quantum computing — what it is, why we need it, and what challenges and opportunities exist from the microelectronics advanced packaging community to bring it into manufacturing.
Dick Otte, Promex, and Joshua Dillon, Marvell, talk about the key takeaways from the Chips Act Special Session – Advanced Packaging in North America, building the ecosystem.
Kim Yess, Brewer Science, talks about the Diversity and Career Growth Panel, and the key takeaways discussed by the panel on diversifying our workforce to meet National needs as outlined by the CHIPS Act Initiative.
Shaw Fong Wong talks about what inspires him to volunteer his time to the EPS Society.
Ibrahim Guven and Florian Herrault wrap up the episode with a look at the success of this year’s format changes and future plans for ECTC 2024 and beyond.
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Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
We are just about 5 weeks away from the biggest event of the year for the semiconductor industry – SEMICON West, which takes place July 11-13 at the Moscone Center in San Francisco.
This annual event is the flagship of SEMI. The days are packed with conference sessions, the show floor showcases the latest and greatest technologies, the special pavilions are humming with activity, and the networking receptions and satellite parties offer great opportunities for networking.
In this episode, Françoise talks with Joe Stockunas, President of SEMI Americas, about some significant and exciting changes happening this year, such as the CEO Summit, which focuses on the path to $1T, the path to Net Zero, and the path for talent. He talks about the 20 under 30 program, recognizing significant contributions by semiconductor technologists who are under 30 years of age. There will be a SemiSisters reception, co-hosted by 3D InCites and sponsored by Edwards, celebrating the women who work in the semiconductor industry. To enhance the attendee exposition experience, new dining options were added that feature local San Francisco fare.
We also get a sneak peek at more changes coming in 2025.
Learn more and register at the SEMICON West website.
Connect with Joe Stockunas on LinkedIN.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Continuing our focus on sustainable semiconductor manufacturing, in this episode Françoise speaks with Cédric Rolin, project manager at imec, about its Sustainable Semiconductor Technologies & Systems (SSTS) research program. Launched by imec in 2021, the SSTS rallies stakeholders from across the semiconductor industry to help reduce the ecological impact of the IC value chain.
In response to mounting concerns about climate change, tech companies around the world are accelerating efforts to complete carbon neutrality for their supply chains and products. The semiconductor industry recognizes its pivotal role in this endeavor. Studies show that almost 75 percent of mobile devices’ CO2 emissions can be traced back to the underlying manufacturing process – with chip production being responsible for nearly half of that footprint. Against this backdrop, the SSTS program provides detailed information on the environmental impact of choices made during semiconductor technology's definition phase.
To date, SSTS has 15 member partners including Google, Amazon, Apple, Meta, and Microsoft; GlobalFoundries, TSMC, Samsung, and Rapidus; and equipment suppliers including Applied Materials, ASML, Edwards, Kurita, SCREEN, and Tokyo Electron.
In this podcast, you’ll learn the back story of the program, how it's structured, what role these companies play, how they developed a new data tool called imec.netzero, how the program will help companies achieve Net Zero Emissions, and more.
imec will be discussing this important topic further at its ITF Semicon USA, in a fireside chat with imec’s Emily Gallagher and SEMI’s Mousumi Bhat.
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Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this fourth episode of the SEMI MIT podcast series, you’ll learn about the semiconductor device design market, the latest SEMI Electronic Design Market Data (EDMD) report, and the Electronic System Design Alliance (ESDA) whose members contribute to it. Speakers include:
· Paul Cohen, Senior Program Manager of ESDA
· Bob Smith, Executive Director of ESDA
· David Ghodsizadeh, Director of Product Marketing for the SEMI Market Intelligence Team
The group discusses the report itself – what it covers and how data is gathered. You’ll learn about how the report is used by customers, and the benefits of participating in it. You’ll also get an inside look at the report itself, and what it shows about the state of the design market.
Additionally, you’ll learn about the upcoming ESDA CEO Outlook Membership meeting, on May 18, 2023, and reasons why you should attend.
Resources
· Learn more about the ESDA
· Learn more about the EDMD Report and read the press release
· Purchase an EDMD Single Report
· Subscribe to the EDMD Report
· Register for the CEO Outlook
· Download the EDMD Q4 newsletter
In the first three episodes featuring SEMI's Market Intelligence Team, you get an overview of the market data portfolio, and specific reports for the semiconductor manufacturing equipment market, the World Fab Forecast, and the Semiconductor Manufacturing Monitor, respectively. Find them here.
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Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In the first two episodes of this series, we heard from startup finalists who participated in last year’s program about their sustainability solutions, their experience with the program – including making strong industry connections and some securing funding, and advice for startups participating this year.
In this third and final episode of the SEMI Startups for Semiconductor Sustainability series, you’ll hear about the journey ahead for the semifinalists of this year’s Startups for Semiconductor Sustainability program. SEMI just announced the semifinalists for this year’s program. You can read about it here.
You’ll also hear from two of the VCs who make this program tick. They explain how they came up with the concept for a start-up pitch event, and how they collaborated with SEMI and VCs across the supply chain to make it happen. You’ll hear about the process and the benefits of participating in this event.
As an attendee of SEMICON West, you’ll find out how to take in the program and learn about the sustainable solutions of this year’s startups.
Contact The Panelists
· James Amano, Senior Director, EHS & Sustainability at SEMI
· Jennifer Ard, Managing Director and Head of Investment Operations at Intel Capital
· Dr. John Wei, Investment Director at Applied Ventures LLC
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Like what you hear? Follow us on LinkedIn and Twitter
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this episode, recorded at IMAPS DPC 2023, Françoise von Trapp talks with Indium’s Andy Mackie, about his latest mission to address the confusing and complex lexicon of Advanced Packaging technology. He shares the backstory on the idea, he has come up with to change the way we talk about semiconductor device packaging, that will uplevel the importance of what is really interconnect technology.
Mackie’s position, and that of other colleagues in the industry, is that the term "packaging", when applied to semiconductor assembly, is misunderstood by most people, at a time when its importance (in the wake of the CHIPS Act and similar legislation) is growing.
As we enter 2023, Mackie suggests that it’s time to make this simple so laypersons and experts alike can use the same terminology.
The ensuing discussion digs into a light-hearted debate about his “strawman” ideas to put some standardization around the nomenclature known as advanced packaging.
If you would like to support this effort, please contact Andy Mackie on LinkedIn.
IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
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In this special episode of the 3D InCites Podcast, we bring you, in its entirety, a panel discussion that took place earlier this year at SEMI ISS Europe. The theme: Closing the Talent Gap and Cultivating the Workforce of Tomorrow. The multigenerational panel offers different perspectives and multiple topics, such as what they look for in a company, the importance of workplace culture, and what the semiconductor industry needs to do to improve its image to recruit more people. We join the panel in progress, as Cassandra Melvin opens the questioning.
Some of the questions posed include:
· How would you describe the image of the semiconductor industry?
· Is there a specific challenge for the EU to improve the image of the industry?
· How can Internships and apprenticeships can be improved to make the industry more compelling to candidates?
· How do the generations differ in what makes a good workplace?
Moderator: Cassandra Melvin, Senior Director of Business Development & Operations, SEMI Europe
· Isabella Drolz, VP Product Marketing Comet Yxlon
· Anna McEvoy, Project Team Lead Semiconductor Service, Edwards
· Léo Saint-Martin, DECISION Etudes & Conseil, METIS Project
· Clara Haubenwallner, Student Assistant, Graz University of Technology
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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At IMAPS DPC, Françoise von Trapp moderated a town hall discussion, DEI: It Takes a Village. The target audience was not HR or hiring managers, but the regular attendees who may be wondering what they can do to help create an atmosphere of equity and inclusion at their workplace. We asked the hard questions that people might be asking: Why should I care? Why do I need to use my pronouns? What can I do/say to have an impact on our company culture?
Panelists:
- Francesca Domingo, EMD Group | Head of University Relations & Talent Strategy, EMD Group
- Ann McKenna, Arizona State University, Fulton Schools of Engineering | Vice Dean for Strategic Advancement
- Rebeca Obregon-Jimenez, Avnet | SVP Strategic Business Engagements & Supplier Management
- Robin Stubenhofer, Kansas City National Security Campus (KCNSC) managed by Honeywell | VP of Engineering
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
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In this episode, Françoise von Trapp holds impromptu interviews with 3D InCites members who attended, exhibited, and/or presented at the 2023 IMAPS DPC in March. Topics of discussion include: Using AI in microelectronics manufacturing,
how front-end processes are finding their way into the back-end, updates on glass substrates, capillary underfill advancements, dealing with wafer warpage, and advanced substrates and standards on panel sizes.
Contact our Guests
Keith Felton, Siemens EDA, summarizes the presentation he gave on how to put AI, Machine Learning, and Deep learning to work in the semiconductor manufacturing environment.
Emerald Greig, PTW Group, explains PTW Group’s mission to become the go-to company for legacy support. Emerald’s daughter recently appeared in the latest episode of Roadtrip Nation, Chip In, in which three young people searching for careers explore the works of microelectronics.
Jim Straus of ACM Research shares feedback from the IMAPS attendee perspective. It was his first time at the event, and he shared some of his takeaways from the sessions he attended, particularly in the area of glass substrates.
Ken Araujo of Namics talks about advancements in liquid capillary underfill, driven by cost as well as tightening specifications of advanced packaging applications.
Debbie Claire-Sanchez, of ERS Electronic GmbH talks about the company’s ongoing research to address wafer warpage issues.
Keith Best, Onto Innovation, talks about the ongoing debate over advanced IC substrates and standardization on panel size.
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
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This episode features interviews that were recorded live at IMAPS DPC 2023.
First is an interview with CEA Leti’s Silvie Joly, who gave an industry coalition talk during the Global Business Council session, New Momentum in Semiconductors: Impact of Ecosystems, a European Case Study. Joly is the partnerships manager for 3D integration and packaging at CEA Leti. She provides key takeaways from her talk.
Next up is Basam Ziadah, who presented his keynote, Driving Adoption of Advanced IC Packaging in Automotive Applications. He talks about what drives more semiconductor devices in automotive applications. He describes the challenges we need to address to deliver advanced technology with the level of reliability required by the automotive industry, and how chiplet integration can be used.
Lastly, Françoise interviews Nicholas Harris, CEO of Lightmatter, who presented on extending Moore’s Law with photonics packaging. He explains why chiplets aren’t the panacea everyone thinks, of and how 3D integration using photonics packaging is the way forward to achieve performance at low power for artificial intelligence and high-performance computing.
Episode Guests
· Sylvie Joly, CEA-Leti
· Basam Ziadeh, General Motors
· Nicholas Harris, Lightmatter
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
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At the 2023 IMAPS Device Packaging Conference, there were a lot of discussions about chiplet technology, both in panel discussions and in general conversations. In this episode, we pulled together several interviews in an attempt to demystify and define chiplets, how they are produced and interconnected, what challenges the industry faces, and what we need to do to overcome them.
You’ll hear from:
- Keith Felton, Siemens EDA
- Chris Scanlan, Besi
- Choon Lee, JCET Group
IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
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In This episode, Françoise von Trapp interviews some of the 2023 3D InCites Award Winners, to learn about the significant accomplishments they are being recognized for.
First is James Bear, TEL, who describes some of the company’s best practices that helped them secure the 2023 3D InCites Sustainability Award.
Engineer of the Year, Markus Leitgeb, AT&S, explains the concepts and advantages of the company’s Embedded Component Process (ECP), which he helped develop.
Mark Gerber, ASE, winner of the Device Technology of the Year award for the VIPack™ Platform explains this six-pillar approach and the recent announcement of its fan-out package on package (FOPOP) technology.
Eelco Bergman, of Saras Micro Devices, this year’s Start-up of the Year Award Winner, talks about the company’s team of industry experts, and the technology its developing heterogeneous integration technologies that will improve power efficiency for AI, high-performance computing, and data centers.
Thomas Uhrmann and Garrett Oakes of EV Group talk about the company’s breakthrough NanoCleave process that one the 3D InCites Process of the Year Award. This revolutionary IR laser process targets silicon carrier technology for 3D integration.
Tim Olson and Robin Davis of Deca, winner of the SemiSister Award for DEI, talked about building DEI into Deca’s DNA, and what it’s like to establish a culture of DEI at a small company.
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In this second episode of the SEMI’s Start-ups for Sustainability podcast series, SEMI’s James Amano returns to provide a quick recap of the program as SEMI gears up for its Startups for Semiconductor Sustainability Pitch Event Year 2.
This year’s focus is on start-up companies that provide solutions that address the challenges of semiconductor manufacturing emissions, energy issues, and circularity (water and waste.) In this episode, we meet three finalists from the 2022 pitch event who share their success stories and provide some useful tips for navigating this year’s pitch event.
You’ll hear how Membrion’s ion exchange membranes us desalinization techniques to recycle manufacturing wastewater to reuse both the water and the reclaimed minerals like copper. You’ll learn how NuMat Technologies programs chemistries to handle and purify gasses to help semiconductor manufacturers reach their sustainability goals. And you’ll learn how Purity ReSources helps semiconductor manufacturers move from a linear to circular closed-loop process to recycle millions of gallons of solvent used in photoresist processes every day.
Lastly, the panelists will share their experiences at the pitch event, and how it helped propel their companies forward.
Panelists
· James Amano, EHS & Sustainability, SEMI
· Greg Newbloom, CEO & Co-Founder at Membrion
· Ben Hernandez, Founder & CEO at NuMat Technologies
· Daniel Alvarez, Founder & CEO at Purity ReSource
SEMI Sustainability Initiative
The SEMI Sustainability Initiative brings together companies across the global electronics manufacturing and design supply chain to collaborate on the industry’s toughest sustainability challenges. One program in the initiative is SEMI Startups for Semiconductor Sustainability, which offers companies with innovative sustainability solutions the opportunity to present to top semiconductor VCs. Submit your startup’s application today. Applications are open until March 13, 2023. Learn more at SEMI.org/startups.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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Continuing the tradition started in 2022, Françoise sits down again with Beth Keser, sitting IMAPS president, and Jim Haley, VP of marketing, IMAPs, to talk about this year's IMAPS IMAPS Device Packaging Conference, which takes place March 14-16, 2023 at WeKoPah Resort and Casino in Fountain Hills Arizona.
Get ready for an action-packed week in this desert oasis at the foot of the MacDowell Mountains. With professional development courses in microelectronics and packaging technologies; keynote talks on hot industry topics like chiplets and silicon photonics; a round table discussion on diversity, equity, and inclusion; awards ceremonies, and lots of networking opportunities; this is one of the microelectronics industry's best conferences.
To learn more about the event or to register, visit the IMAPS Device Packaging Website.
Click here to learn more about the Hike for DEI and ways to support the DEI Fund.
Connect with our guests on LinkedIn Beth Keser
James Haley
IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
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These days, everyone is talking about the importance of sustainability. In the semiconductor industry, developing more sustainable practices is top of mind for most manufacturers, because they are challenged with meeting increasing demands as semiconductors have become critical to everyday life, yet manufacturing them puts a strain on natural resources.
To address this, The SEMI organization put together a sustainability initiative – and one element of that is its Startups for Sustainability program. This episode is the first in a series of three, in which we’ll learn more about the program, and talk to some of last year’s finalists.
Panelists
· James Amano, Senior Director, EHS and Sustainability, SEMI
· Jon Herlocker, President & CEO at Tignis
· Maher Damak, CEO & Co-Founder at Infinite Cooling
· Lester D'Cruz, Senior Director Product Management at ATONARP
SEMI Sustainability Initiative
The SEMI Sustainability Initiative brings together companies across the global electronics manufacturing and design supply chain to collaborate on the industry’s toughest sustainability challenges. One program in the initiative is SEMI Startups for Semiconductor Sustainability, which offers companies with innovative sustainability solutions the opportunity to present to top semiconductor VCs. Submit your startup’s application today.) Learn more at SEMI.org/startups.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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Welcome to 3D InCites In Case You Missed It Series. We did a lot of podcasting in 2022. Some of our longer episodes consisted of multiple interviews, so you may have missed some of the juiciest conversations. So when there’s a break in the action, we’re taking you back to those conversations.
In this episode, we’re going back to ECTC 2023, where Françoise sits down with ASE Fellow, Bill Chen, who has been instrumental in progressing the Heterogeneous Integration Roadmap. He talks about its purpose, the committee’s vision, and how it will make possible the next 50 years of Moore’s Law, as Gordon Moore himself envisioned in the second part of his paper.
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For first episode of 2023, Françoise von Trapp handed over the microphone to Dean Freeman, the market analyst at 3D InCites. He attended SEMI’s Industry Strategy Symposium at Half Moon Bay, CA, in January and interviewed SEMI’s Market Intelligence team for the third episode in this four-part series. Part 3 focuses on the Semiconductor Manufacturing Monitor, a report jointly developed by SEMI and TechInsights.
SEMI ISS is an annual event attended by semiconductor industry executives who rely on it for updates on many crucial aspects of semiconductor industry operations. As such, Dean and the panelists discuss some of the key market intelligence takeaways from this ISS 2022 before delving into the report.
Panelists include:
· Inna Skvortsova, Market Research Analyst in the SEMI Market Intelligence Team
· Risto Puhaka, Director of Market Research, Market Research TechInsights
· David Ghodsizadeh, Director of Product Marketing for the SEMI Market Intelligence Team
Learn more about SEMI's Market Intelligence Team
Learn more about the Semiconductor Manufacturing Monitor
Order a sample of the Semiconductor Manufacturing Monitor
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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This episode was recorded live during the Advanced Packaging Sympoisium at SEMICON Europa on November 16. 2022. Steffen Kröhnert, President & Founder, ESPAT-Consulting, moderates a panel discussion with members of the semiconductor packaging service provider community in Europe. The topic? The Future of semiconductor manufacturing in Europe – and specifically, back-end packaging and test.
Kröhnert sets the stage by providing an overview of the current availability of semiconductor packaging in Europe. Panelists Oliver Maiwald, CEO, Sencio B.V. and Jan de Koning Gans, Managing Director, RoodMicrotec GmbH, talk about their respective offerings, and discuss the desire to build a robust packaging ecosystem to support the European semiconductor supply chain. Q&A with audience wraps up the conversation.
Contact the Panel on LinkedIn:
- Steffen Kröhnert, President & Founder, ESPAT-Consulting
- Oliver Maiwald, CEO, Sencio B.V.
- Jan de Koning Gans, Managing Director, RoodMicrotec GmbH
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In this episode recorded live at SEMICON Europa 2022, Françoise hands over the mike to Cassandra Melvin, Senior Director of Business Development and Operations at SEMI Europe. At SEMICON Europa, Cassandra led a panel discussion on the topic of Leveraging Generational Differences in the Shifting Workplace. The panel comprised industry professionals representing different generational cohorts, from Baby Boomers to Gen-Z. We recorded it in its entirety.
Meet the Panellists
- Cassandra Melvin, Moderator, SEMI Europe
- Francoise Chombar, Chairwoman, Melexis
- Philip Matthes, Head of Global Human Resources, Semiconductor Materials, Merck KGaA, Darmstadt Germany
- Mark Agujar, Project Technician, Edwards Vacuum
- Marco Fasel, Industrialization Team Leader, Comet PCT
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In this episode, recorded live at SEMICON Europa in Munich the week of November 14-18, 2022, Françoise von Trapp speaks with 3D InCites member companies that either exhibited, presented, or in some cases, both, at the event. Conversations range from discussions about this year's event compared with the 2021 show, the impact of the respective EU and US CHIPS and Acts on their businesses, and the technology innovations they showcased at the show.
Guests and Companies
- Peter Dijkstra of Trymax
- Alan Weber of Cimetrix by PDF Solutions
- Dieter Rathei and Krista Tropper of D.R. Yield
- Thomas Fries of FormFactor
- Heiko Dudek of Siemens EDA and Raphael Theveniau of ST Microelectronics
- Jim Garstka of PlasmaTherm
- Byron Exarcos and John Voltz of ClassOne Technology
- Ralph Zoberbier of Evatec
- Debbie Claire Sanchez and Sophia Oldeide of ERS electronic GmbH
- Jim Straus and Sally-Ann Henry of ACM Research
- Ram Trichur of Henkel Corporation
- Mike Rosa of Onto Innovation
FInd these Articles on 3D InCites
- The Road Towards Climate Neutrality from the Perspective of a German SME
- Mobile Antennas and Power Devices that Break The Mold
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This podcast episode was recorded live at SEMICON Europa 2022, in Munich Germany. It features interviews with select keynote speakers representing the depth and breadth of topics discussed throughout the week.
Luc Van den hove, President and CEO of imec, in Belgium talks about the rollercoaster ride we’ve been on in the aftermath of the pandemic, the war in Ukraine, the subsequent energy crisis, and financial crisis, and how this has propelled semiconductors into the limelight. He also explained how semiconductors enabled the ability to generate and analyze gigabytes of data using AI to quickly sequence the human genome, and how that made it possible to develop a COVID vaccine in just one year, as well as other examples of how semiconductors are helping to drive change in global challenges like the climate crisis, health, and food supplies.
Laura Matz, CEO of Athinia, returns to the podcast to talk about the importance of developing a data ecosystem to bring materials suppliers and device manufacturers together to collaborate. Since then, she’s been exploring other areas of semiconductor manufacturing, such as supply chain and sustainability.
Michelle Williams-Vaden, of SEMI Foundation, spoke about the talk she gave during the Future of Work session on how companies can shift to welcome a more inclusive workforce. She provides some strategies on how to attract new talent and create a devoted team.
Isabella Drolz, of Comet Yxlon, talks about how X-ray technology is the future of inspection in advanced packaging. She explains why there hasn’t been an industry-wide adoption of X-ray inspection as the preferred method.
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In this episode, Françoise speaks with Beth Keser, Ph.D., about her latest book co-authored with Steffen Kröhnert, ESPAT Consulting.
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces was published in December 2021. It is essentially a companion to the wafer-level packaging handbook titled, Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies, which the duo published in 2019. This book picks up where the first one left off, with 11 new chapters including contributions from some of the same companies that participated before, as well as new ones.
The book examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges, and is filled with contributions from some of the field’s leading experts.
In the interview, Beth talks about the book’s backstory, why and how it was written, and who participated. She also explains why they decided to begin the book with a market report, and how the book is a snapshot in time.
Contact Beth Keser on LinkedIn
Order your own copy of Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces.
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According to the International Energy Agency, road transportation accounts for 16% of global emissions. Electric vehicles are the key technology to decarbonize this. The EIA estimates that EVs will account for 13% of new cars sold in 2022. Many countries are setting goals to eliminate combustion engine cars to reach Net Zero emissions by 2050. But there are a lot of challenges to iron out before EVs achieve critical mass. For example, one area of interest for this week’s podcast guests is the materials used to manufacture EV power modules. In this episode, Françoise von Trapp talks with Indium’s Pei Lim and Dean Payne about these challenges, particularly why pressure silver sintering die to attach is becoming a popular approach.
You’ll learn how eMobility has impacted manufacturing power modules and the origin of silver sintering in these devices. You’ll learn about the materials currently used in sintering, and why silver is a better choice for electric vehicles. Lastly, you’ll learn about Indium’s pressure sinter offering and its benefits.
Learn more about pressure silver sintering here.
Contact today’s guests on LinkedIn:
Sze Pei Lim, Senior Global Product Manager, Indium Corporation
Dean Payne, Semiconductor Product Manager, Indium Corporation
Indium Corporation
Indium Corporation's materials solutions serve the semiconductor, e-mobility, and thermal markets.
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For this episode, recorded during the IMAPS International Symposium, Françoise von Trapp hands over the mike to Robin Davis, of 3D InCites Member company, Deca.
Davis organized and moderated a Diversity, Equity, and Inclusion town hall discussion during IMAPS, on the topic of Equality vs. Equity. A distinguished panel of industry veterans shared their perceptions and personal stories, including Jean Trewhella, GlobalFoundries; Susan Trulli, Raytheon; Shelby Nelson, Mosaic Microsystems; Urmi Ray, Saras Micro Devices, and KT Moore, Cadence.
Davis provided a framework for the conversation, explaining the difference between Equal and Equity: Equality means each employee gets the same bicycle to ride, and equity means that everyone gets the bicycle that suits their needs. The panelists then also offered tips for how to overcome our own unconscious bias to create a culture of DEI at our own workplaces.
Contact the Panelists on LinkedInRobin Davis, Deca
Jean Trewhella, GlobalFoundries
Susan Trulli, Ratheon
Shelby Nelson, Mosaic Microsystems
Urmi Ray, Saras Microdevices
KT Moore, Cadence
Deca
Deca's technology empowers the transformation of electronic interconnects for the chiplet era.
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25 of our community members participated in the 2022 IMAPS International Symposium in Boston, MA, which was held during the first week of October. This episode features conversations about what they were presenting and showcasing, and what they learned during the week.
Craig North, of Gel-Pak, is on a mission to find out as much as he can about chiplet processes and technology, to identify gaps that can be filled by Gel Pak products and services.
Bob Connor and Kevin Oswalt of X-Celeprint. Kevin talked about the paper he presented at IMAPS on micro-transfer printing (MTP) at the conference and creating the III_V heterogeneous integration ecosystem.
Bill Acito, of Member company Siemens, presented on silicon substrate design for BGA designers.
Carlotta Baumann, the new CEO of Finetech, talks about stepping into the role in the midst of COVID, and into the shoes of a 22-year veteran not only as a woman but as the sole owner of the company.
Tim Olson, CEO of Deca, was awarded the IMAPS Founder Award. To celebrate, we took a walk down memory lane to share Deca’s origin story and how the company has evolved over the years.
Casey Krawiec and Tim Going of StratEdge Corporation, talked about the new die-on-tab service they are offering for customers who want to incorporate GaAn die into hybrid packaging. They’ve got some interesting products coming down the pipelines in space and defense applications.
Keith Best, of our member company Onto Innovation, talked about the company’s presentation on RDL inspection, which is difficult to inspect because of metal grain. He explained how Onto Innovation’s ClearFind technology uses a green laser to make metal black and organics white, to make the defects easier to see.
Dick Otte, QP Technologies, returns to the podcast to offer some insight on the CHIPS and Science Act. He talks about who customers will be as an outcome of the government investment, and what can be done to take advantage of them,
IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
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in this episode, Françoise von Trapp interviews three of the keynote speakers who presented during the 2022 IMAPS International Symposium. Featured guests include Lionel Kimmerling, Dr. Anu Agarwal (MIT Microphotonics Center); Glenn Daves (NXP), and Dave Bolognia (Analog Devices).
We’re back on the road – recording a series of episodes at the IMAPS International Symposium. In this first episode, Françoise interviews some of the keynote speakers to capture the highlights of their talks.
First up, is Lionel Kimmerling, Thomas Lord Professor of Materials Science and Engineering Director at MIT Microphotonics Center, and his colleague, Dr. Anu Agarwal, MIT – Director of Electric Photonic Packaging and principal research scientist. They explain the basics of Si photonics and co-packaged optics, and the advantages and opportunities of electronic-photonic package integration, which is expected to be the next big technology transition in the IC field, particularly when it comes to chip stacking.
Additionally, Dr. Agarwal talks about a partnership between the Microphotonics Center and IMAPS to provide an educational setting to provide hands-on-training to help the packaging engineer workforce to develop the new skills
Glenn Daves of NXP gave the keynote on Day 2 on the topic of 6G – It’s Opportunities and Packaging Challenges. He talks about the promise of 6G and why it’s more than just another “G” and explains what the plans are for 6G applications. We also talk about all that needs to be accomplished to stay on track to integrate 6G into the wireless offerings, and what’s needed specifically from the packaging community t support it. Lastly, he talks about the importance of semiconductor sustainability and the opportunity to design sustainability into 6G from the get-go.
Dave Bolognia of Analog Devices talks about advancing medical electronics at the intelligent edge. He explains what he means by the intelligent edge; how data volumes are driving the need for more processing at the edge, and the medical applications that will benefit from it.
Contact Our Guests:
Lionel Kimmerling, MIT Microphotonics Center
Anu Agarwal, Ph.D., MIT Microphotonics Center
Glenn Daves, NXP Semiconductors
Dave Bolognia, Analog Devices
IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
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Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit.
Learn more about the 3D InCites Community and how you can become more involved.
It’s no secret that semiconductors are very much a male-dominated industry. In fact, according to Zippia, only 10.7% of engineers working in the semiconductor industry are women. And according to Deloitte and Touche’s Women in the Workplace, women are still vastly underrepresented at all levels of management. In this episode, Françoise von Trapp talks with Christine Whitman, a semiconductor executive who has broken through these barriers. She’s the chairman and CEO of our member company. Mosaic Microsystems.
In this episode, Christine shares her origin story. She talks about what inspired her to pursue a career in semiconductors, and the career path she took that resulted in her buying her first company. A self-described serial entrepreneur, she talks about her passion for materials science, what she looks for when investing in a start-up, and what led her to found Mosaic Microsystems. She also shares her vision for the future, and advice for women looking to shatter the glass ceiling.
About Mosaic Microsystems
Mosaic is pioneering thin glass for packaging and interposer applications in fields ranging from millimeter-wave communications to artificial intelligence and photonics. Thin glass has outstanding mechanical and electrical properties for today’s packaging applications, but adoption has been slow due to its fragility and flexibility. Mosaic’s Viaffirm handling solution eliminates these roadblocks by making thin glass compatible with standard semiconductor processes. Viaffirm also provides a platform for through glass vias and void-free via fill, enabling glass-based interposers with capabilities normally reserved for silicon.
Learn more about Christine Whitman here.
Mosaic Microsystems: The Future is Clear
Thin glass solutions for next-generation microelectronics and photonics packaging.
In this episode, Françoise speaks with Riko Radojcic, veteran semiconductor engineer-turned-novelist, about his 30-year career in the semiconductor industry, what inspired him to turn to fiction writing, and what he hopes to teach his readers about the exciting world of semiconductor device technology.
Ever since the chip shortage impacted your local car dealership, everyone in the world knows how critical semiconductor technology is to every person on the planet. They may not understand anything else about them. But the fact that they are critical to our everyday activities is clear.
But before all this happened, one well-known 3D technology expert at Qualcomm felt a calling to teach the general public about the wonders of semiconductor chips and their capabilities through storytelling.
He left his career in engineering and set out to become a techno-thriller novelist, in which his heroes are semiconductor engineers who must save the world from imminent destruction. Kind of like we’re trying to do in real life.
His name is Riko Radojcic, In this episode, he shares his journey as a semiconductor engineer, and talks about about his latest novel, Start-Up.
Learn more about Riko Radojcic and where to find his books here.
This SEMI Market intelligence Report podcast featuresSanjay Malhotra, Vice President of SEMI’s Corporate Marketing and the Market Intelligence Team (MIT), and Christian Dieseldorff, Senior Principal Analyst. The conversation focuses on the World Fab Forecast, its history, how data is gathered, and how semiconductor manufacturers and suppliers use it to guide their business decisions.
Sanjay starts things off by recapping the Market Symposium at SEMICON West, and the midyear forecast presented there. He also shares how he used the World Fab Forecast during his years in the industry.
Christian talks about the outlook for new fabs and fab expansions, and how much this activity represents future capacity increases from both an actual and historical standpoint. Most importantly, he and Sanjay put fab expansion numbers and capacity into context.
Lastly, Christian talks about the impact of the US CHIPS and Science Act, and other global incentives around the world. He and Sanjay provide some valuable insights to consider when reviewing the World Fab Forecast to help listeners make the most of this useful tool.
You can learn more about SEMI Market Reports here. For specific questions, email the Market Intelligence team at marketstats@semi.org.
Find our Guests on LinkedIn:
- Sanjay Malhotra, VP of Corporate Marketing and the MIT
- Christian Dieseldorff, Senior Principal Analyst, MIT
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
In this episode, Françoise speaks with Dr. Juan Terrazas, the Director of the College of Engineering at CETYS University about the benefits of cross-border manufacturing relationships between the US and Mexico to help alleviate the strains of the semiconductor crisis.
In the aftermath of President Biden’s signing of the CHIPS and Science Act, we’ve been seeing news articles about Mexico positioning itself to take advantage of the US’s desire to bring semiconductor manufacturing closer to home. According to these reports, Mexico is starting to offer incentives to tempt semiconductor manufacturers to open facilities there. The country is already the eighth largest producer of electronics. It’s also close to where companies like Intel and Samsung are already planning new facilities.
Many of these activities began before the chip crisis, with the onshoring efforts and the SHIP program we’ve talked about before on the podcast. Dr. Terrazas provides some insight on the microelectronics manufacturing capabilities in Mexico, and how the US can leverage these capabilities to bolster our domestic semiconductor supply chain. He also talks about the growing technical talent pool that can help solve some of the growing semiconductor workforce challenges.
Learn more CETYS University here
Contact our Guest on LinkedIn
Dr. Juan Terrazas Gaynor, Director of Engineering, CETYS University
The IMAPS International Symposium takes place October 4-7, 2022 at the Hynes Auditorium in Boston MA. This year's Symposium theme is Packaging Technologies Enabling the New Normal, and will feature 20 sessions in five technical tracks, plus an Interactive Poster Session. The technical program will span three days of sessions with an emphasis on packaging technologies that serve 5G, High-Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics markets, and beyond.
New this year will be a workshop on Strategies to Revitalize the Onshore Packaging and Assembly Defense Industrial Base, a Workforce Development Panel discussion, and a DEI Townhall discussion and reception, Equity and Equality in the Workplace.
In this episode, Françoise speaks with Beth Keser, President of IMAPS, and Jim Haley IMAPS VP of Marketing, who dive into the details of this year’s event.
To learn more about the event or to register, visit the IMAPS Symposium Website
Connect with our guests on LinkedIn Beth Keser
James Haley
Earlier this year, we brought you an episode about Roadtrip Nation – an initiative the SEMI Foundation sponsored to raise awareness among recent STEM graduates about opportunities in the semiconductor industry. We interviewed SEMI Foundation’s Shari Liss, to get all the details. You can listen to the episode here.
In this follow-up episode, we’re speaking with Tel’s Katy Crist, who heads up the company’s workforce development initiative, and Tara Greig, an intern at TEL who was selected as one of the lucky candidates who participated in this year’s Roadtrip Nation.
Katy talks about the importance of the Roadtrip Nation project to SEMI’s image and awareness campaign about the semiconductor industry as a great career path. She also talks about TEL’s involvement.
Two-thirds of the way through the experience, Tara shares some highlights of her experience and the journey from applying to the program through the actual three-week adventure, the people she met, the connections and relationships she made, and also provides tips for future applicants who might want to take advantage of this amazing program.
Roadtrip Nation is a nonprofit organization that humanizes career exploration through storytelling and empowers individuals to connect their interests to fulfilling lives and careers.
Learn more
Find our Guests on LinkedINKaty Crist, Sr. Manager, Strategic Alliances and Partnerships, TEL
Tara Greig, Business Informatics Intern, TEL
TEL
Tokyo Electron (TEL) provides innovative semiconductor and flat panel display production equipment.
This podcast episode was recorded live at SEMICON West 2022 at the Moscone Center in San Francisco, where critical discussions about the latest issues impacting the semiconductor industry took place.
Chips aren’t the only thing in short supply, the semiconductor industry talent shortage continues, and SEMI has launched a workforce initiative to address this. In this episode, Françoise von Trapp speaks with General Paul Funk and Major Ray Willson of the United States Army; and Larry Smith, Chairman of the board at TEL, who participated in a panel discussion at SEMICON West on the role military veterans can play in shoring up the microelectronics workforce.
All three guests share their Army stories, what it means to be a soldier for life, and about the important connections made there. They also talk about helping transitioning veterans from the military to civilian life, and what makes them so well suited for positions in microelectronics.
Smith provides a recap of the SEMI panel, who participated, and some of the key takeaways. He talked about the semiconductor industry workforce image and awareness program, and how partnering with military veterans’ programs can form important connections that help veterans learn about the employment opportunities available to them.
General Funk talks about the lifelong connections that a career in the army allows affords, as well as the similarities of characteristics and skill sets that make veterans such ideal candidates for careers in the semiconductor industry. He describes some of the army programs that transition army veterans to civilian life. One of these programs is Soldier for Life.
Major Ray Wilson provides more details on Soldier for Life, which connects the army with government and non-government organizations to influence policies, programs, and services for soldiers veterans, and families. He explains the three pillars in detail.
Find our Guests on LinkedIn:
Larry Smith, TEL U.S.
General Paul Funk, U.S. Army
Major Ray Wilson, U.S. Army
TEL
Tokyo Electron (TEL) provides innovative semiconductor and flat panel display production equipment.
In this episode, Françoise von Trapp interviews Laura Matz, CEO of Athinia™ and Chief Science and Technology Officer of Merck KGaA, Darmstadt, Germany, about the growing need for data collaboration between materials suppliers and semiconductor device manufacturers, and the solution she helped create.
Over the past 10 years, more new materials have been introduced into semiconductor manufacturing at each device node. At the same time, processes continue to tighten. This is increasing sensitivities to materials variations. Because of this, materials companies have to publicly communicate on excursions in the materials supply chain. Until now.
Matz explains how a secure data ecosystem platform can use Big Data and AI to solve these issues. She provides details on how this platform addresses both IP security and cybersecurity.
The platform she describes, Athinia™, was launched in December 2021. This secure data collaboration platform allows semiconductor device manufacturers and materials suppliers to share, aggregate, and analyze data to unlock efficiencies and time to market while improving quality, supply chain, and sustainability.
Six months in, Matz has some exciting news to share about a collaboration with Micron. She also talks about her role in conceptualizing this platform and bringing it to life.
Athinia - Data for Pioneers
Building a secure data ecosystem to solve some of the toughest semiconductor industry problems.
The secondary semiconductor equipment market has been under a strain as secondary tools have been in hot demand since the chip shortage began in 2020 impacting the entire semiconductor supply chain. Here to speak with Françoise about this are Bruce Kim and Jin Choi of SurplusGLOBAL. They are their company’s perspective, and the actions they are taking to address the situation.
Kim talks about the growth of the secondary equipment market in Korea, where the company is based. He explains that the chip shortage has not only placed a demand on new tools but secondary tools because of the need to increase the capacity of legacy node chips. He talks about challenges facing companies who want to expand capacity. The main issue is the long lead times for new tools, so customers are turning to secondary equipment. There are also challenges with finding parts for legacy tools.
To address these challenges, SurplusGLOBAL established its Semiconductor Equipment Cluster. Kim discusses the motivation for building it. He also talks about the company’s new global parts program to support customers around the world who struggle to find replacement parts for otherwise perfectly good tools that have years of life left in them.
Lastly, to support customers who need to optimize new processes but don’t have the spare lines to devote to them, they’ve launched an R&D Foundry program. Jin Choi leads this initiative and discusses it.
Kim wraps up our discussion by talking about the role secondary semiconductor equipment can play in creating a more sustainable semiconductor ecosystem.
To learn more about SurplusGLOBAL visit the website.
or contact Bruce Kim, CEO, SurplusGLOBAL on LinkedIn.
In this episode, we visit 3D InCites member companies on the trade show floor at SEMICON West and the Design Automation Conference to learn about what they are showcasing this year.
Dave Kirsch and Paul Lindner of EV Group talk about the latest achievement in die-to-wafer fusion and hybrid bonding, and what it means for multi-die system-on-chip. They also share BIG news about 3D ICs.
Allan Weber, Cimetrix, a division of PDF Solutions, talked about the company’s connectivity and control products for automated fabs and the data pipeline its technology enables. Weber emphasized the use of streaming data to improve supply chain challenges.
Faraz Shoukat of Anemoi Software walks us through a demonstration if the company’s cloud-based thermal modeling tool for multichip modules, stacked die, and chiplet integration.
Monita Pau of Onto Innovation talks about the importance of particle inspection for hybrid bonding, and the focus on panel-level packaging.
Byron Exarcos, CEO ClassOne Technology, talks about the company’s plating and surface preparation process capabilities to support hybrid bonding, especially for microLED applications. The company introduced a new Solstice platform at the show and Exarcos reports that the company is already gaining traction.
Meg Conkling, of Veeco, joins the podcast for the third time – and she and Françoise compare notes about the markets since SEMICON West 2021. They discuss the automotive industry, and their next vehicles. They also talk about advances is Veeco’s Laser Spike Annealing, lithography, and ion beam deposition product offerings.
Jim Garstka, PlasmaTherm, talks about the impact of the chip shortage, the company’s latest product introduction, the HeatPulse, used in automotive electronics, as well as the role plasma dicing takes in providing clean die surfaces for die-to-wafer hybrid bonding.
Vidya Vijay, CyberOptics, talks about the latest generation WaferSense technology used for wafer and reticle calibration for front-end tools. She also talked about some of the presentations she attended at SEMICON West, and what she’s excited about.
Alex Chow, and Sai Danraj of YES about the company’s recent shift in focus from wafer segments for backend processes to the IC carrier substrate segments of the industry. The products they showcased included the next generation Vertacure, as well as two new products that will be introduced on the market in the coming year: one is for solder reflow, and the other for glass panel substrates.
This podcast episode was recorded live at SEMICON West 2022 at the Moscone Center in San Francisco, where critical discussions about the latest issues impacting the semiconductor industry took place.
Françoise von Trapp speaks with Joe Stockunas, the new President of SEMI Americas; Ajit Manocha, SEMI CEO and President; Mousumi Bhat, who heads up SEMI’s Sustainability Initiative, and Shari Liss, Executive Director at SEMI Foundation, who talk about some of the week’s highlights.
While Joe is new to trade organizations, he brings over 40 years of industry experience in executive positions to this role. During the conversation, he talks about how his perspective as a long-time SEMI member gives him insight on how to serve the membership. He also shares highlights of SEMICON West 2022, and takeaways from the keynote talks. To wrap up his interview, Joe touches on future plans for SEMICON West, and his top priorities for SEMI programs for the Americas.
With Sustainability as one of SEMI’s main priorities, there was an entire day and a half devoted to it, with the Sustainability Summit and Sustainability Start-Up event. The interview with Ajit Manocha and Mousumi Bhat focuses on the critical situation of climate change, and the role SEMI is playing to support industry-wide collaboration in setting achievable goals so that we can half our carbon footprint by 2030, and net zero by 2050. They also discuss next steps and top priorities for a Semiconductor Industry Sustainability Roadmap.
Lastly, Françoise speaks with Shari Liss about SEMI’s new career platformed to help diversity and grow the U.S. semiconductor workforce. They talk about the microelectronics industry’s image and awareness program, and what SEMI Foundation is doing to address it. Shari unveils the details of the career platform, which is designed to help students understand what skills they have, which they need to develop, and how they can apply this skills to a career in the semiconductor industry.
Learn more about the Sustainability Initiative here
Learn more about the Career Platform here
Find our guests on LinkedIN:
- Ajit Manocha, CEO and President, SEMI
- Joe Stokunas, Presideint, SEMI Americas
- Mousumi Bhat, VP, SEMI Sustainability Programs
- Shari Liss, Executive Director, SEMI Foundation
Françoise von Trapp interviews Thomas Smelker, of Mercury Systems, about what is meant by “Trusted and Secure” microelectronics, and why it is critical to Mercury’s military, aerospace, space, and industrial customers.
He then does a deep dive into the geopolitical climate, the “actors” are trying to take away the technological advantage the US and its allies have. Tom explains why trusted and secure microelectronics are more important now than ever, as well as why it’s important to bring leading-edge 2.5D and 3D advanced packaging to its DoD customers. They discuss the impact of the supply chain issues on reshoring, procuring rare-earth minerals, and adhering to ESG efforts, as well as making sure their supply chain partners are trusted and secure.
The company just opened a new facility in Phoenix Arizona. Tom gives Françoise take a tour of the facility, and they take our listeners along to hear all about it. As Tom walks us through the facility, the conversation shifts to chiplet integration, and the company's capabilities in these leading-edge technologies. Photos of the original ribbon cutting can be found here on the 3D InCites website.
Contact Tom Smelker on LinkedIN
Learn more about Mercury Systems
ASE’s Mark Gerber, Amkor’s Curtis Zwenger, and Quorvo’s Matthew Poulton talk about 5G Technology Challenges; Synopsys' Ming Zhen talks about the Era of SysMoore; Start-up competition competitors give mini-pitches.
While the rollout of 5G is underway, there are remaining technology challenges that must be solved before we can really experience the full benefits of 5G. This was the topic of for the panel discussion at the IMAPs SiP Conference. We invited the panelists to talk about it on the podcast: Mark Gerber from ASE, Curtis Zwenger of Amkor, and Matthew Poulton, Qorvo.
We talked about the hype around the 5G that’s been deployed today, vs mmWave technology needed for new 5G. We also discussed the challenges for the advanced packaging community to develop the technologies needed to support the higher frequencies needed to support 5G. Questions asked and answered include:
· Why are 5G download speeds no better than LTE today?
· Is what we are experiencing in 5G really truly 5G?
· What needs to happen for 5G to be ready for automotive applications?
· Why do we experience more dropped calls on a 5G phone than LTE?
Ming Zhang, Synopsys, talks about his career path from his Ph.D. in rad-hard circuit design, to IC design at Intel, chiplet design at Z-Glue, to Synopsys. Traditionally a front-end EDA company, Synopsys began to invest in advanced packaging design just a few years ago. He also talks about the new era of “SysMoore”, focusing on three enabling capabilities and opportunities for design: software, system, and security. The goal is to show How to get better chips, done faster, used by more people and things, focusing on the quality of product, speed of innovation, and scale of deployment.
Start-up Competition
David Levy, Mosaic Microsystems, talks about the company’s novel ViaFirm, a material used for temporary bond/debonding of active glass wafers to silicon handle for processing.
Merve Kecher, Sivers Semiconductors, talked about the technological advantages of the company's AIP module how it solves some of the remaining 5G challenges.
Haris Baset, Averatek, talked about the company's chemistries that unlock the full potential of lithography processes, photoresists, and dielectric materials. He also talks about the company’s SiliconDust authentication chiplet.
Chris Pfisner, Avacino Tech, explained that the start-up leverages blue micro LEDs as optical interconnects for short-reach, ultra power interconnects for chip-to-chip communications.
Guest Contacts
* Mark Gerber, ASE Global
* Curtis Zwenger, Amkor Technology
* Matthew Poulton, Qorvo
* Ming Zhang, Synopsys
* David Levy, Mosaic Microsystems
* Merve Kacar, Sivers Semiconductors
* Haris Baset, Averatek
* Chris Pfisner, Avacina Tech
Qualcomm’s Chidi Chidambaram talks about system technology co-optimization; ASE’s Mark Gerber Talks about the VIPack Platform; Daniel Graf, Zero EC, talks about solving data bottlenecks.
This episode was recorded live at the 2022 IMAPS Advanced SiP Conference, where the focus is on SiP technology developments, solutions and business trends. The first interview is with keynote speaker, Chidi Chidambaram, Qualcomm, who talked about system-level optimization opportunities and challenges in the era of slowing silicon process technology. In this podcast interview, Chidambaram explained why Qualcomm is not at the forefront of 3D IC and has focused on SiP solutions. He shared some of the key takeaways from his talk and answered Françoise’s questions about what he calls the connected intelligent edge, and why that’s important for the microelectronics industry. He also discusses the company’s position on chiplet technologies, and why it will be some time before they consider it for mobile applications.
Mark Gerber unpacks ASE’s new platform, VIPack. He talks about the motivation behind the platform. The capabilities of its core technologies and target applications. He also discusses the company’s role in the Universal Chiplet Integration Express (UCIe) as an effort to develop standardization for interfaces.
Daniel Graf, head of business development at Zero EC. The EC stands for Energy Connection. This start-up is an IP developer for semiconductor applications to solve data transport bottlenecks. He explains the challenges of data transfer, and how much energy is wasted during the process. Graf describes the solution his company has come up with to solve the issue.
Guest Contacts
- Chidi Chidambaram, Qualcomm
- Mark Gerber, ASE Group
- Daniel Graf, Zero EC
Kiterocket
A global strategic marketing agency serving the semiconductor and sustainability industries.
We are excited to share that we’ve partnered with SEMI’s Market Intelligence team to bring you quarterly semiconductor industry market updates. Each episode will feature one of SEMI’s market analysts, who will discuss different market trends driving specific areas of the market. They’ll also provide some high-level intelligence to help you in your day-to-day business decisions. In this first episode, we’re focusing on the Semiconductor Manufacturing Equipment Market. Guests include Sanjay Malhotra, Vice President of Corporate Marketing and the Market Intelligence Team, and Inna Skvortsova, one of the Analysts in the Market Intelligence Group.
Sanjay kicks off the conversation by providing information on the SEMI Market Intelligence team. He talks about the value he gained as a customer of SEMI reports during his tenure at Applied Materials. He describes the different offerings, and explains who uses SEMI data, and how.
Then, Inna dives into the reporting. She explains how the data is gathered, and how they ensure the reliability of the reports. In addition to providing some details on current year equipment market growth, she talks about the impact of the chip shortage on the equipment manufacturers, supply chain constraints, and other potential headwinds.
You can learn more about SEMI Market Reports here. Fo specific questions, email the Market Intelligence team at marketstats@semi.org.
Find our Guests on LinkedIn:
· Sanjay Malhotra, VP of Corporate Marketing and the Market Intelligence Team
· Inna Skvortsova, Market Analyst
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Françoise hit Technology Corner at the IEEE Electronic Components Technology Conference 2022, May 31-June 3, interviewing 3D InCites member companies about being back in person, and their perspectives of some of the key industry challenges such as supply chain issues, sustainability; diversity, equity, and inclusion efforts, new technology advancements, and much more.
Tanja Braun, Fraunhofer - IZM, accepted the 3D InCites Award and shared some of the results of the PLP consortium 2.0. We talked about the challenges of standardizing panel sizes, the progress made, and what’s next for a possible third-phase of development.
Diane Scheele, EMD, Ken Araujo, Namics; and Dean Payne, Indium all talk about the challenges materials suppliers in meeting sustainability requirements for semiconductor and microelectronics manufacturing.
John Park, Cadence, talks about how EDA tools for packaging have evolved from PCB based to chip design based. He also talked about the company’s new Thermal Solver tool, Celsius.
Patrick Parin, Micross, talks about the supply chain shortages, how it’s impacting the company, and the steps they are taking to anticipate and mitigate the situation.
Robert Avila, Finetech, talks about the company’s new die bonding platform, Pico 2. He also talked about dealing with lead times and price increases as part of the supply chain shortage.
Robin Davis, Deca, talks about the company’s Diversity Equity and Inclusion initiative that she leads, and what she likes about working there.
Dick Otte, QP Technologies, talks about the progress, or lack thereof, of the Chips for America Act and which companies are likely to benefit from the funding. He also talks about the changing telecommunications market, and massive increase in data rates between 10 years ago and today.
YES’s Zia Karim and Dragen Checic talked about a new partnership in Korea, and their new application lab coming soon in Chandler Arizona.
Habib Hichri of Ajinomoto Fine Tech, winner of our Material Supplier of the Year award, talked about the company’s ABF film used in substrates and assured us that even though there is a substrate shortage, there is no shortage of ABF film.
Matt Phillips, of our newest community member, SET NA, shares the company’s back story, and talks about their Ontos plasma cleaning system. He talks about the impact of the supply chain on the lead times for their different tools.
MST Group's Peter Putnam shares the process flow of product assembly through the partners companies, and talks about the impact of the supply chain and a new concept: design for supply chain.
Roland Rittenmeir, Evatec, talks about what he learned in attending the sessions. He also talked about the company’s role in chiplet integration.
In Part 1 of ECTC 2022 coverage, Françoise catches up with some of the industry visionaries at key companies in the microelectronics space, as well as 3D technology research institutes to find out what they shared and learned at ECTC 2022.
The episode kicks off with a conversation with Marvell’s Kevin O’Buckley who talked about key take-aways from the advanced packaging and co-packaged optics panel, and Chris Koopmans who shared some insight on the impact of supply chains on fabless semiconductor manufacturing, and how he thinks the $52B Chips Act funds should be allocated.
Paul Lindner, Dave Kirsch, and Thomas Uhrmann of EV Group talk about ECTC itself, and how much they enjoy reconnecting with colleagues after 2.5 years. They also talked about what they learned at ECTC 2022.
Laura Mirkarimi and Abul Nuruzzaman of Adeia (formerly Xperi) and Alan Huffman, of SkyWater, talk about recent advancements in hybrid bonding. They also provide some details about the new licensing agreement between the companies.
Sitaram Arkulgud, of TEL, shares some of the details of the presentations that TEL delivered on hybrid bonding. He explained the limits of chemical mechanical planarization, how they are explaining what to do when it runs out of steam, and how to keep hybrid bonding going when that happens.
Subramanian (Subu) Iyer, of the UCLA CHIPS program, explains why he believes chiplets should be called dielets. Why chiplets aren’t where they need to be yet to match the performance of monolithic chips, and the work they are doing at UCLA to get there.
As ECTC 2022 draws to a close, Françoise reminisces with IZM-ASSID’s Juergen Wolf, about 12 years of work in 3D integration technology.
Françoise wraps up the day with a glass of wine with ASE Fellow, Bill Chen, who has been instrumental in progressing the Heterogeneous Integration Roadmap. He talks about its purpose, the committee’s vision, and it will make possible the next 50 years of Moore’s Law, as Gordon Moore himself envisioned in the second part of his paper.
The semiconductor industry is on a rapid growth trajectory, with a goal of becoming a $1 trillion industry by 2030 – that’s only 8 years away! Getting there will require a tremendous amount of innovation, investment, and risk-taking – all characteristics that define an entrepreneur. But what does it really mean to be an entrepreneur in the semiconductor industry?
To find out, Françoise visited our 3D inCites community member, CyberOptics Corpation. The company’s president and CEO, Dr. Subodh Kulkarni, was recently named a finalist for the Ernst and Young Entrepreneur of The Year® 2022 Heartland Award. This is one of the preeminent competitive business awards for entrepreneurs and leaders of high-growth companies who think big to succeed.
During the interview, Dr. Kulkarni talks about the importance of resiliency and never giving up. He also explained his leadership approach at CyberOptics, and the importance of creating a family culture that fosters diversity and inclusivity.
Dr. Subodh Kulkarni
Kulkarni has been a director of CyberOptics Corporation since 2009 and has been the President and Chief Executive Officer since February 2014. He was the Executive Chairman from September 2013 to February 2014 and was the lead director from December 2012 until his election as Executive Chairman. From January 2013 to February 2014, he served as Chief Executive Officer of Prism Computational Sciences, a developer of software tools for scientific and commercial applications in the simulation of hot gases and plasmas used in the semiconductor industry. Prior to his work at Prism, he held various positions with Imation Corporation, including Chief Technology Officer; Senior Vice President, OEM/Emerging Business; and Vice President, Global Commercial Business, R&D, and Manufacturing. Prior to his employment with Imation, he held various research management positions with 3M Corporation and IBM. He currently serves on the Board of Directors of Key Tronic. He has won awards for commercializing technologies he and others have developed in the electronics industry. He holds a Master's Degree and a Ph.D. in Chemical Engineering from the Massachusetts Institute of Technology. He wrote his thesis on the surface decomposition of disilane, a chemical used to manufacture semiconductors.
He received a B.S. in chemical engineering from IIT—Bombay, India (where he was first in his class).
In our continued coverage of the chip shortage and actions being taken around the globe, this episode looks at the raw materials market, and how different aspects of it are impacting the semiconductor supply chain. Françoise speaks with Lewis Black, CEO of Almonty Industries, an international raw materials development company that mines tungsten – which is integral material in semiconductor chips and electronics. Tungsten gas used to create a nanolayer coating on the inner workings of semiconductor chips to make them dissipate heat better and run more efficiently.
The conversation covers a lot of ground – how the shift to electric vehicles is increasing the need for semiconductor devices and how that impacts raw materials supply; the impact of the pandemic and the geopolitical situation; the US push to onshoring that is driving US domestic manufacturers to seek alternative choices to China and Russia for tungsten; as well as the importance of environmental social governance driving companies to more ethically sourced raw materials supplies. We also talk about the $52 billion expected to be dispersed once Congress passes the Chips for America Act.
About Lewis Black:
Lewis Black is CEO of Almonty Industries, a leading global company involved in the mining, processing, and shipping of tungsten concentrate, and has over 15 years of experience in the tungsten mining industry. From June 2005 to December 2007, he was Chairman and CEO of Primary Metals Inc. (“PMI”), a former TSX-V-listed tungsten mining company. Black also formerly served as head of sales and marketing for SC Mining Tungsten, Thailand. In addition, Black is well-versed in the global rare earths market, the current supply chain for those rare earths, and what’s to come in diversifying the supply chain as demand continues to increase. Connect with Lewis Black on LinkedIn. Learn more about Almonty.
Kiterocket
A global strategic marketing agency serving the semiconductor and sustainability industries.
The semiconductor industry’s role in creating a sustainable world continues to be one of the hottest topics of discussion. At the SEMI Industry Strategy Symposium 2022, almost every presentation addressed the issue in one form or another. In this episode, Françoise speaks with Marshall Chase, director of sustainability at Micron. Marshall’s entire presentation at ISS was on this topic.
Topics of discussion include:
· The feasibility of semiconductor companies reaching Net Zero Emission Goals by 2050, and ways that can be achieved.
· Different approaches companies are taking
· The 17 Sustainable development goals, and how they apply to the semiconductor industry
· The business advantages of establishing an Environmental Social Governance roadmap
· The role sustainability plays in attracting talent to the industry
· The impact of the pandemic on semiconductor sustainability efforts
· Micron’s approach and commitment to sustainability
Learn more about Micron’s Pact for Impact
Contact Marshall Chase
Kiterocket
A global strategic marketing agency serving the semiconductor and sustainability industries.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
SEMI Europe’s Laith Altimime joins Françoise for a conversation about how the Ukraine War is impacting Europe in general, and specifically the European semiconductor industry supply chain. Laith explains what SEMI is doing to support the semiconductor supply chain crisis.
On a brighter note, they also talk about the outcome of the recent European Chips Act. Europe wants to go from owning 9% to 20% of the worlds chip manufacturing. The European Chips Act that was passed adds €15 billion to an existing €30 billion in public investments to create new STEM-focused programs, attract new talent to Europe, and build new infrastructure.
Lastly, Laith invites everyone to learn more at the upcoming ISS Europe, which takes place in Brussels, Belgium, on May 30, 2022. Learn more and register here.
Contact Laith Altimime
Kiterocket
A global strategic marketing agency serving the semiconductor and sustainability industries.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
As we all know, events of the last two years that are beyond our control – such as the pandemic, geopolitical issues, trade wars, and the war in Ukraine - have had a significant impact on the semiconductor supply chain, sending us scrambling for workarounds and playing catch-up. What if we had been better prepared to proactively address these issues? At SEMI ISS Bindiya Vakil, Co-founder and CEO of Resilinc, presented a talk titled, Designing Risk-Ready Supply Chains for the Post-COVID World. In this conversation, Bindiya talks about the power of mapping and real-time monitoring of potential disruptions to create a robust supply chain. She says mapping and monitoring allow you to proactively outline the worst-case situations, collaborate with your suppliers, take deliberate action and protect knowns based on available information.
Contact Bindiya Vakil
What’s changed about ISS since 2020? The attendees were 20% women – and specifically, women in leadership. To celebrate, we gathered some of our SemiSisters for a conversation over breakfast and recorded it as a podcast episode. We talked about lots of things – what it’s like to be a woman in this male-dominated industry, our personal career journeys, and how we navigated the pandemic. We also talked about all the opportunities for women in engineering, and other STEM degrees, as well as non-STEM career paths; the benefits of mentorship; and more. The conversation meanders and goes off on tangents, and there is a LOT of laughter. This was so much fun to make. Here’s who participated. You can find them on LinkedIn.
Debbie Gustafson, CEO Energetiq
Meg Conkling, Director, Global Key Accounts Veeco
Emerald Greig, Surplus Global
Lubab Sheet-Davis, VP at Lam Research Corporation
Cat Nylund, Director of Sales / Business Development, Rogue Valley Microdevices
Nerissa Draeger, Ph.D, Director of Global University Engagements at Lam Research
Kiterocket
A global strategic marketing agency serving the semiconductor and sustainability industries.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
We spent the week of April 4-8 at the SEMI Industry Strategy Symposium, where industry leaders gathered to discuss the key issues facing the semiconductor industry, and set goals for the next year – and beyond. In this episode, Françoise talks with some of the market analysts who presented their 2022 projections: Jan Vardaman, of TechSearch International, Andrea Lati of TechInsights, and Bob Johnson, of Gartner.
This conversation touches on all the key points that are currently top of mind for the semiconductor industry, from the impact of the inflation, the pandemic, the geopolitical situation, and the global economy to critical supply chain shortages, the talent shortage, and more. Questions include:
· How will all of these headwinds impact 2022 projections?
· Will the industry really reach $1T in revenue by 2030, and what happens if we don’t?
· How should the $52B of the Chips Act Funding be allocated?
· When will we start to see the results of Intel’s IDM 2.0?
Contact the Speakers
Jan Vardaman, TechSearch International
Andrea Lati, TechInsights
Bob Johnson, Gartner
SEMI’s annual Industry Strategy Symposium (ISS) took place April 4-7, 2022 at the Riz Carlton resort in Half Moon Bay, CA. The event usually takes place in January, but due to Omicron, was postponed at the last minute and rescheduled to April. This annual event is where industry leaders gather for mission-critical discussions that the strategies for the year ahead. Over the course of the week, we recorded six episodes, speaking to presenters and attendees about the hottest topics in the semiconductor industry.
In this first episode, Françoise speaks with Kristian Yerygin, Chief Commercial Officer of Recycling Solutions, Ukraine. Yerygin attended ISS representing Arnox, a strategic waste and byproduct management company that is part of a Ukrainian steel conglomerate, and supplier of Neon, Xenon, and Krypton. These rare gasses are critical for lithography processes used in semiconductor manufacturing. Yerygin explains in detail the impact of the Russian invasion of Ukraine, the toll it’s taking on the steel industry, and subsequently the supply of Neon, Xenon, and Krypton. He explains what it could mean for the semiconductor industry and what semiconductor manufacturers need to do to prepare for an inevitable shortage of these rare gasses.
Contact Kristian Yerygin on LinkedIn.
Kiterocket
A global strategic marketing agency serving the semiconductor and sustainability industries.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
In 2021, there was a changing of the guard at the International Microelectronics and Packaging Society. In this episode, Françoise speaks with new IMAPS President, Beth Keser, and President-elect Erica Folk, about their vision for IMAPS going forward.
Beth and Erica provide details on three major initiatives: One is to create awareness in the US Government and defense industry about the importance of packaging in the semiconductor industry. The second is to bring in more academics and students into the society. Students are the future of the microelectronics industry. Third, they want to update the IMAPS documentation to modernize the bylaws and rules that govern the organization. We also talked about the activities of the IMAPS Foundation. They are launching a competition to get universities excited. Learn more here.
Contact our Speakers on LinkedIn
· Beth Keser, IMAPS President
· Erica Folk, IMAPS President-elect
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
In addition to our 3D InCites Award Winners, we caught up with some of our members who had news and stories to share at IMAPS DPC, March 8-10, 2022.
In this episode, Françoise speaks with Bob Connor, of member company X-Celeprint, about the Micro Transfer Process (MTP) a massively parallel pick and place technology that has been around since 2007, but is starting to get traction new applications in the heterogeneous integration space.
Next, she speaks with Darby Davis of Gel-Pak, a Delphon Company, who explains the relationship between Delphon Industries and its subsidiary companies. Gel-pak is a different sort of advanced packaging. While they aren’t involved in building microelectronics, they are critical to the supply chain as they are used for packaging and handling fragile devices. They come to IMAPS DPC to learn about what’s happening in the industry to stay on top of their technology development.
The episode wraps up with a conversation with Abul Nuruzzaman, Xperi Corporation, in which they unpack the elements of a recent two-pronged press release about a new license agreement with Micron, and a new brand for the Xperi IP business – Aediea.
Contact our Speakers on LinkedIn
· Bob Conner, VP Business Development, X-Celeprint
· Darby Davis, VP Sales, Delphon Industries
· Abul Nuruzzaman, VP Marketing, Xperi Corporation
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
The topic of the 2022 IMAPs Global Business Council Spring Meeting, co-located with the IMAPS Device Packaging Conference, was Onshoring for the Department of Defense (DoD). Since the last time we visited the Onshoring packaging to the US question, the Chips Act has been passed, and now Congress is trying to decide how to appropriate the 52Billion in incentives.
Simultaneously, the already-funded State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) program has been launched to develop a sustainable business and operational model to provide the DoD with access to domestic sources of SOTA digital and radio frequency packaging. It’s believed that sustained access to SOTA packaging will foster significant system performance increases, which will enable military system modernization and support next-generation capabilities.
In this episode, we speak with Jim Will of Skywater Technology and John Lannon, of Micross AIT. Both presented as part of the GBC plenary session. We talk about how the $52Billion would best be appropriated. We also talk about the concerns that this might be just a temporary solution, and what the outcome will be if it’s not sustained.
We also speak with Keynote Speaker, Darrin Crum, Technical Lead of the SHIP Program, and Tom Smelker of Mercury Microsystems, the performer that provides the classified environment needed to keep the program secure. Crum and Smelker explain how the SHIP program works, who is involved, and how chiplets and other heterogeneous integration technologies can make it possible to quickly bring SOTA to the defense community.
Contact Today's Speakers on LinkedIn:
- James Will, SkyWater Technology - A&D BU Director
- Dr. John Lannon, Micross Advanced Interconnect Technology - General Manager
- Darren J. Crum, Naval Surface Warfare Center, Crane Division - Technical Lead of the SHIP Program for OUSD(R&E) – Modernization Microelectronics
- Tom Smelker, Mercury Systems – VP& GM, Microsystems
To learn more, read Tom Smelker's blog post, Enabling a Trusted Domestic Microelectronics Ecosystem.
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
We presented the 2022 3D InCites Awards in person on March 10 at the IMAPs Device Packaging Conference. Rather than acceptance speeches, we carved out time throughout the week to interview some winners for the 3D InCites podcast. In this, the first of two episodes we speak with the following award winners and asked them to share their success stories with our listeners.
First up, a conversation with EMD’s Jeff Catlin, about the company’s commitment to sustainable semiconductor manufacturing. EMD is our 2022 Sustainablity Award Winner.
Next, you’ll hear from John Lannon of Micross AIT, about the company’s legacy of 3D IC technology development. Micross is the 3D InCites Devices manufacturer of the year.
Craig Bishop, CTO of Deca, Process of the Year winner, talks about Gen 2. of Adaptive Patterning. He also share’s his personal story of how he came to be part of the advanced packaging industry. It all began with a conversation with his neighbor, Tim Olson, CEO of Deca…
Shelby Nelson, CTO of Mosaic Microsystems, winner of Start-up of the Year, share’s the company’s origin story as women-founded company, through its growth today.
ERS electronic GmbH is the 2022 Equipment Supplier of the Year, and Debbie Claire Sanchez joined us to talk about the highlights of the paper she presented on the company’s advances in thermal debonding. She also shared some of her back-story of working at Deca.
This year’s Herb Reiter Design Tool Award went to Cadence. We spoke with John Park about the company’s first-of-its-kind comprehensive, high-capacity 3D-IC design platform. He also clarifies the difference between a SiP and a chiplet architecture from a design perspective.
Raja Swaminathan gives an acceptance speech for the DEI Award, explains the role of a Sr. Fellow at AMD. He also talks about AMD’s 3D V-Cache, and explains what he means by True 3D. We continued the discussion of the different between a SiP package and a Chiplet package.
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and we at 3D InCites are very excited! It’s been two years since the event took place in person. In fact, it was the last event I attended before the world shut down – literally two weeks later. Even then, the buzz was about COVID 19, elbow bumping and hand sanitizing. Masks weren’t even a thing yet. It was also the last time we held the 3D InCites Awards Ceremony in person. Last year, we went virtual. So we thought it would be great to kick things off and generate some excitement by inviting Beth Keser, IMAPS new President, and Jim Haley, VP of Marketing, to talk about what’s in store for attendees. We talk about the programming, the exhibits, networking opportunities, the collaboration between 3D InCites and IMAPS to bring you future podcast episodes and more.
Here's where you can learn more about what we discussed:
· IMAPS Device Packaging Conference Program and Registration
· IMAPS Golf Outing
· 3D InCites Award Winners
· Hike for DEI
Email Françoise for DEI Sponsorship information or to sponsor a podcast episode
Beth Keser, Ph.D. is a recognized global leader in the semiconductor packaging industry with over 24 years of experience. She received her B.S. degree in Materials Science and Engineering from Cornell University and her Ph.D. from the University of Illinois at Urbana-Champaign. Beth’s excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 34 patents and patents pending and over 50 publications in the semiconductor industry. Based in San Diego, Beth leads Intel’s Packaging & Systems Technology department in the Product Enablement Solutions Group. Beth is currently IMAPS President and has taught a Professional Development Course on Fan-Out Wafer Level Packaging at conferences since 2015.
Connect with Beth Keser on LinkedIn
James Haley is a passionate leader with cross functional experience in early adoptive and fortune 100 companies. Background and experience range in bridging businesses from start up to commercial success. Active areas of expertise business strategy, strategic marketing, product development and strategic selling in prior companies.
Mr. Haley received his Bachelor of Business Degree from St. Norbert College in Wisconsin. He participates in several organizations relating to the electronics industry and is an active member in IMAPS, IPC and the USPAE.
Connect with James Haley on LinkedIn
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
One of our most listened-to episodes in Season 1 was on the importance of package design for chiplet integration. For those of you who are new to this podcast and chiplet technology, in a nutshell: Chiplets are hardened blocks of IP of different semiconductor technology nodes that result from disaggregating – literally taking apart a System-on-Chip. These blocks are then reintegrated asa single package using high-speed interfaces to deliver greater performance at a reduced cost, higher yield, and lower power with only a slightly larger area than a heterogeneous integrated advanced package.
Chiplets are big news right now for companies like Intel, AMD, and TSMC – but one of the challenges for broadening the market is the lack of standardized models. To address this, the Chiplet Design Exchange was created.
In this conversation, Françoise talks to Anthony (Tony) Mastroianni of Siemens EDA and Jawad Nasrullah Palo Alto Electron, Inc. to demystify all of this – especially for those who are not fluent in chip and package design.
You’ll get some back-story on the evolution of chiplets, and the importance of standardizing chiplet models and workflows for the chiplet ecosystem. You’ll also learn about the Chiplet Design Exchange, what the goal is, and how you can become involved.
Meet the Speakers
Tony Mastroianni has more than 30 years of experience as an engineer and engineering manager in the global semiconductor industry. In recent years, he has focused significantly on advanced ASIC package design flow development (2.5/3D). He currently leads the development of Advanced Packaging Solutions for Siemens Digital Industries Software. Prior to joining Siemens, he served in engineering leadership positions at Inphi and eSilicon. He earned a bachelor’s degree in electrical engineering from Lehigh University and a master’s in electrical engineering at Rutgers University. Email Tony.
Jawad Nasrullah is a chip designer with expertise in chiplets, microprocessors, HW/SW co-design, and SerDes. Previously Jawad was the co-founder and CTO of zGlue, Inc., a Silicon Valley chiplet startup that set the direction of chiplet technology and developed a number of heterogeneous integrated circuits. Jawad is now working on his next adventure, Palo Alto Electron. Jawad has been very active with the ODSA workgroup within OCP to help catalyze chiplet ecosystems. Before zGlue, Jawad has held leadership positions at Intel, Samsung, Sun Microsystems, and Transmeta. Jawad holds a Ph.D. degree in Electrical Engineering from Stanford University. Email Jawad
The Chiplet Design Exchange is part of the Open Domain-Specific Architecture (ODSA) Sub-Project under the OCP Server Project. Learn more here.
Workforce development is a critical and ongoing challenge in the microelectronics industry. SEMI Foundation is working to build awareness about the opportunities that come with a career in microelectronics through its Industry Image and Awareness Campaign. Part of that initiative is a partnership with Roadtrip Nation to create a video and documentary series focused on the microelectronics industry.
In this episode, I talk with Shari Liss, Executive Director of SEMI Foundation. She explains how for young people interested in STEM, the semiconductor is still fairly invisible. They know all about social media apps, but they don’t understand the microelectronics that underpin all these devices. The goal of the Image and Awareness Campaign is to bring the semiconductor out of obscurity, so they can understand what opportunities are available to them.
To this end, SEMI Foundation has partnered with the Council for Adult and Experiential Learning (CAEL) and Roadtrip Nation to provide opportunities to students who are interested in learning more about this exciting industry. Listen in to learn all about these programs and how your company can participate and support these efforts.
You can learn more about SEMI Foundation’s workforce development efforts here.
If you’re interested in becoming involved in SEMI Foundation’s Road Trip Nation initiative, contact Shari Liss.
A leading manufacturer of innovative semiconductor and flat panel display production equipment, TEL believes its employees are central to its success. That’s why TEL is committed to employing people with diverse cultures, backgrounds, and values. The company has offices and manufacturing facilities located in 12 countries around the world. To see if TEL is a good fit for you, check out their careers page at Tel.com/careers
TEL
Tokyo Electron (TEL) provides innovative semiconductor and flat panel display production equipment.
We’re kicking it off Season 2 of the 3D InCites Podcast with a conversation about CES 2022. As you probably know, the Consumer Electronics Showcase took place Live in Las Vegas earlier this month. The official attendee report is 45,000 in-person attendees and 2300 exhibitors, as well as 1800 global media representatives. 1/3 of the attendees were from outside the US. Sounds like big numbers – but that’s only about ¼ of the usual turnout, according to the Las Vegas Review-Journal. The show closed a day early because of Omicron – and many tech publications didn’t send editorial teams and chose to cover it virtually instead.
Martijn Pierik, CEO at Kiterocket, did attend in person, and he’s here with me today to give us his perspective on the first Live CES experience since COVID began. From the process of getting through the COVID protocols to get into the show, to traveling in style between the halls, to the overall atmosphere, and of course some of the technology highlights, he shares it all.
We also talk about this year’s focus on the Metaverse, cryptocurrency, sustainability and repairability, automotive, wellness, and the home. We also talk about how CES 2022 reflects the changing behavior of people as they adjust to the new normal of events post-pandemic.
To learn more about how Kiterocket, visit Kiterocket.com. To connect with Martijn, find him on LinkedIn, or just drop him a line at Martijn@Kiterocket.com
In this episode, sponsored by EMD Electronics, Françoise speaks with Anand Nambiar, who heads the semiconductor materials business of EMD Electronics, a business of Merck KGAA Darmstadt, Germany. In addition to providing his perspectives on the chip shortage, supply chain issues, and managing the growth of the semiconductor industry, he shared some exciting news. First, he talked about Level-Up, EMD’s program to step into the next decade with the right level of capability. These 3.5 billion global investments in the company’s global capacity and R&D include $1B earmarked for US locations alone.
He also talked about Athinia, an independent company that is a joint venture between Merck KGaA, Darmstadt, Germany and Palentir Technology. The partnership is aimed at delivering a secure collaborative data analytics platform for the semiconductor industry. The Athinia platform will leverage AI and big data to improve supply chain transparency and tackle chip shortage.
This episode is brought to you by EMD Electronics, helping to build a smarter, more connected world through the development of high-tech materials and solutions vital to our everyday lives. Learn More at EMDGroup.com.
Connect with Anand Nambiar on LinkedIn.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
EMD Electronics
Helping to build a smarter, more connected world by developing high-tech materials and solutions.
As part of our SEMICON West Hybrid 2021 podcast series, Françoise spent lots of time on the show floor, catching up in person with 3D InCites community members and other industry experts to find out how business has been since the last time they saw each other at SEMICON West in 2019. In addition to talking about what they are showcasing in their booths, top of mind topics included the chip shortage, supply chain issues, the talent shortage, managing growth, efforts in sustainable manufacturing, and their hopes and dreams for 2022.
In this third episode, we hear from:
- Joe Montano of Delphon Industries, one of our newest community members. He talked about the company’s three brands that serve the semiconductor industry – Gel-Pak, TouchMark, and UltraTape. He shared how the supply chain shortage impacted the company and talked about Gel-Pak’s latest offering for transporting ultra-thin die.
- Kenton Read of Evatec, specialists in sputtering and evaporation technology for thin-film applications. He talked about a new evaporation platform that hooks up to a central handler. They also showcased their Clusterline 300 platform for advanced packaging. They are focused on the future of heterogeneous integration and the advantages their knowledge base across different technologies brings to the table.
- Meg Conkling of Veeco, who recently joined the company as Director of Global Accounts. She talked about how great it is to meet in person at SEMICON West and have the real conversations that you can’t have on Zoom. We discussed the challenge of shortening the supply chain to meeting growing needs of customers, particularly in the face of fab expansion. She says she thinks things will begin to normalize in 2022. She also talked about the company’s plans to double its capacity. The company showcased its Altair platform, a backend lithography tool that provides solutions for the packaging world.
- Emerald Grieg of SurplusGlobal, supplier of secondary semiconductor equipment. She talked about the great quality of conversations she had this year at SEMICON West, because it wasn’t crowded and rushed. All the topics we’ve been discussing this week are the ones that are top of mind for her customers. One of the issues they’re dealing with is the vicious cycle of not having chips to build the tools to make the chips. SurplusGLOBAL’s big news is its new state-of-the-art cluster facility and what it has to offer customers for demoing and testing their equipment locally in Asia.
Find all of today’s speakers on LinkedIn:
- Joe Montano
- Kenton Read
- Meg Conkling
- Emerald Grieg
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
As part of our SEMICON West Hybrid 2021 podcast series, Françoise spent lots of time on the show floor, catching up in person with 3D InCites community members and other industry experts to find out how business has been since the last time they saw each other at SEMICON West in 2019. In addition to talking about what they are showcasing in their booths, top of mind topics included the chip shortage, supply chain issues, the talent shortage, managing growth, efforts in sustainable manufacturing, and their hopes and dreams for 2022.
In this second episode, we hear from:
- Rama Puligadda, Kim Arnold, and Alex Smith of Brewer Science, who talk about the company’s growth, its strength in culture as they navigated through the pandemic, about the company’s efforts to foster tenure, helping employees to grow in their career paths, and focusing on diversity, equity and inclusion.
- Subodh Kulkarni, CyberOptics, who talks about the company’s inspection sensor technology product lines, and how they are addressing the complex needs as heterogeneous integration, chiplets, and 3D packaging take hold. We also talked about how the supply chain and talent shortages have impacted CyberOptics.
- Bob Smith of SEMI’s Electronic System Design Alliance, who talks about the important work this technology community does in risk management for the EDA industry, for example, the anti-piracy effort to top the theft of software licensing that plagues the industry and costs billions of dollars annually.
- Jonas Discher of PlanOptik, who shared his experience traveling from Germany to attend SEMICON West. He shared that the company celebrated two anniversaries this year – 40 years as a company and 20 years for its location in the U.S. He also talked about the development of copper-plated through glass via (TGV) wafers that allow for interconnection via conductive material through the holes in the wafers. The company kicked off its first project with customers for interposers for 3D wafer-level packaging.
Find all of today’s speakers on LinkedIn:
- Rama Puligadda
- Kim Arnold
- Alex Smith
- Subodh Kulkarni
- Bob Smith
- Jonas Discher
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
As part of our SEMICON West Hybrid 2021 podcast series, Françoise spent lots of time on the show floor, catching up in person with 3D InCites community members to find out how business has been since the last time they saw each other at SEMICON West in 2019. In addition to talking about what they are showcasing in their booths, top of mind topics included the chip shortage, supply chain issues, the talent shortage, managing growth, efforts in sustainable manufacturing, and their hopes and dreams for 2022.
In this first episode, we hear from:
- Dragan Cekic and Victoria Barnes of YES, who talk about the importance of maintaining proximity to customers; and their approach to talent acquisition across the globe as the company expands its infrastructure to provide “boots on the ground” support to customers locally.
- Faraz Shoukat and David Ratchkov of Anemoi Software – a brand new start-up that has developed thermal solver solutions for 3D IC and heterogeneous package design. They share their origin story, how they identified the problems with thermal management and teamed up to develop the solution.
- Garret Oakes and Dave Kirsch, of EV Group, who talk about how EVG is handling industry growth, and growth as company, and EVG’s Heterogeneous Integration Competence Center makes it possible to support HI designers who can come in and use technology to develop their solutions.
- Mike Plisinski, CEO of Onto Innovation, who talks about navigating a merger, acquisition, and re-brand through the pandemic followed by the rapid growth of the company. He also talks about the company’s competitive edge with AI technology implemented in its tools to support smart manufacturing.
Find all of today’s speakers on LinkedIn:
· Victoria Barnes
· Dragen Cekic
· Dave Kirsch
· Garret Oakes
· Mike Plisinski
· David Ratchkov
· Faraz Shoukat
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
This week (December 7-9) at SEMICON West in the Workforce Development Pavilion, one of the overarching topics has been how to address one of the current supply chain crises – not the chip shortage – but the talent shortage. If you’ve been following the news, you know that in response to the chip shortage, chip manufacturers and their suppliers are adding capacity at a furious pace. According to SEMI, 29 new fabs will break ground globally between now and 2022. But who will staff them? With 34,000 current vacancies in the semiconductors industry worldwide, companies large and small are already competing for the same talent pool.
In this episode, Françoise von Trapp speaks with Debbie Gustafson, CEO of Energetiq, Scott Balaguer, Vice President, and General Manager Semiconductor Division North America, and Emma Cheer, who is leading the DEI efforts at GlobalFoundries. They shared their insights and provided examples of what their companies are doing to both retain their existing workforce and recruit the next generation of semiconductor talent.
If you'd like to reach today's panelists, you'll find them on LinkedIn.
Debbie Gustafson, Energetiq
Scott Balaguer, Edwards Vacuum
Emma Cheer, Global Foundries
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
At SEMICON West Hybrid 2021, everyone was talking about the impact of the chip shortage, global fab expansion, the talent shortage, and the over-arching topic of the importance of sustainable semiconductor manufacturing. We spoke with Ajit Manocha, CEO of SEMI, to get his perspective on all these issues, and the role SEMI plays in providing a collaborative environment to find solutions.
On the topic of global fab expansion, he noted that between now and 2024, there are plans to open 25 8-inch fabs and 60 300mm fabs around the world. This added 300mm capacity represents 48% growth – a number he says he’s never seen before. The revenue attached to that is an increase from $550B this year, to $2.2T by 2030.
Manocha also shares some key takeaways from his fireside chat with Deputy Secretary of Commerce, Don Graves, and how the US Government is finally understanding the important role the semiconductor industry plays in our lives, from accelerating the development of the vaccine to ensuring national security.
And lastly, as an industry with a massive carbon footprint, yet with devices that help other industries reduce theirs, we find ourselves in a bit of a conundrum. How do we continue to support market demand for more and more chips without having a negative impact on climate change? As an industry organization, SEMI is on the case, and Manocha provided some details on the establishment of the Sustainable Advisory Council.
You can learn more about SEMI here.
Connect with Ajit Manocha on LinkedIN
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Do you suffer from FOMO – Fear of Missing Out? Our host, Françoise von Trapp, does. She had it bad when she couldn’t attend SEMICON Europa in November, and instead had to watch it play out on social media. So, she decided to invite some 3D InCites Community Members who were able to attend to join her in a round table discussion on the 3D InCites Podcast to fill her in on everything that she missed. The result is an eclectic discussion about how the venue handled COVID 19, some of the program highlights, activity on the exhibit floor, and juggling multiple SEMICON events in a relatively short period of time. The panel includes:
· Sally-Anne Henry and Jim Strauss, of ACM Research
· Thomas Uhrmann of EV Group
· Sophia Oldeide of ERS Electronic
· Silvia Poppa of Atotech
In this second SEMICON West preview episode, Françoise von Trapp talks with James Gellert, Chairman, and CEO of RapidRatings, a financial health, data, and analytics company based in New York City.
James is delivering a keynote talk at SEMICON West titled - The Second Wave: Risk in Part Two of the Supply Chain Crisis.
For years, we’ve seen advanced technology like artificial intelligence, machine learning, and 5G - all underpinned by semiconductor chips and sensor technologies, create opportunities for almost every industry we can think of.
And now we’re in the midst of a global chip shortage and everyone is talking about the impact it's having on the global supply chain – and I’m not just talking about those of us who work in the semiconductor industry. These stories are making headlines in mainstream media.
What’s not being talked about is a potential second wave of disruption of this crisis as the situation drags on. That’s what James is going to address in his keynote.
In this preview podcast episode, James explains some of the key points he’ll be discussing in-depth during his presentation, and who will benefit from hearing what he has to say.
For example, you’ll hear about:
- The challenges companies are having to stay afloat, and how to watch for those in your supply chain who are struggling.
- Why two layers of risk management in the supply chain is needed to handle both the crisis of the day and also the longer-term process
- How the failure of critical suppliers will have a reverberating effect on the resiliency of the whole supply chain.
- What can be done to work with these critical suppliers through collaboration to help them succeed.
- How collaboration and transparency are the keys to having a resilient supply chain
·Who should attend? Anyone thinking about how their suppliers are doing through the crisis, as well as risk management of their own companies. Anyone who wants to prepare their companies to ride the second wave to a positive outcome.
If you're attending SEMICON West, you can hearJames' full keynote on Wednesday, December 8 | 10:20 am - 10:50 am, Keynote Stage, Moscone North, Lower Level, Room 24.
Register for SEMICON West here.
About RapidRatings RapidRatings provides a language around financial health that allows customers and suppliers to communicate effectively, to collaborate and to grow.
To learn more, email: info@rapidratings.com
Valuable resources are available at www.rapidratings.com
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
We are really excited to announce that the 3D InCites Podcast will be the official podcast of SEMICON West Hybrid 2021, which kicks off in just four short weeks on December 7.
SEMICON West in December? That’s right! Rather than holding it virtually for the second time in two years, the SEMI Americas team made a bold move - holding off until they could host a hybrid event. For many of us, it’s been a while since we’ve prepared for and attended an in-person event. Luckily, SEMI hasn’t missed a beat – first pivoting to virtual events, and then to hybrid events. This isn’t their first rodeo. So, if you’re feeling a little rusty, or if you’re new to the industry, you’re going to love this conversation with Sandy Chapin, show director of SEMICON West Hybrid 2021.
In this first episode of our SEMICON West Series, you’ll learn useful information like:
· What is involved in planning a hybrid event
· In-person virtual event highlights, and the best way to take it all in
· What it means to be co-located with the Design Automation Conference?
· COVID safety protocols
· And answers to frequently asked questions from exhibitors
We will be recording live from the floor at SEMICON West. If you’d like to be part of the fun, contact Françoise for details on participating and sponsoring.
Register here for SEMICON West.
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Hybrid bonding has been a big story in heterogeneous integration and particularly 3D integration for quite some time. At the recent IMAPS International Symposium, it seemed like every keynote speaker mentioned some sort of hybrid bonding as an enabler for next-generation technology. Everybody is talking about it, everyone wants it – in fact, Xperi recently announced a licensing agreement with YMTC for its DBI hybrid bonding process that the company will use for 3D NAND products. This is the first time DBI is being implemented in volume production for 3D NAND applications.
In this Member Spotlight interview, Xperi’s Craig Mitchell explains the technology behind DBI, the applications it enables, its implementation in 3D NAND, and much more.
To learn more about DBI, visit Invensas.com.
Do you have an interesting topic, a story to tell, or insight to share on the semiconductor and microelectronics industry? Tell us about it and you might just find yourself being a guest on our podcast.
We’re excited to announce that we’ve partnered with SEMI to be the Official Podcast of SEMICON West. Get ready for some interesting conversations! We’ll start dropping preview episodes next week, and then will be recording some episodes live at the show. If you’d like your company featured at SEMICON West, sponsored spots are available. For $500 we’ll interview you at your booth and include the interview in our Exhibitor wrap-up. No charge for 3D InCites members. Contact francoise@3DInCites.com to schedule your interview today.
This week, we’re wrapping up our conversations from the IMAPS International Symposium, with an extended episode. The questions I’m asking? How have the events of the last 18 months impacted the future of the semiconductor industry, and what are the three things we should be focusing on in advanced packaging right now?
You’ll hear from Jan Vardaman of TechSearch International; Ram Trichur of Henkel Corporation; Curtis Zwenger of Amkor Technology; Robert Avila, Finetech; Jon Medernach, MRSI; Dhiraj Bora, Silitronics; and Craig North, GelPak.
How have the events of the last 18 months impacted the future of the semiconductor industry?
Top of everyone’s mind for question one are things like adjusting to working from home, how tool suppliers adjusted their manufacturing, how the industry thrived despite the challenges, returning to in-person events and what that looks like, securing the semiconductor supply chain, sustainable semiconductor manufacturing, the geopolitical situation, the push to onshoring manufacturing to the US, rebuilding the microelectronics workforce.
What are the three things we should be focusing on in advanced packaging right now?
The importance of collaboration and consortia for heterogeneous integration; silicon photonics; chiplet integration and the need for standardization; increased package size and the implications for materials; advanced node technologies making it to the automotive industry, and much more.
You can connect with today’s speakers on LinkedIn.
- Jan Vardman, TechSearch International*
- Ram Trichur, Henkel Corporation*
- Curtis Zwenger, Amkor Technology*
- Robert Avila, Finetech*
- Jon Medernach, MRSI Systems
- Dhiraj Borah, Silitronics
- Mark Gerber, ASE Group*
-
Craig North, GelPak
-
3D InCites Community Members
Kiterocket
A global strategic marketing agency serving the semiconductor and sustainability industries.
If you liked Part 1 of Conversations from the IMAPS Symposium, you’re going to love part 2. While my questions are the same, the responses are quite varied. In this episode, you’ll hear from Andy Mackie of Indium Corporation, and Dirk Friebel, of Fraunhofer Institute, as we wrap up Day one of coverage. We’ll also give you a sneak peek of Day 2 with a conversation with Tom Gregorich of Zeiss Process Control Solutions.
So what are these questions? First, I asked how the events of the last 18 months have shaped the future of the semiconductor industry. Second, I asked what are three things that are impacting advanced packaging right now. In this episode, these questions sparked conversation around navigating through the pandemic, the return to in-person events, Fraunhofer’s presence in the USA and what it means, how electric vehicles are impacting advanced packaging requirements, who’s going to handle chiplet assembly, advancements in thermal interface materials, the need for inline X-ray inspection for high volume manufacturing, and all sorts of other things.
Thank you to today’s guests! Here’s where you can find them on LinkedIN:
· Andy Mackie, Indium Corporation
· Dirk Friebel, Fraunhofer Institute
· Tom Gregorich, Zeiss Process Control
Kiterocket
A global strategic marketing agency serving the semiconductor and sustainability industries.
We’re changing things up a bit for the next few weeks with a series of podcast episodes recorded live at the IMAPS International Symposium in San Diego. How we've missed those live events and the hallway conversations! We figured you did too, so we convinced some of our colleagues to sit down with Françoise and record them.
In this first episode, we talk with two of the panelists from Monday night’s Diversity and Inclusion Town Hall. Nicole Wongk of Honeywell is putting her chemical engineering background to work in advanced packaging and assembly. She's active in the company's Diversity and Inclusion initiative. Marqus Patton, a software analyst at Accenture Federal Service, is VP of the San Diego Chapter of the National Society of Black Engineers.
Next, I spoke with Cadence’s KT Moore, who delivered the only In-person keynote. KT is very active in Cadence’s DEI efforts, so we talked a bit about that before diving into the two questions that I asked everyone I spoke with – how have the events of the last 18 months shaped the future of the semiconductor industry. And what are the three things happening in Advanced Packaging right now that we should be watching? Everyone had something different to say – the next two episodes will feature the rest of those conversations. Here we go….
Contact our Speakers on Linked In:
- Nicole WongK
- Marqus Patton
- KT Moore
Kiterocket
A global strategic marketing agency serving the semiconductor and sustainability industries.
Globally, sustainability has become a much larger conversation than just taking steps to achieve zero carbon emissions. The UN has established 17 sustainable development goals that cover everything from climate change to diversity, equity, and inclusion. As the world becomes more socially conscious, it is no longer enough for a company to be profitable - they must also be purpose-driven - to make the world a better place. As a result, many semiconductor companies are elevating the importance of Environmental Social Governance efforts.
In this podcast episode, Françoise speaks with ASE’s Jennifer Yuen, and KLA’s John McLaughlin about their respective companies' approaches to achieving a successful ESG strategy. Topics of discussion include:
- Why putting sustainable development goals at the forefront is critical for the future of the semiconductor industry and the world
- What motivated the companies to develop an ESG strategy?
- What is the state of ESG in the semiconductor industry today?
- How do we create a holistic strategy that keeps the needs of all the stakeholders – employees, customers, investors, and suppliers?
- Important lessons to consider when putting together a strong ESG strategy
- And more…
Jennifer Yuen currently serves as Senior Director of Global Corporate Communications at ASE Group. Over her 20+ year career at ASE, responsibilities have included strategic marketing, customer and ESG communications, digital strategy, and media relations efforts worldwide. Her team is actively involved in the company’s sustainability development. She’s always had an interest in sustainability and her involvement over the past year has increased her passion for taking an active role in improving the company’s impact on the environment. You can contact Jennifer via LinkedIn.
John McLaughlin, is KLA’s Global ESG Leader, working across the value chain with suppliers and customers, as well as with business leaders across the company. He is also, president of KLA Foundation, and is responsible for the second global headquarters located in Ann Arbor Michigan. John is also available on LinkedIn.
Learn more about ASE’s commitment to ESG.
Learn more about KLA’s ESG strategy here, or download their global impact report directly.
Kiterocket
A global strategic marketing agency serving the semiconductor and sustainability industries.
Chiplets are the new “It” heterogeneous integration technology. Many believe they provide the solution to power, performance, area and cost (PPAC) for everything from mobile computing and automotive applications, to 5G, high-performance computing, and artificial intelligence. In this podcast episode, Françoise speaks with 3D InCites’ Community Members, Kevin Rinebold of Siemens EDA, and Robin Davis of Deca to explore how successful chiplet integration begins with a collaborative design flow.
To get started, we’ll get some of the chiplet back-stories, beginning with the advantages of disaggregating SoC into hardened IP blocks of different nodes, and reintegrating them on an “interconnect fabric.” From there, we define what we mean by chiplets, what differentiates them from system-in-package, and how different advanced packaging architectures can be implemented to create chiplet packaging. We also discuss the main challenges of designing chiplet packages; such as who owns the design? Is it the IC designer or package designer? How do we manage the die shift? How do we manage multiple designs?
Additionally, Kevin and Robin talk about their companies’ respective design kits, and how they are working together to enable a chiplet ecosystem.
Papers/presentations referenced by Kevin and Robin include:
Using a System Technology Co-Optimization Approach for 2.5/3D Heterogeneous Semiconductor Integration – Siemens EDA
Adaptive Patterning Techniques for the Chiplet Era – Deca
Contact the Speakers on LinkedIn:
Kevin Rinebold
Robin (Gabriel) Davis
Kiterocket
A global strategic marketing agency serving the semiconductor and sustainability industries.
In a global industry that relies heavily on collaboration, COVID 19 created a big pause and pivot in one of the key business development tools of the microelectronics industry: technology conferences and trade shows. In this podcast, we’re talking to several industry event organizers to get their take on the past year of what worked, what didn’t, and thoughts about the future of industry events as we transition back to in-person meetings.
Rich Rice, head of marketing for North America at ASE, represented IMAPS as he completes his year as society president. He talked about the challenge of providing the type of content expected by its members in a new and interesting way. Dave Anderson, President of the Americas for SEMI, offers some insight on the advantages of virtual events with regard to tracking and metrics, and how SEMI has worked to improve the experience for its members throughout the pandemic.
We talk about how everyone is craving a return to face-to-face activities, how that may roll out with local events first, hopefully, followed by international events, and how to implement a hybrid model going forward. We also talk about how the combination of COVID and an increased concern for a sustainable future is impacting how our industry conducts business, and what that may mean for business travel going forward.
Find more information on IMAPS global events at IMAPS.org
Find more information on SEMI global events at SEMI.org
Kiterocket
A global strategic marketing agency serving the semiconductor and sustainability industries.
Over the last 18 months, the European semiconductor industry has felt the repercussions of supply chain interruptions due COVID 19 and trade wars, combined with exploding global demand for chips driven by the digital transformation. There are also questions about regional sovereignty and the need to strengthen the local supply chain. To address these topics and more, SEMI Europe is holding its first in-person event since the start of COVID. Aiming at facilitating mutual engagement, the SEMI Packaging Technology Seminar will foster collaboration among semiconductor packaging, assembly, test manufacturing, and design experts, to collectively strengthen the semiconductor back-end industry in Europe.
In this episode, we speak with Steffen Krohnert, ESPAT Consulting, and Christian Roessle MSE Group about the semiconductor supply challenges Europe is facing, particularly for low-volume advanced packaging, and how members of the SEMI integrated Packaging, Assembly and Test Technology Community (ESiPAT-TC), are addressing them. We also talk about the upcoming seminar, and what attendees will gain by attending.
To learn more about SEMI Europe's Packaging Technology Seminar, visit the website here.
Contact Steffen Kröhnert at ESPAT Consulting
Contact Christian Roessle at MST Group
The acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors (FABS) Act that promises tax credits for investments in, either equipment or fabs. and then there’s the $250 billion US Innovation and Competition Act, which earmarks $52bn for new chip manufacturing and research. This is now being debated in the House of Representatives. There’s a lot to unpack here – what we’re focusing on today is how all of this could impact advanced packaging and test in the US – To talk about this, we invited 3D InCites Community Members. Bob Patti, of Nhanced Semiconductor, Alan Huffman, of Micross Components, and Dick Otte, of QP Technologies.
The conversation covers a wide range of questions: Will the $52Bn be enough? How should those funds be best allocated? What will the impact be on small entities? Where will the workforce to support it come from? How do we create a US supply chain? Are we politicizing chip manufacturing? How do we ensure that Foundry 2.0 adds IP value and attracts new talent? Is the answer a vertically integrated advanced packaging company? Should we create a consortium of advanced packaging companies and use the government funding to fill in the gaps?
Tune in to hear the answers to these questions and much more.
If you'd like to learn more about some of these 3D InCites Community Members, visit their profiles:
· Nhanced Semiconductor
· Micross
· QP Technologies
You can also contact the guest directly via email:
Bob Patti, Nhanced Semiconductor
Allan Huffman, Micross
Dick Otte, QP Technologies
Earlier this year, on February 18, 2021, the next-generation Mars Rover, Perseverance, successfully landed on Mars. According to Earth and Sky Magazine, Perseverance was the first artificial object to land on Mars since 2018, and the first Rover to land since 2012 when Curiosity touched down.
Perseverance traveled 293 million miles (472 million km) – over 203 days, and hit the Martian atmosphere traveling at almost 12,000 miles per hour (19,000 kmh), About a mile above Mars surface, the descent module fired its engines, while a terrain relative navigation system scanned and analyzed the terrain below, then matched it up with maps in its database to prepare for touchdown.
All this requires some sophisticated and rugged microelectronics and semiconductor technology. So, what makes this even more exciting for us at 3D InCites, is that 3D PLUS, winner of the 2021 Device of the Year Award, and Community Member, StratEdge Corporation, both provided the advanced packaging technology to make this possible.
In this episode, we talk to Patrice Benard, of 3D Plus, and Casey Krawiec, of StratEdge Corporation to learn about the experience of working on this exciting project.
Stratedge Corporation specializes in high frequency, high power, high-reliability semiconductor packages. Markets served include telecom, VSAT, broadband wireless, satellite, military, test and measurement, automotive, clean energy, and down-hole. Learn more at Stratedge.com.
Email Casey Krawiec
3D Plus provides advanced, high-density 3D microelectronic products to space, avionics, and defense markets. Learn more at 3D-Plus.com.
Email Patrice Benard
In the aftermath of Gay Pride Month, we bring you a very special episode of the 3D InCites Podcast. Even though it's July, we believe it is important to be allies to the LGBTQ community all year round.
While many companies showed support for the LGBTQ+ community by adapting their logos with rainbow colors and sharing supportive messaging and banners on social media, SEMI Foundation went a step further and commissioned a blog post written by Maria Vetrano titled, "LGBTQIA+ Visibility and Acceptance in the Chip Industry.".
The blog post was enlightening, to say the least, and it inspired us to learn more about how those of us in the semiconductor industry can be better allies and accomplices to our LGBTQ+ colleagues. To do that, we invited Maria and SEMI Foundation's Michelle Williams-Vaden to join us in a conversation.
If you have more questions, we invite you to reach out to Michelle at SEMI Foundation: mwilliams@semi.org, and/or Maria Vetrano on Linked In.
If you'd like to learn more about some of the organizations mentioned in this episode, visit their websites:
SEMI Foundation
Outright Action International
GLSEN
Human Rights Campaign
The Trevor Project
Click here to learn more about how 3D InCites is supporting Diversity, Equity, and Inclusion in the semiconductor industry, and how you can help,
In this first Member Spotlight episode, we have a conversation with Zia Karim, Yield Engineering Systems, and Mie Lillethorup, RadiSurf about their collaboration to bring unique nanotech-based surface enhancement materials from the lab to the fab. What's exciting about these materials and processes is the potential they hold for simplifying both temporary and permanent wafer bonding in 2.5D and 3D advanced packaging applications.
The two companies fall under the umbrella of KCK Group. Yield Engineering Systems specializes s in high-volume solutions for material modification and surface enhancement, Radisurf is a Danish start-up that has developed nano-coating of polymer brushes, which are densely-placed tiny plastic chains that act as an adhesion promoter, and is suited for multiple applications in semiconductor advanced packaging, as well as MEMS, sensors, microLEDs.
To learn more about Yield Engineering Systems, visit the website or contact Zia Karim.
To learn more about RadiSurf, visit the website or contact Mie Lillethorup
In this episode, Françoise interviews Bharat Kapoor, lead partner, Americas, at Kearney. a global strategy and management consulting firm, where he founded and leads PERLab, the firm’s design innovation service.
Bharat has solid roots in semiconductor engineering and design. His interest in electrical engineering began in his hometown in the Himalayas when he was in the third grade. He learned you could make a transformer by wrapping wire around a piece of iron. He tried it at home and almost burned his house down. A passion was born. As a junior engineer at Motorola, he seized an opportunity to work on the special projects team that developed the first smartphone. You can read his story here. It’s pretty great.
In the wake of COVID 19 and its impact on the semiconductor supply chain, Kapoor’s team researched, wrote, and published a white paper, Why a Resilient Semiconductor Supply Chain is Imperative and How to Create One. In addition to giving an overview of the paper and tips you can put to work at your company, Bharat answers some tough questions like:
· With all the fab expansion, will we be at risk of an oversupply?
· Is the US infusion of $52B too little, too late?
· Will Intel’s IDM 2.0 Strategy for Manufacturing be successful?
· And more…
Related Links
· Why A Resilient Semiconductor Supply Chain is Imperative and How to Create One
· Kearney Global Strategy and Management Consulting Firm
· Contact Bharat Kapoor
The chip shortage in the wake of COVID 19 is such a big story that it’s attracting mainstream media attention, and it feels like the general public now knows what semiconductors are. The upshot is that the shortage combined with the demand for chips is putting a strain on the entire semiconductor supply chain. With an expected 38 new fabs coming online between 2020 and 2024, demand is high for 300mm and 200mm tools, as well as the workforce to make them run. Not only that, but lead times to get those fabs operating will not solve the current situation. Emerald Grieg of Surplus Global; Dave Kirsch, EV Group, and Darrell McDaniel, of NSTAR Global Services, join me in a conversation to provide perspective and insight.
Contact Today's Speakers
Emerald Grieg, SurplusGlobal, Email: Emerald@Surplusglobal.com
Darrell McDaniel, NSTAR Global Services, Email: DMcDaniel@NSTARglobalservices.com
Dave Kirsch, EV Group, Email: D.Kirsch@EVGroup.com
Today we are talking about the importance of sustainability in semiconductor manufacturing, which you may have noticed is a really hot topic right now. And it's also one we feel really strongly about because of its impact on the future of society.
Our guests today are Dean Freeman, who has been blogging about it for the past few months and Julia Goldstein, who just joined us as a regular blogger. We're also joined by Martijn Pierik, CEO of our sponsor, Kiterocket.
In the beginning, we focus on the impact that our electronic devices have on the e-waste issue and what can be done about it. And then we talk about the bigger picture of sustainably manufacturing these devices.
Dean has more than 36 years of experience in semiconductor manufacturing materials. Over the course of his career, he's also been responsible for every aspect of the semiconductor manufacturing process. You may know him best for his years as a market analyst at Gartner. And he is currently a consultant and blogging for 3D InCites.
Julia has her Ph.D. in material science and began her career as an engineer in the advanced packaging space. She switched gears to become a technical writer for the industry in the early 2000s. She switched gears to become a technical writer for the industry in the early 2000s. Her passion for materials led to her concern about the negative impact some of them have on the earth. She is the author of the book, Material Value, More Sustainable, Less Wasteful Manufacturing of Everything from Cell phones to Cleaning Products. She also recently joined the blogging team.
Contact Today’s Speakers
Dean Freeman: freconsult@gmail.com
Julia Goldstein: julia@jlfgoldstein.com
Martijn Pierik – Martijn@kiterocket.com
If you're interested in reading Julia's book, Material Values, you can find it on her website, www.juliagoldsteinauthor.com It's also available on Amazon.
Sponsor
Today's podcast is sponsored by Kiterocket, a full-service PR and marketing agency that specializes in B2B marketing for companies that serve the semiconductor and sustainability industries. Learn more about them at kiterocket.com.
Welcome to our very first episode! Because podcasting is becoming an essential part of any business’s marketing toolbox, we thought it would be great to kick it off with a basic discussion about ways to market your company in this competitive industry. To do that, we tapped into Joe Cestari, Executive Director of our community member, Kiterocket. Joe has had a successful career as a corporate executive at a number of high-profile semiconductor companies up and down the supply chain including AMD, Applied Materials, Kinetics, and Total Facility Solutions.
During our conversation, Joe shared with me his experiences and thoughts about the role a holistic marketing approach can play in developing a team of ambassadors and building your brand’s core message.